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Infineon Technologies CY7C1041G30-10ZSXIT

Part No.:
CY7C1041G30-10ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041G30-10ZSXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,916

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Product details

Overview

CY7C1041G30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring TTL-compatible I/Os, ERR output for error indication, and low standby current (6 mA typical). It serves as fault-tolerant memory in industrial control modules requiring data integrity under EMI-prone conditions.

For engineers reviewing the CY7C1041G30-10ZSXIT datasheet, CY7C1041G30-10ZSXIT pinout, CY7C1041G30-10ZSXIT application, or CY7C1041G30-10ZSXIT equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC functional behavior, byte-enable write control (BHE/ BLE), and real-world timing constraints for deterministic memory subsystem design.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles without automatic write-back. The ERR pin asserts HIGH only when correction occurs, enabling external logging or system-level fault response.

It supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); the "30" suffix confirms 2.2–3.6 V operation with 10 ns tAA. Byte-select architecture allows independent upper/lower byte writes via BHE (I/O8–I/O15) and BLE (I/O0–I/O7), preserving data coherency in mixed-width bus systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size 4 Mbit (256K words × 16-bit) - provides 512 KB of parallel-access data storage with full word-wide I/O capability
Access time (tAA) 10 ns at VCC = 3.0 V - enables direct interface with 100 MHz synchronous controllers without wait states
ECC function Single-bit error detection and correction per 16-bit word - ensures data integrity in mission-critical reads without software overhead
Standby current (ISB2) 6 mA typical at VCC = 3.0 V - supports low-power hold modes in battery-backed or energy-constrained industrial nodes
Supply voltage range 2.2 V to 3.6 V - compatible with 3.3 V logic families and mixed-voltage SoC interfaces
ERR pin Dedicated open-drain output indicating ECC correction event - enables hardware-triggered diagnostics without polling
Data retention 1.0 V minimum - maintains stored content during brown-out or controlled power-down sequences

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVJXI footprint with swapped I/O byte ball positions versus BVXI.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address inputs 18-bit address bus supporting full 256K-word addressing; A0–A17 directly map to internal row/column decoders
I/O0–I/O15 Bidirectional data I/O 16-bit parallel data path; high-impedance state when CE HIGH or OE/BLE/BHE deasserted
CE Chip Enable Active-low global enable; device enters ISB2 standby mode when CE > VCC – 0.2 V with CMOS inputs
OE Output Enable Active-low read strobe; controls output drivers only - does not affect ECC decoding or ERR assertion
WE Write Enable Active-low write strobe; initiates ECC encoding on write data before storage in memory array
BLE / BHE Byte Low/High Enable Independent active-low controls for lower (I/O0–I/O7) and upper (I/O8–I/O15) byte writes - enables partial-word updates without read-modify-write
ERR Error indication output Open-drain output asserted HIGH only during successful single-bit correction on read - requires external pull-up for logic-level compatibility
VCC / VSS Power / Ground Dual VCC pins (balls C4, D3) and dual VSS pins (balls C5, D6) provide low-inductance supply routing for noise-sensitive SRAM operation

Key Features

Feature Design Value
Embedded ECC engine Hardware-accelerated single-bit correction per 16-bit word with no CPU intervention or latency penalty on corrected reads
Multi-voltage support Three discrete VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) allow drop-in replacement across legacy and modern 3.3 V/5 V systems
Byte-select write control BLE and BHE enable true 8-bit sub-word writes - eliminates bus contention and reduces power vs. full-word writes in 8-bit peripheral interfacing
Low-power standby ISB2 = 6 mA typical at 3.0 V - meets industrial temperature range (-40°C to +85°C) requirements without thermal derating
TTL-compatible signaling VIH/VIL thresholds match standard TTL logic levels - simplifies interface with microcontrollers lacking configurable I/O voltage thresholds

Applications

Industrial PLC Memory Buffer Medical Diagnostic Data Cache

Use Scenario: Stores real-time sensor fusion outputs and control command history in programmable logic controllers with watchdog-triggered recovery.

IC Role / Device Role / Timing Role: Fault-tolerant SRAM buffer holding critical runtime state between FPGA-based control cycles; 10 ns tAA aligns with 100 MHz clock domains.

Use Value: Embedded ECC prevents silent data corruption in long-duration continuous operation, eliminating need for periodic software checksum validation.

Use Scenario: Caches raw imaging sensor frames prior to FPGA-based FFT processing in portable ultrasound units.

IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer interfacing directly with image sensor controller's 16-bit parallel output bus.

