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Infineon Technologies CY7C1041GN-10ZSXI

Part No.:
CY7C1041GN-10ZSXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041GN-10ZSXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
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Inventory:509

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Product details

Overview

CY7C1041GN-10ZSXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous CMOS static RAM with 10 ns access time, 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V triple-voltage operation, 38 mA typical active current, and 6 mA typical standby current. It supports byte-level write control via BHE/ BLE and operates across industrial temperature range (–40 °C to +85 °C) in a 48-ball VFBGA package.

For engineers reviewing the CY7C1041GN-10ZSXI datasheet, CY7C1041GN-10ZSXI pinout, CY7C1041GN-10ZSXI application, or CY7C1041GN-10ZSXI equivalent, key selection criteria include voltage-flexible operation, TTL-compatible I/Os, low-power data retention at 1.0 V, and dual-byte enable architecture for efficient memory mapping in legacy and mixed-voltage systems.

Technical Context

This SRAM implements a fully asynchronous interface with independent CE, OE, and WE controls, enabling non-overlapping read/write cycles without clock dependency. Its dual-byte enable (BHE/BLE) logic allows selective upper- or lower-byte writes without external gating, reducing bus contention in 16-bit data paths.

The device features three distinct VCC operating ranges-1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V-with corresponding timing and current specifications validated per range. Data retention at 1.0 V is supported with automatic CE-driven power-down mode (ISB2 = 6 mA typ), and all I/Os enter high-impedance state when CE is HIGH or OE/BLE/BHE are deasserted.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size4 Mbit (256K words × 16 bits); supports full 16-bit parallel data bus with byte-select capability
Access time (tAA)10 ns at VCC = 2.2–3.6 V or 4.5–5.5 V; enables integration in fast microcontroller buses and FPGA glue logic
VCC operating range1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V; allows direct interfacing with multiple voltage domains without level shifters
Active current (ICC)38 mA typical at f = 100 MHz; optimized for burst-access embedded systems with moderate throughput demands
Standby current (ISB2)6 mA typical with CE > VCC – 0.2 V; supports low-power sleep modes in portable instrumentation
Data retention voltage1.0 V minimum; maintains stored data during brown-out or battery-backup scenarios
I/O compatibilityTTL-compatible inputs and outputs; ensures interoperability with legacy 5 V logic and modern 3.3 V/1.8 V controllers

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant (package grade BVXI).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address inputs18-bit address bus supporting 256K-word addressing; A0–A17 directly map to memory location index
I/O0–I/O7Lower data byte I/OBi-directional 8-bit data path controlled by BLE; used for LSB-aligned transfers
I/O8–I/O15Upper data byte I/OBi-directional 8-bit data path controlled by BHE; used for MSB-aligned transfers
CEChip EnableActive-low global enable; places all I/Os in high-Z when HIGH, enabling multi-chip memory expansion
OEOutput EnableActive-low read strobe; gates output drivers independently of CE and WE
WEWrite EnableActive-low write strobe; initiates write cycle when CE and WE both LOW
BLEByte Low EnableActive-low control for I/O0–I/O7; allows partial-byte writes without masking logic
BHEByte High EnableActive-low control for I/O8–I/O15; enables independent upper-byte updates

Key Features

FeatureDesign Value
Dual-byte write enable (BHE/BLE)Eliminates need for external byte-mask logic in 16-bit systems, reducing PCB area and signal routing complexity
Triple-voltage operationSupports seamless integration into mixed-supply designs (e.g., 1.8 V core + 3.3 V I/O or 5 V legacy peripherals)
10 ns access time at 3.3 V and 5 VMeets timing requirements of 80 MHz–100 MHz microcontroller buses without wait states
1.0 V data retentionEnables reliable memory hold during power-fail conditions using backup capacitors or coin cells
TTL-compatible I/OsGuarantees noise margin and drive strength compatibility with standard 5 V, 3.3 V, and 1.8 V logic families

Applications

Industrial PLC Memory BufferAutomotive Instrument Cluster Display Cache

Use Scenario: Stores real-time sensor fusion results and UI frame buffers in programmable logic controllers with mixed 3.3 V and 5 V subsystems.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer providing zero-wait-state access to CPU and FPGA co-processors during deterministic scan cycles.

Use Value: Triple-voltage support eliminates level-shifter components; 10 ns tAA ensures sub-microsecond response to motion-triggered interrupts.

Use Scenario: Holds graphical assets and configuration data for TFT-LCD driver ICs in automotive dashboards operating across –40 °C to +85 °C.

IC Role / Device Role / Timing Role: Nonvolatile-cached memory holding boot-up graphics and calibration tables during cold start and ignition sequences.

Use Value: 1.0 V data retention preserves critical display state during 12 V battery dips; industrial-grade thermal resistance (θJA = 31.35 °C/W) sustains reliability under hood temperatures.

Medical Imaging Data FIFOAvionics Sensor Interface Module

Use Scenario: Acts as line-buffer FIFO between analog front-end ADCs and DSP processors in portable ultrasound devices.

