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Infineon Technologies CY7C1041GE30-10BVXIT

Part No.:
CY7C1041GE30-10BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1041GE30-10BVXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,943

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Product details

Overview

CY7C1041GE30-10BVXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring dedicated ERR output pin, TTL-compatible I/Os, and low standby current (6 mA typical). It serves as fault-tolerant memory in industrial control modules requiring data integrity during extended operation.

For engineers reviewing the CY7C1041GE30-10BVXIT datasheet, CY7C1041GE30-10BVXIT pinout, CY7C1041GE30-10BVXIT application, or CY7C1041GE30-10BVXIT equivalent, this page delivers verified package mapping (48-ball VFBGA, BVXI), ECC correction behavior, byte-enable write control (BHE/ BLE), and voltage-range-specific timing margins - all confirmed from Infineon's official Rev. *N datasheet.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles, signaled via the open-drain ERR pin asserted HIGH. The memory array uses standard row/column decoding with sense amplifiers and supports independent high- and low-byte writes via BHE and BLE control.

It operates across three VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); the "30" in the part number specifies the 2.2–3.6 V range with 10 ns tAA. All I/Os enter high-impedance state when CE is HIGH or OE/BLE/BHE are deasserted - enabling bus sharing in multi-device systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size 4 Mbit (256K words × 16-bit) - provides 512 KB of parallel-access data storage with full word-wide I/O interface.
Access time (tAA) 10 ns at VCC = 2.2–3.6 V - enables integration into 100 MHz synchronous bus systems with minimal wait states.
ECC capability Single-bit error detection and correction per 16-bit word - ensures data reliability without external logic or software overhead.
Standby current (ISB2) 6 mA typical at VCC = 3 V - supports low-power hold mode in battery-backed or energy-constrained industrial nodes.
Supply voltage range 2.2 V to 3.6 V - compatible with modern 3.3 V logic families and mixed-voltage system designs.
ERR pin function Dedicated open-drain output indicating successful single-bit correction - allows real-time error logging or system-level fault response.
Data retention 1.0 V minimum retention voltage - permits ultra-low-power suspend modes while preserving memory contents.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVXI footprint (pinout matches Figure 2 in datasheet Rev. *N).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address inputs 18-bit address bus supporting full 256K-word addressing; A17 is MSB for 4-Mbit capacity.
I/O0–I/O15 Bidirectional data bus 16-bit parallel interface; high-impedance when CE HIGH or OE/BLE/BHE inactive.
/CE Chip enable (active LOW) Primary device selection signal; enables automatic power-down (ISB2 = 6 mA) when HIGH.
/OE Output enable (active LOW) Controls read-data output drive; must be LOW with /CE LOW to place data on I/O lines.
/WE Write enable (active LOW) Initiates write cycle; latches data on rising edge of /WE when /CE and /WE both transition LOW→HIGH.
/BHE Byte high enable Enables write/read of upper byte (I/O8–I/O15); used for 8-bit sub-word access in 16-bit systems.
/BLE Byte low enable Enables write/read of lower byte (I/O0–I/O7); supports partial-word transfers without full-word overhead.
ERR Error indication output Open-drain output asserted HIGH during single-bit correction event; requires external pull-up for logic-level compatibility.
VCC, VSS Power and ground Dual VCC pins (balls C4, D4) and dual VSS pins (balls C5, D5) reduce IR drop and improve noise immunity.

Key Features

Feature Design Value
Embedded ECC engine Hardware-based single-bit correction per 16-bit word eliminates need for external error-handling logic or firmware intervention.
Multi-voltage support Operates across 2.2–3.6 V range with guaranteed 10 ns timing - simplifies migration from legacy 5 V to modern 3.3 V platforms.
Byte-selectable I/O Independent /BHE and /BLE controls allow 8-bit microcontroller interfacing without data masking or glue logic.
Low-power standby 6 mA typical ISB2 current at 3 V enables >10-year battery-backed retention in industrial logging applications.
TTL-compatible signaling VIH/VIL thresholds match standard TTL levels - ensures interoperability with legacy 3.3 V and 5 V controllers without level shifters.

Applications

Industrial PLC Data Buffer Railway Signaling Memory

Use Scenario: Storing real-time sensor inputs and control state variables in programmable logic controllers deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Fault-tolerant main data buffer with ECC-enabled read/write cycles synchronized to 10 ns bus timing.

Use Value: Prevents undetected memory corruption in safety-critical control loops where single-bit upsets could trigger false actuator commands.

Use Scenario: Holding interlocking logic tables and train position history in EN 5012x-certified signaling equipment operating in electromagnetic-heavy rail environments.

