Infineon Technologies CY7C1041G30-10BVXI
- Part No.:
- CY7C1041G30-10BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1041G30-10BVXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1041G30-10BVXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring TTL-compatible I/Os, ERR output for error indication, and low standby current (6 mA typical). It serves as a fault-tolerant memory buffer in industrial control modules requiring data integrity under radiation-prone or long-life operation.
For engineers reviewing the CY7C1041G30-10BVXI datasheet, CY7C1041G30-10BVXI pinout, CY7C1041G30-10BVXI application, or CY7C1041G30-10BVXI equivalent, key selection factors include ECC-enabled read reliability, 48-ball VFBGA (6 × 8 × 1.0 mm) package compatibility, 10 ns timing at 3.0 V, and support for byte-level write enable via BHE/ BLE.
Technical Context
This SRAM integrates dedicated ECC encoder/decoder logic adjacent to the memory array, performing real-time single-bit error correction on every read cycle without external logic. The ERR pin asserts HIGH only during detected-and-corrected single-bit errors - no automatic write-back or multi-bit error handling is implemented.
It supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); the "30" suffix denotes 2.2–3.6 V operation with 10 ns speed grade. The BVXI package identifier confirms 48-ball VFBGA with non-swapped I/O ball mapping (I/O[7:0] on lower byte, I/O[15:8] on upper byte), distinct from BVJXI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 4 Mbit (256K words × 16-bit) - provides 512 KB of parallel-access data storage per device |
| Access time (tAA) | 10 ns at VCC = 3.0 V - enables direct interface with 100 MHz bus systems without wait states |
| ECC capability | Single-bit error correction per 16-bit word - ensures data integrity in mission-critical reads without software overhead |
| Supply voltage range | 2.2 V to 3.6 V - compatible with modern 3.3 V logic domains and mixed-voltage system designs |
| Standby current (ISB2) | 6 mA typical at TA = 25 °C - reduces power budget in low-duty-cycle industrial monitoring nodes |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm) - supports high-density PCB layouts with fine-pitch routing and thermal efficiency |
| ERR pin function | Dedicated open-drain output indicating corrected single-bit errors - enables system-level logging or diagnostic flagging |
Pinout & Package
48-ball VFBGA (6 × 8 × 1.0 mm) package with JEDEC-standard footprint and solder-ball pitch of 0.8 mm. Ball map follows non-swapped I/O configuration (I/O[7:0] on columns C/D/E, I/O[15:8] on columns F/G/H).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address inputs | 18-bit address bus supporting full 256K-word addressing; A17 is MSB |
| I/O0–I/O15 | Bidirectional data I/O | 16-bit parallel data path; high-impedance when CE HIGH or OE/BLE/BHE deasserted |
| CE | Chip Enable | Active-low global enable; places all I/Os in high-Z when HIGH |
| OE | Output Enable | Active-low read strobe; controls output drivers independently of CE |
| WE | Write Enable | Active-low write strobe; initiates write cycle when CE and WE both LOW |
| BHE / BLE | Byte High/Low Enable | Independent 8-bit write control: BHE enables I/O[15:8], BLE enables I/O[7:0] |
| ERR | Error indication output | Open-drain HIGH pulse during single-bit error detection/correction; requires external pull-up |
| VCC / VSS | Power / Ground | Dual VCC balls (A7, D4) and dual VSS balls (C4, E5) minimize IR drop and noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Hardware-accelerated single-bit error correction per 16-bit word - eliminates need for external ECC controller or software parity checks |
| Multi-voltage support | Operates across 2.2–3.6 V range with guaranteed 10 ns tAA - simplifies integration into 3.3 V systems without level-shifting |
| Low-power standby mode | 6 mA typical ISB2 current - extends uptime in battery-backed or energy-constrained edge devices |
| TTL-compatible signaling | VIH/VIL thresholds match standard TTL levels at 3.0 V - ensures interoperability with legacy microcontrollers and FPGAs |
| Byte-selectable writes | Independent BHE and BLE pins enable 8-bit partial writes - reduces bus contention and improves write efficiency in mixed-data-size applications |
Applications
| Industrial PLC Memory Buffer | Railway Signaling Data Cache |
|---|---|
|
Use Scenario: Storing real-time sensor fusion outputs and control state tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Fault-tolerant SRAM buffer interfacing directly with ARM Cortex-M7 MCU's 16-bit external memory bus. Use Value: ECC prevents silent data corruption from cosmic rays or EMI-induced bit flips during extended unattended operation. |
Use Scenario: Caching track occupancy status and interlocking logic results in wayside signaling units operating under EN 5012x safety standards. IC Role / Device Role / Timing Role: High-reliability memory node providing deterministic 10 ns read latency for fail-safe decision engines. Use Value: ERR pin enables immediate logging of corrected errors for maintenance reporting and SIL-2 compliance tracking. |
