Infineon Technologies CY7C1041GN-10VXI
- Part No.:
- CY7C1041GN-10VXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041GN-10VXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44SOJ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1041GN-10VXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous CMOS static RAM with 10 ns access time, 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V triple-voltage operation, and 48-ball VFBGA (6 × 8 × 1.0 mm) packaging. It supports byte-level writes via BHE/ BLE control, TTL-compatible I/Os, and 1.0-V data retention for low-power hold mode - deployed in industrial embedded controllers requiring deterministic memory access without refresh overhead.
For engineers reviewing the CY7C1041GN-10VXI datasheet, CY7C1041GN-10VXI pinout, CY7C1041GN-10VXI application, or CY7C1041GN-10VXI equivalent, key selection criteria include verified 10 ns tAA timing at 5 V, dual-byte enable architecture, industrial-grade –40°C to +85°C operation, and VFBGA package thermal resistance (θJA = 31.35°C/W), critical for thermally constrained PCB layouts.
Technical Context
This SRAM implements a fully decoded 18-bit address bus (A0–A17) driving a 256K-word × 16-bit memory array with independent high- and low-byte write enables (BHE, BLE). Read/write cycles are controlled by CE, OE, and WE with full TTL-compatible input thresholds and output drive strength across all supported VCC ranges.
It features two standby current modes: ISB1 (15 mA max, TTL inputs) and ISB2 (6 mA typical, CMOS inputs), plus 1.0-V data retention capability enabling ultra-low-power hold states. The device lacks internal refresh logic, relying on external address stability during access - consistent with classic asynchronous SRAM architecture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16 bits) - provides 512 KB of fast, non-refreshing storage for real-time firmware buffers or register shadowing. |
| Access Time (tAA) | 10 ns at VCC = 4.5–5.5 V - enables direct interfacing with legacy microcontrollers (e.g., 8051, Motorola 68K) running at ≤100 MHz bus clocks. |
| VCC Operating Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - supports mixed-voltage system integration without level shifters in industrial power domains. |
| Active Current (ICC) | 38 mA typical at f = 100 MHz - defines peak dynamic power draw during sustained burst reads/writes at maximum speed. |
| Standby Current (ISB2) | 6 mA typical with CMOS inputs - sets minimum quiescent power in CE-high sleep mode for battery-backed applications. |
| Data Retention Voltage | 1.0 V minimum - allows memory state preservation during brown-out or controlled power-down sequences without backup capacitors. |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm, BVXI grade) - delivers superior thermal performance (θJA = 31.35°C/W) vs. TSOP II alternatives in compact industrial modules. |
Pinout & Package
48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, JEDEC MO-249 compliant, BVXI marking. Pinout validated per Figure 1 (Document 001-95413 Rev. *D, Page 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus selecting one of 256K memory locations; no internal latching - requires stable address during CE/OE/WE assertion. |
| I/O0–I/O7 | Lower-Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW during read/write; high-impedance when deselected or BLE HIGH. |
| I/O8–I/O15 | Upper-Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW; independent of BLE - enables true 8/16-bit flexible bus interfacing. |
| CE | Chip Enable | Active-LOW global device select; forces all I/Os into high-Z when HIGH, and enables internal logic only when LOW with valid WE/OE. |
| WE | Write Enable | Active-LOW signal initiating write cycle; data latched on rising edge of WE while CE and address are stable and valid. |
| OE | Output Enable | Active-LOW control for read operations; outputs driven only when OE = LOW, CE = LOW, and address valid - prevents bus contention. |
| BLE / BHE | Byte Low/High Enable | Independent active-LOW controls for lower/upper byte writes; permits partial-word updates without masking logic in host controller. |
| VCC / VSS | Power / Ground | Dual VCC pins (B3, E3) and dual VSS pins (C3, D4) provide low-inductance supply routing; decoupling required within 5 mm of each VCC ball. |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Voltage Operation | Supports 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V rails - eliminates need for external voltage translators in multi-rail industrial systems. |
| Byte-Enable Architecture | Dedicated BHE/BLE pins allow independent 8-bit writes to upper/lower memory bytes - reduces host CPU overhead versus full-word masking. |
| 1.0-V Data Retention | Maintains stored data at VCC ≥ 1.0 V with ISB2 ≤ 6 mA - enables seamless transition to ultra-low-power hold mode during AC loss or scheduled shutdown. |
| TTL-Compatible I/O | VIH/VIL thresholds match legacy 5-V TTL logic families - ensures direct interface with older microcontrollers and FPGAs without level-shifting circuitry. |
| VFBGA Thermal Performance | θJA = 31.35°C/W (vs. 68.85°C/W for TSOP II) - reduces junction temperature rise by >50% under same power dissipation, improving long-term reliability. |
Applications
| Industrial PLC I/O Buffering | Medical Device Real-Time Data Logging |
|---|---|
Use Scenario: Storing sensor acquisition buffers and actuator command queues in programmable logic controllers with deterministic scan-cycle timing. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state memory access for cyclic data exchange between CPU and fieldbus interface ASICs. Use Value: 10 ns tAA ensures sub-microsecond read/write latency, meeting <100 µs PLC scan cycle deadlines without DMA arbitration overhead. |
