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Infineon Technologies CY7C1041GE30-10VXIT

Part No.:
CY7C1041GE30-10VXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-BSOJ (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041GE30-10VXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44SOJ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,797

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Product details

Overview

CY7C1041GE30-10VXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring dedicated ERR output pin, TTL-compatible I/Os, and low standby current (6 mA typical). It serves as fault-tolerant data buffer in industrial control modules requiring ECC-enabled memory for mission-critical register storage.

For engineers reviewing the CY7C1041GE30-10VXIT datasheet, CY7C1041GE30-10VXIT pinout, CY7C1041GE30-10VXIT application, or CY7C1041GE30-10VXIT equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC correction behavior, byte-enable timing constraints, and direct substitution guidance for industrial-grade SRAM selection.

Technical Context

The device implements a full on-die ECC engine that detects and corrects single-bit errors during read cycles, asserting the ERR pin high upon correction-without automatic write-back. Its dual-voltage support enables interoperability across 2.2–3.6 V logic domains while maintaining 10 ns tAA timing under worst-case conditions.

Memory access uses asynchronous control with CE, OE, and WE inputs; byte-level writes are enabled via BHE (I/O8–I/O15) and BLE (I/O0–I/O7); all I/Os enter high-impedance state when CE is high or OE/BLE/BHE are deasserted. The ERR signal is synchronous to the read cycle and latched only during valid read accesses.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K words × 16-bit) - supports 32 KB of wide-data storage per chip, reducing address bus width in microcontroller interfaces.
Access Time (tAA) 10 ns max at VCC = 2.2–3.6 V - enables direct interface with 80 MHz+ microcontrollers without wait states.
ECC Function Single-bit error detection and correction per 16-bit word - ensures data integrity in radiation-prone or long-term industrial deployments.
Standby Current (ISB2) 6 mA typical at VCC = 3 V - allows low-power retention mode during system sleep without external power gating.
Supply Voltage Range 2.2 V to 3.6 V - compatible with modern 3.3 V logic families and mixed-voltage SoC subsystems.
ERR Pin Behavior Active-HIGH open-drain output asserted only during successful single-bit correction - provides hardware-level fault signaling without software polling.
Data Retention 1.0 V minimum VCC - maintains stored contents down to ultra-low voltage, supporting graceful shutdown sequences.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVJXI grade (I/O[7:0] and I/O[15:8] swapped vs. BVXI).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; A17 is MSB for 4-Mbit capacity.
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; split into upper (I/O8–I/O15) and lower (I/O0–I/O7) bytes for selective write operations.
CE Chip Enable Active-LOW enable controlling device selection; forces all outputs to high-impedance when HIGH.
OE Output Enable Active-LOW control enabling read data onto I/O lines; independent of CE for partial-cycle gating.
WE Write Enable Active-LOW signal initiating write cycle; sampled with CE and byte enables to latch data.
BHE / BLE Byte Enable Controls BHE enables writes to I/O8–I/O15; BLE enables writes to I/O0–I/O7 - supports 8-bit peripheral interfacing.
ERR Error Indication Output Open-drain output asserted HIGH only when single-bit error is detected and corrected during a read cycle.
VCC / VSS Power / Ground Dual VCC pins (balls C4, D3) and multiple VSS balls (A3, D5, E6, F3) ensure low-noise power delivery and signal integrity.

Key Features

Feature Design Value
Embedded ECC Engine On-die Hamming-code encoder/decoder corrects one bit per 16-bit word without CPU intervention or memory controller support.
Multi-Voltage Operation Valid operation across three disjoint VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) - eliminates need for level shifters in mixed-rail systems.
ERR Pin Assertion Timing ERR goes HIGH within tAA + tERR (max 12 ns) after valid address setup - enables real-time error logging in deterministic systems.
Low-Power Standby Mode ISB2 = 6 mA typical at 3 V - reduces idle power by >85% vs. legacy 5 V SRAMs, critical for battery-backed controllers.
TTL-Compatible I/O VIL ≤ 0.6 V and VOH ≥ 2.4 V at 3 V - ensures robust noise margin and direct connection to legacy 3.3 V microcontrollers.

Applications

Industrial PLC I/O Modules Railway Signaling Controllers

Use Scenario: Storing real-time sensor status and actuator command history in distributed I/O racks exposed to EMI and temperature cycling.

IC Role / Device Role / Timing Role: Fault-resilient scratchpad memory holding diagnostic logs and configuration snapshots between watchdog resets.

Use Value: Single-bit ECC prevents silent data corruption in safety-critical status registers, eliminating false trip events caused by alpha particle strikes.