IC Role / Device Role / Timing Role: High-reliability SRAM providing deterministic 10 ns access for fail-safe decision engines.

Use Value: ERR pin enables immediate logging of corrected errors for maintenance reporting and SIL-2 compliance evidence generation.

Medical Diagnostic Imaging Cache Avionics Data Recorder

Use Scenario: Temporary storage of raw pixel data during CT/MRI image acquisition before compression and transfer to flash storage.

IC Role / Device Role / Timing Role: Burst-mode SRAM buffer supporting high-throughput parallel data capture at 100 MB/s sustained rate.

Use Value: Embedded ECC avoids post-acquisition re-scan due to transient radiation-induced bit flips in imaging chain memory.

Use Scenario: Capturing flight parameter telemetry (altitude, attitude, engine metrics) in black box recorders subjected to thermal cycling and vibration.

IC Role / Device Role / Timing Role: Retentive memory holding last 25 hours of data with 1.0 V data retention capability during power loss.

Use Value: Dual VCC/VSS ball layout minimizes noise coupling in EMI-prone avionics bays, preserving data integrity during turbulence events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C34098B-10TIN No integrated ECC; requires external Hamming logic or software correction; 10 ns access at 3.3 V only. Lacks hardware ERR signal; increases BOM count and firmware complexity for error reporting. Select only if ECC is handled externally and board space permits additional logic.
IS61WV25616EDBLL-10MLI 256K × 16-bit, 10 ns, no ECC; 3.3 V only; supports ZQ calibration but no error indication pin. Higher density not utilized; no hardware-level error visibility - unsuitable for safety audits requiring error logs. Choose only for cost-sensitive non-safety applications where ECC is unnecessary.

Compared with AS7C34098B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041GE30-10BVXIT uniquely delivers on-die ECC correction with observable ERR output - reducing system-level validation effort and eliminating external error-handling circuitry required by alternatives.

Availability

CY7C1041GE30-10BVXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, railway signaling memory, medical diagnostic imaging cache, and avionics data recorder applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1041GE30-10BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with ISO 9001 and IATF 16949 certified manufacturing.

CY7C1041GE30-10BVXIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for industrial and transportation systems demanding hardware ECC, multi-voltage operation, and long-term supply assurance.

FAQ

Does CY7C1041GE30-10BVXIT support automatic error correction without host intervention?

Yes. The device performs single-bit error detection and correction autonomously during every read cycle using on-die ECC logic. No host processor action is required - corrected data appears on I/O lines, and the ERR pin asserts HIGH to signal the event. It does not perform automatic write-back; corrected data remains in the accessed location until overwritten.

What is the function of the ERR pin, and how should it be interfaced?

The ERR pin is an open-drain output that goes HIGH whenever a single-bit error is detected and corrected during a read access. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to generate a valid logic HIGH. This signal can drive an interrupt input or latch for error logging, enabling real-time system diagnostics without polling.

Can CY7C1041GE30-10BVXIT operate at 1.8 V?

No. The "30" suffix denotes the 2.2 V–3.6 V operating range. For 1.65–2.2 V operation, the correct variant is CY7C1041GE18-15BVXIT (15 ns speed grade). Attempting 1.8 V operation on the -30 variant may result in timing violations or functional failure, as tAA is not characterized below 2.2 V.

How does byte enable (/BHE and /BLE) control work during write operations?

/BHE enables writes to I/O8–I/O15 (upper byte); /BLE enables writes to I/O0–I/O7 (lower byte). Both signals must be LOW for full 16-bit writes. When only one is LOW, only the corresponding byte is updated - preserving the other byte's content. This enables efficient 8-bit microcontroller interfacing and avoids read-modify-write sequences.

CY7C1041GE30-10BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1041GE30-10BVXIT FAQ

1.How can I place an order for CY7C1041GE30-10BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041GE30-10BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041GE30-10BVXIT reliable?

The price and inventory of CY7C1041GE30-10BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GE30-10BVXIT is usually 5 days.

3.What payment methods are accepted for CY7C1041GE30-10BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GE30-10BVXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041GE30-10BVXIT?

CY7C1041GE30-10BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041GE30-10BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041GE30-10BVXIT?

For technical support, including CY7C1041GE30-10BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GE30-10BVXIT requirements.

6.How does Aetrix verify that CY7C1041GE30-10BVXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1041GE30-10BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GE30-10BVXIT meets industry standards.

7.What is the process for return or replacement of CY7C1041GE30-10BVXIT?

All CY7C1041GE30-10BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GE30-10BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041GE30-10BVXIT part is unused and in its original packaging.

Return procedure for CY7C1041GE30-10BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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