Use Scenario: Capturing high-fidelity analog waveforms (ECG, EEG) at 10 kS/s in portable diagnostic equipment with battery life constraints. IC Role / Device Role / Timing Role: High-reliability buffer memory holding raw samples prior to compression and wireless transmission. Use Value: 1.0-V data retention enables safe suspend-to-RAM during battery swaps, preserving unsent waveform data without volatile loss. |
| Ruggedized HMI Display Frame Buffer | Avionics Sensor Fusion Preprocessing |
Use Scenario: Serving as dual-port frame buffer for sunlight-readable TFT displays in outdoor control panels exposed to –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Static RAM acting as pixel storage accessed concurrently by display controller (read) and ARM Cortex-M7 (write). Use Value: Industrial-grade temperature rating and VFBGA package withstand thermal cycling stress better than TSOP alternatives in sealed enclosures. |
Use Scenario: Temporarily storing inertial measurement unit (IMU) and GPS timestamp-aligned packets before Kalman filter execution in flight control units. IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory ensuring bounded latency for time-critical sensor fusion algorithms. Use Value: No refresh overhead or access jitter - guarantees worst-case 10 ns read latency essential for hard real-time deadline compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-10TLI | Same density, 10 ns speed, but only 3.3 V operation (3.0–3.6 V); 44-pin TSOP II package; higher θJA (68.85°C/W). | Lacks multi-voltage support and VFBGA thermal advantage - suitable only for 3.3-V-only designs with less stringent thermal budgets. | Select if board already uses TSOP footprint and 3.3-V rail is fixed; avoid for mixed-voltage or thermally dense layouts. |
| ON Semiconductor MC14LC5481M10 | 5 V-only (4.5–5.5 V), 10 ns, 44-pin SOJ; ISB2 = 10 mA typical (vs. 6 mA); no 1.0-V retention mode. | No low-voltage operation or data retention below 2.2 V - incompatible with brown-out hold requirements. | Acceptable only for legacy 5-V systems where power-down retention is not required and SOJ rework is acceptable. |
Compared with IS61LV25616AL-10TLI and MC14LC5481M10, CY7C1041GN-10VXI uniquely combines triple-voltage compatibility, 1.0-V data retention, and VFBGA thermal efficiency - making it the sole choice for new industrial designs demanding voltage flexibility and thermal resilience.
Availability
CY7C1041GN-10VXI is available at Aetrix Electronics and suitable for industrial PLCs, medical data loggers, and ruggedized HMIs requiring stable component supply across extended temperature and multi-rail voltage environments.
Supply support for CY7C1041GN-10VXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its broad portfolio of high-reliability memory, microcontrollers, and analog ICs for industrial, automotive, and IoT applications.
CY7C1041GN belongs to Cypress's legacy asynchronous SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in real-time embedded systems where refresh-free operation and voltage flexibility are mandatory.
FAQ
What voltage ranges does CY7C1041GN-10VXI support, and how are they selected?
CY7C1041GN-10VXI operates across three disjoint VCC ranges: 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V. No configuration pins or registers are involved - the device auto-adapts based solely on applied VCC voltage. Each range has distinct DC/AC specifications (e.g., ISB2 = 6 mA typical only in 4.5–5.5 V mode), and mixing voltages across pins is prohibited.
Does CY7C1041GN-10VXI require an external clock or refresh signal?
No. CY7C1041GN-10VXI is a fully asynchronous SRAM with no clock input. Memory access is controlled solely by CE, OE, WE, BHE, and BLE timing - all defined by setup/hold relationships relative to address and control edges. There is no refresh circuitry or periodic maintenance requirement.
How does the byte-enable functionality work during write operations?
BLE (active-LOW) enables writes only to I/O0–I/O7 (lower byte); BHE (active-LOW) enables writes only to I/O8–I/O15 (upper byte). Both may be asserted simultaneously for full 16-bit writes. When either is HIGH, its corresponding byte lines remain unchanged - enabling partial-word updates without host-side masking logic or read-modify-write cycles.
Can CY7C1041GN-10VXI retain data at 1.0 V while fully powered down?
Yes - at VCC ≥ 1.0 V and CE held HIGH, the device enters data retention mode with ISB2 ≤ 6 mA typical. This is not full power-down: VCC must remain applied, but the core array remains powered. True zero-VCC retention is not supported; external backup power or supercapacitor hold-up is required for complete power loss scenarios.
CY7C1041GN-10VXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-SOJ
CY7C1041GN-10VXI FAQ
1.How can I place an order for CY7C1041GN-10VXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041GN-10VXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041GN-10VXI reliable?
The price and inventory of CY7C1041GN-10VXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GN-10VXI is usually 5 days.
3.What payment methods are accepted for CY7C1041GN-10VXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GN-10VXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041GN-10VXI?
CY7C1041GN-10VXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041GN-10VXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041GN-10VXI?
For technical support, including CY7C1041GN-10VXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GN-10VXI requirements.
6.How does Aetrix verify that CY7C1041GN-10VXI is sourced from the original manufacturer or authorized distributors?
All CY7C1041GN-10VXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GN-10VXI meets industry standards.
7.What is the process for return or replacement of CY7C1041GN-10VXI?
All CY7C1041GN-10VXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GN-10VXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041GN-10VXI part is unused and in its original packaging.
Return procedure for CY7C1041GN-10VXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1041GN-10VXI Tags

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