Use Scenario: Buffering interlocking logic tables and route validation checksums in wayside signaling units operating continuously for >15 years.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding validated route maps; refreshed from flash on boot with ECC-checked integrity.

Use Value: ERR pin triggers immediate firmware audit on first read, ensuring zero tolerance for undetected memory degradation over decades.

Medical Imaging Subsystems Avionics Data Recorders

Use Scenario: Capturing raw pixel buffers from X-ray detector arrays before FPGA-based compression and encryption.

IC Role / Device Role / Timing Role: High-speed frame buffer with deterministic 10 ns access, synchronized to line-scan clocks.

Use Value: Byte-enable capability allows partial frame updates without full-word overhead, optimizing bandwidth for bursty detector output.

Use Scenario: Recording flight parameter telemetry (altitude, attitude, engine metrics) during extended missions where power interruption is possible.

IC Role / Device Role / Timing Role: Low-voltage retention memory preserving last-known state during brownout, recoverable at 1.0 V.

Use Value: 1.0 V data retention enables safe capture of final seconds before power loss, meeting DO-178C traceability requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC-enabled SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C34098B-10TIN No integrated ECC; requires external logic or controller-based correction; 10 ns speed, 4-Mbit, 3.3 V only. Lacks hardware ERR indication; error handling shifts to firmware, increasing latency and complexity. Select only if ECC is implemented elsewhere in system and board space permits discrete correction logic.
IS61WV25616EDBLL-10MLI Includes ECC but no ERR pin; correction is internal-only with no external notification; 10 ns, 4-Mbit, 2.5/3.3 V. Cannot trigger diagnostics or logging on correction event; silent correction limits root-cause analysis. Prefer when system-level error reporting is unnecessary and minimal pin count is prioritized over visibility.

Compared with AS7C34098B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041GE30-10VXIT uniquely delivers both hardware ECC correction and externally observable ERR assertion-enabling deterministic fault response without software overhead or external components.

Availability

CY7C1041GE30-10VXIT is available at Aetrix Electronics and suitable for industrial PLC I/O modules, railway signaling controllers, and medical imaging subsystems requiring stable component supply, long-lifecycle support, and guaranteed ECC functionality.

Supply support for CY7C1041GE30-10VXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and safety-certified product lines.

CY7C1041GE30-10VXIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-reliability embedded systems demanding hardware-based error resilience without sacrificing speed or power efficiency.

FAQ

Does CY7C1041GE30-10VXIT perform automatic write-back after ECC correction?

No. The device corrects single-bit errors during read cycles and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory array. Write-back must be handled by external logic or firmware if persistent correction is required. This design avoids unintended write cycles during read-only operations and preserves deterministic timing.

What is the maximum junction temperature and thermal resistance for the 48-ball VFBGA package?

The ΘJA (junction-to-ambient) is 31.35 °C/W under standard test conditions (still air, 3 × 4.5 inch four-layer PCB), and ΘJC (junction-to-case) is 14.74 °C/W. Maximum operating junction temperature is 125 °C, consistent with Industrial grade rating (–40 °C to +85 °C ambient).

Can the ERR pin drive a standard CMOS input directly?

Yes. The ERR pin is an open-drain output with internal pull-down; it requires an external pull-up resistor (typically 4.7 kΩ to VCC) to generate a clean HIGH signal. When pulled up to 3.3 V, it sources >2 mA sink current, fully compatible with 3.3 V CMOS logic thresholds.

Is the 1.0 V data retention specification guaranteed across temperature and process corners?

Yes. The 1.0 V minimum retention voltage is specified over the full industrial temperature range (–40 °C to +85 °C) and applies to all production lots. It reflects actual measured retention margin-not a design target-and is validated per JEDEC JESD22-A117.

CY7C1041GE30-10VXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-BSOJ (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-SOJ

CY7C1041GE30-10VXIT FAQ

1.How can I place an order for CY7C1041GE30-10VXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041GE30-10VXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041GE30-10VXIT reliable?

The price and inventory of CY7C1041GE30-10VXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GE30-10VXIT is usually 5 days.

3.What payment methods are accepted for CY7C1041GE30-10VXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GE30-10VXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041GE30-10VXIT?

CY7C1041GE30-10VXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041GE30-10VXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041GE30-10VXIT?

For technical support, including CY7C1041GE30-10VXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GE30-10VXIT requirements.

6.How does Aetrix verify that CY7C1041GE30-10VXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1041GE30-10VXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GE30-10VXIT meets industry standards.

7.What is the process for return or replacement of CY7C1041GE30-10VXIT?

All CY7C1041GE30-10VXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GE30-10VXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041GE30-10VXIT part is unused and in its original packaging.

Return procedure for CY7C1041GE30-10VXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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