| Medical Imaging Frame Buffer | Avionics Data Recorder |
|
Use Scenario: Temporary storage of digitized X-ray or ultrasound frames before compression and transmission in portable diagnostic equipment. IC Role / Device Role / Timing Role: Low-power, high-speed SRAM acting as intermediate frame buffer between ADC and SoC video processing pipeline. Use Value: 6 mA standby current extends battery life during idle periods while maintaining instant-on readiness. |
Use Scenario: Capturing flight parameter telemetry (AOA, G-load, engine RPM) in black-box recorders subjected to wide temperature swings (–55 °C to +85 °C). IC Role / Device Role / Timing Role: Industrial-grade SRAM retaining valid data down to –40 °C with 1.0 V data retention capability. Use Value: Dual VCC/VSS balls and low thermal resistance (θJA = 31.35 °C/W) ensure stable operation during rapid thermal transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C34096B-10TIN | No embedded ECC; requires external Hamming logic; 10 ns access at 3.3 V; 44-pin TSOP II package | Lacks hardware error correction - increases FPGA resource usage and firmware complexity for error handling | Select only if board layout constraints prohibit VFBGA or ECC is implemented externally |
| IS61WV25616EDBLL-10MLI | 256K × 16-bit, no ECC, 10 ns, 3.3 V, 48-ball VFBGA; lower ICC (30 mA active) but no ERR pin | Higher reliability risk in harsh environments due to absence of on-die ECC and error reporting | Prefer where cost sensitivity outweighs fault tolerance requirements and system-level error logging is not mandated |
Compared with AS7C34096B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041G30-10BVXI uniquely delivers integrated ECC with observable error indication in the same VFBGA footprint - reducing BOM count, PCB area, and validation effort for safety-critical memory subsystems.
Availability
CY7C1041G30-10BVXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, railway signaling data caches, and medical imaging frame buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1041G30-10BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and reliable memory solutions for industrial and safety-critical applications.
CY7C1041G30-10BVXI belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for high-integrity data storage in environments where radiation-induced soft errors or long-term data retention must be mitigated without external circuitry.
FAQ
Does CY7C1041G30-10BVXI support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory array. System firmware must handle any required write-back if persistent correction is needed.
What is the function of the NC pins in the 48-ball VFBGA package?
NC (No Connect) pins - such as balls A1, C1, D1, E1, F1, G1, H1, A2, A3, A4, A5, A6, A8, A9, A10, A11 - are physically present but not bonded to the die. They serve mechanical stability and thermal dissipation roles and must remain unconnected in PCB layout.
Can CY7C1041G30-10BVXI operate at 1.8 V?
No. The "30" speed grade is specified only for 2.2 V–3.6 V operation. For 1.65 V–2.2 V operation, the correct part is CY7C1041G18-15BVXI (15 ns), which is not pin-compatible due to different timing and voltage qualification.
Is the ERR pin active-high or open-drain?
The ERR pin is an open-drain output. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to generate a HIGH signal during single-bit error detection and correction. When inactive, ERR remains in high-impedance state.
CY7C1041G30-10BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1041G30-10BVXI FAQ
1.How can I place an order for CY7C1041G30-10BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041G30-10BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041G30-10BVXI reliable?
The price and inventory of CY7C1041G30-10BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041G30-10BVXI is usually 5 days.
3.What payment methods are accepted for CY7C1041G30-10BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041G30-10BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041G30-10BVXI?
CY7C1041G30-10BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041G30-10BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041G30-10BVXI?
For technical support, including CY7C1041G30-10BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041G30-10BVXI requirements.
6.How does Aetrix verify that CY7C1041G30-10BVXI is sourced from the original manufacturer or authorized distributors?
All CY7C1041G30-10BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041G30-10BVXI meets industry standards.
7.What is the process for return or replacement of CY7C1041G30-10BVXI?
All CY7C1041G30-10BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041G30-10BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041G30-10BVXI part is unused and in its original packaging.
Return procedure for CY7C1041G30-10BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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