Use Value: 6 mA ISB2 enables extended battery life during idle periods while maintaining instant-on readiness for emergency scans.

Railway Signaling Event Log Avionics Flight Data Recorder Buffer

Use Scenario: Logs train position, speed, and signal status events with timestamp stamping in EN 5012x-certified trackside equipment.

IC Role / Device Role / Timing Role: Nonvolatile-capable SRAM (1.0 V retention) holding last 72 hours of operational logs during AC power loss.

Use Value: ERR pin feeds into safety monitor circuitry to trigger redundant log duplication upon detected bit-flip, satisfying SIL-2 diagnostic coverage requirements.

Use Scenario: Buffers high-rate inertial measurement unit (IMU) samples before compression and storage in solid-state flight recorders.

IC Role / Device Role / Timing Role: Deterministic 10 ns read/write cycle supports 100 kSPS sampling without FIFO overflow in DO-160E Zone 3 environments.

Use Value: Dual VCC/VSS ball pairs minimize ground bounce during simultaneous 16-bit writes, preserving signal integrity in EMI-heavy avionics bays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM with ECC applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C34098B-10TIN No integrated ECC; requires external Hamming logic or software correction; 10 ns access, 3.3 V only Lacks hardware error reporting (no ERR pin); increases firmware complexity for fault logging Select only if ECC is implemented externally and board space permits additional logic
IS61WV25616EDBLL-10MLI 256K × 16-bit, 10 ns, no ECC; 1.8 V core / 3.3 V I/O; lower ISB2 (25 µA) Zero-error-correction capability; suitable for non-safety-critical buffering where data integrity is managed at system level Choose when ultra-low standby power dominates over fault tolerance, and ECC is handled upstream

Compared with AS7C34098B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041G30-10ZSXIT uniquely delivers hardware ECC with dedicated ERR signaling in a single chip - reducing BOM count, eliminating timing-critical software correction, and enabling deterministic failure response in safety-aware systems.

Availability

CY7C1041G30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical diagnostic data caches, and railway signaling event logs requiring stable component supply across extended product lifecycles.

Supply support for CY7C1041G30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, emphasizing automotive, industrial, and aerospace-grade components with rigorous qualification and long-term support.

CY7C1041G30-10ZSXIT belongs to the Cypress SRAM family designed specifically for fault-tolerant embedded systems where data integrity, deterministic timing, and multi-voltage interoperability are mandatory - not general-purpose memory.

FAQ

Does CY7C1041G30-10ZSXIT perform automatic write-back after ECC correction?

No. The device detects and corrects single-bit errors during read operations but does not automatically rewrite the corrected data back to the memory array. External logic or firmware must initiate a write cycle if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet and avoids unintended write wear during frequent soft-error events.

What is the function of the ERR pin, and how is it electrically driven?

The ERR pin is an open-drain output that asserts HIGH only when a single-bit error is both detected and corrected during a read cycle. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to establish a valid logic HIGH level. The pin remains inactive (high-impedance) during normal reads, writes, or uncorrectable multi-bit errors.

Can CY7C1041G30-10ZSXIT operate across multiple VCC ranges simultaneously?

No. The device must be powered within one specified VCC range: either 1.65–2.2 V, 2.2–3.6 V, or 4.5–5.5 V. The "30" in the part number explicitly denotes 2.2–3.6 V operation. Mixing voltages or applying intermediate values (e.g., 2.5 V with 1.8 V logic) violates absolute maximum ratings and may cause undefined behavior or accelerated wear.

How does byte-enable (BLE/BHE) control interact with ECC functionality?

BLE and BHE govern physical I/O gating during write cycles but do not alter ECC encoding scope: the full 16-bit word is always encoded, even for byte writes. On read, ECC correction applies to the entire 16-bit word regardless of which byte is accessed - meaning a corrected upper-byte read still validates the lower byte's integrity, though only the requested byte appears on I/O lines.

CY7C1041G30-10ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1041G30-10ZSXIT FAQ

1.How can I place an order for CY7C1041G30-10ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041G30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041G30-10ZSXIT reliable?

The price and inventory of CY7C1041G30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041G30-10ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7C1041G30-10ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041G30-10ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041G30-10ZSXIT?

CY7C1041G30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041G30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041G30-10ZSXIT?

For technical support, including CY7C1041G30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041G30-10ZSXIT requirements.

6.How does Aetrix verify that CY7C1041G30-10ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1041G30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041G30-10ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7C1041G30-10ZSXIT?

All CY7C1041G30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041G30-10ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041G30-10ZSXIT part is unused and in its original packaging.

Return procedure for CY7C1041G30-10ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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