IC Role / Device Role / Timing Role: High-speed, low-latency memory staging raw pixel data before compression and transmission.

Use Value: Byte-enable architecture allows efficient packing of 12-bit ADC samples into 16-bit words; 6 mA ISB2 minimizes standby power in battery-operated units.

Use Scenario: Interfaces ARINC 429 transceivers and flight control microcontrollers requiring deterministic memory access in DO-254-certifiable hardware.

IC Role / Device Role / Timing Role: Deterministic-access SRAM serving as register-mapped configuration store and telemetry scratchpad.

Use Value: Fully asynchronous operation avoids clock-domain crossing issues; 48-ball VFBGA meets IPC-7351 density and thermal requirements for conduction-cooled modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS6C4008-10TINSingle 3.3 V supply only (3.0–3.6 V); no 1.8 V or 5 V support; 10 ns tAA identical; 44-pin TSOP II onlyLacks triple-voltage flexibility; unsuitable for mixed-rail systems or legacy 5 V designsSelect only when system uses fixed 3.3 V rail and board layout accommodates TSOP II footprint
IS61LV25616AL-10TLI2.5 V–3.6 V operation only; 10 ns tAA; 44-pin TSOP II; 1.5 V data retention (vs. 1.0 V)Higher minimum retention voltage reduces brown-out margin; no 1.65–2.2 V or 4.5–5.5 V supportPrefer for cost-sensitive 3.3 V-only applications where 1.5 V retention suffices and VFBGA is not required

Compared with AS6C4008-10TIN and IS61LV25616AL-10TLI, CY7C1041GN-10ZSXI uniquely supports three discrete VCC ranges and 1.0 V data retention in a space-efficient VFBGA, making it the only option for compact, mixed-voltage, or ultra-low-retention-voltage designs.

Availability

CY7C1041GN-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive instrument cluster display caches, and medical imaging data FIFOs requiring stable component supply across extended temperature and voltage ranges.

Supply support for CY7C1041GN-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, security ICs, and memory solutions acquired through its 2020 acquisition of Cypress Semiconductor.

CY7C1041GN-10ZSXI belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-reliability, voltage-flexible, asynchronous memory applications in industrial automation, transportation, and medical equipment where pin-compatible longevity and multi-rail interoperability are critical.

FAQ

What voltage ranges does CY7C1041GN-10ZSXI support, and how do they affect timing?

CY7C1041GN-10ZSXI supports three non-overlapping VCC ranges: 1.65–2.2 V (15 ns tAA), 2.2–3.6 V (10 ns tAA), and 4.5–5.5 V (10 ns tAA). Timing parameters are specified separately per range in the datasheet; operation outside these ranges is not guaranteed. The 10 ns rating applies only at 2.2–3.6 V and 4.5–5.5 V, while 1.65–2.2 V operation requires derating to 15 ns.

Does CY7C1041GN-10ZSXI require external pull-up resistors on control pins?

No external pull-ups are required on CE, OE, WE, BHE, or BLE. All control inputs have TTL-compatible thresholds and internal input leakage < ±1 µA, allowing direct connection to microcontroller GPIOs or FPGA I/O banks. Pull-ups may be added only if system-level noise immunity or default-deselected behavior is needed.

Can CY7C1041GN-10ZSXI operate in data retention mode at 1.0 V while maintaining full addressability?

Yes - at VCC = 1.0 V, the device enters data retention mode with CE held HIGH and all inputs at valid logic levels. Address lines A0–A17 remain functional for retention verification, but no read/write operations are permitted. Data integrity is maintained for ≥200 hours per JEDEC JESD22-A117, with ICCDR ≤ 8 mA.

Is the 48-ball VFBGA (BVXI) package RoHS-compliant and lead-free?

Yes - CY7C1041GN-10ZSXI in the 48-ball VFBGA package is Pb-free and RoHS-compliant, as confirmed in the Infineon ordering information and package diagram documentation. The "Z" in the part number suffix denotes lead-free finish, and the "SXI" grade indicates industrial temperature range and green packaging.

CY7C1041GN-10ZSXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1041GN-10ZSXI FAQ

1.How can I place an order for CY7C1041GN-10ZSXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041GN-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041GN-10ZSXI reliable?

The price and inventory of CY7C1041GN-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GN-10ZSXI is usually 5 days.

3.What payment methods are accepted for CY7C1041GN-10ZSXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GN-10ZSXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041GN-10ZSXI?

CY7C1041GN-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041GN-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041GN-10ZSXI?

For technical support, including CY7C1041GN-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GN-10ZSXI requirements.

6.How does Aetrix verify that CY7C1041GN-10ZSXI is sourced from the original manufacturer or authorized distributors?

All CY7C1041GN-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GN-10ZSXI meets industry standards.

7.What is the process for return or replacement of CY7C1041GN-10ZSXI?

All CY7C1041GN-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GN-10ZSXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041GN-10ZSXI part is unused and in its original packaging.

Return procedure for CY7C1041GN-10ZSXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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