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Infineon Technologies CY7C1041GN30-10BVJXI

Part No.:
CY7C1041GN30-10BVJXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1041GN30-10BVJXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,273

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Product details

Overview

CY7C1041GN30-10BVJXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) high-speed CMOS static RAM with 10 ns access time, 2.2 V–3.6 V operating voltage, 38 mA typical active current, and 6 mA typical standby current in industrial-grade VFBGA packaging. It supports byte-level write control via BHE/ BLE, TTL-compatible I/Os, and 1.0-V data retention - deployed in real-time industrial controllers requiring deterministic memory access.

For engineers reviewing the CY7C1041GN30-10BVJXI datasheet, CY7C1041GN30-10BVJXI pinout, CY7C1041GN30-10BVJXI application, or CY7C1041GN30-10BVJXI equivalent, key selection criteria include VCC range compatibility (2.2–3.6 V), 48-ball VFBGA mechanical fit, byte-enable timing margins, and ISB2 < 8 mA standby compliance for low-power embedded systems.

Technical Context

This SRAM implements asynchronous random-access architecture with independent address decoding (A0–A17), dual-byte write enable (BHE for I/O8–I/O15, BLE for I/O0–I/O7), and three-state output control via CE/OE. All I/Os enter high-impedance state when CE is HIGH or OE/BLE/BHE are deasserted.

It operates across three VCC ranges but the CY7C1041GN30 variant is specifically characterized at 2.2–3.6 V with tAA = 10 ns (max), ICC = 45 mA (max), and ISB2 = 8 mA (max) under industrial temperature (–40 °C to +85 °C). Data retention is guaranteed at VCC = 1.0 V with tCDR = 0 ns and tR = 10 ns (VCC > 2.2 V).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K words × 16 bits = 4 Mbit total storage; enables 16-bit parallel data bus interfacing without external multiplexing
Access Time (tAA) 10 ns maximum at VCC = 3.0 V, TA = 25 °C; ensures sub-100 MHz synchronous system timing margin
VCC Operating Range 2.2 V to 3.6 V; compatible with 3.3-V logic families and mixed-voltage SoC interfaces
Active Current (ICC) 38 mA typical / 45 mA maximum at f = 100 MHz; defines thermal budget for dense PCB layouts
Standby Current (ISB2) 6 mA typical / 8 mA maximum with CE > VCC – 0.2 V; supports low-power sleep modes in battery-backed systems
Data Retention Voltage 1.0 V minimum; allows memory state hold during brown-out or controlled power-down sequences
Package 48-ball VFBGA (6 × 8 × 1.0 mm, BVJXI); JEDEC-compliant footprint with swapped I/O[7:0]/I/O[15:8] vs BVXI variant

Pinout & Package

48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, JEDEC-compliant BVJXI package with ball pitch of 0.5 mm. Pinout follows Figure 2 in datasheet Rev. *D (Page 4), where I/O[7:0] and I/O[15:8] are swapped relative to BVXI.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; no internal latching - requires stable setup/hold relative to CE
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 controlled by BHE for byte-select writes
CE Chip Enable Active-low global enable; device enters standby (ISB2) when HIGH, disables all outputs regardless of OE/WE state
OE Output Enable Active-low read strobe; controls output drivers only - does not affect internal array access timing
WE Write Enable Active-low write strobe; initiates write cycle when CE and WE both LOW; sampled synchronously with address
BLE / BHE Byte Low/High Enable Independent active-low enables for lower/upper byte writes; permits 8-bit partial writes without disturbing adjacent byte
VCC / VSS Power / Ground Dual VCC balls (pins E2, D3) and dual VSS balls (pins F2, E3) reduce IR drop and improve noise immunity in high-speed operation

Key Features

Feature Design Value
10 ns access time at 3.0 V Enables direct interface with 80–100 MHz microcontrollers without wait states
Byte-select write capability Reduces bus contention and eliminates need for external byte-masking logic in 16-bit systems
1.0-V data retention Permits memory state preservation during deep-sleep or backup-battery operation without full VCC rail
TTL-compatible I/O levels Ensures interoperability with legacy 3.3-V and 5-V logic families without level-shifting circuitry
Industrial temperature range Validated operation from –40 °C to +85 °C supports deployment in factory automation and outdoor edge nodes

Applications

Programmable Logic Controller (PLC) CPU Module Industrial HMI Display Buffer

Use Scenario: Stores real-time I/O mapping tables and instruction cache for ARM Cortex-M7-based PLC main processor.

IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state instruction/data fetch at 100 MHz bus clock.

Use Value: 10 ns tAA and 256K × 16 organization eliminate pipeline stalls during ladder logic scan cycles.

Use Scenario: Serves as frame buffer for 800×480 TFT display in panel-mounted HMI with touch controller co-processor.

IC Role / Device Role / Timing Role: Dual-port-capable memory accessed concurrently by display controller (read) and host MCU (write).

Use Value: Byte-enable (BLE/BHE) allows efficient partial updates of GUI widgets without full-frame rewrite overhead.

Railway Signaling Safety Processor Medical Diagnostic Imaging Subsystem

Use Scenario: Holds certified safety-critical configuration data and diagnostic logs in SIL-3 compliant signaling module.

IC Role / Device Role / Timing Role: Nonvolatile-retentive memory used during controlled power-down sequences between train detection cycles.

Use Value: Guaranteed 1.0-V data retention enables safe state capture during 100-ms brown-out events per EN 5012x standards.

Use Scenario: Buffers raw sensor data from 12-bit ADC array prior to FPGA-based FFT processing in portable ultrasound unit.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfaced directly to FPGA Avalon-MM bus.

Use Value: 38 mA typical ICC and 6 mA ISB2 support battery-operated mode with >8-hour runtime under intermittent acquisition duty cycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV25616BLL-10MLI Same 256K × 16 organization, 10 ns access, but 3.3 V only (3.135–3.465 V); no multi-voltage support Lacks 2.2–3.6 V flexibility; unsuitable for designs with wide input voltage tolerance requirements Select when system VCC is tightly regulated at 3.3 V and JEDEC TSOP-II footprint is preferred over VFBGA
Winbond W9825G6JH-10 SDRAM (not SRAM); requires refresh, clocked interface, and command protocol; 10 ns latency only in burst mode Cannot replace CY7C1041GN30 in asynchronous bus systems without controller redesign Consider only for new designs with DDR-capable MCU and need for higher density (>4 Mbit) at lower cost-per-bit

Compared with IS61WV25616BLL-10MLI and W9825G6JH-10, the CY7C1041GN30-10BVJXI uniquely delivers true asynchronous operation, multi-voltage support, and byte-select capability in a space-constrained VFBGA - making it irreplaceable in legacy bus-based industrial controllers requiring deterministic timing and minimal BOM changes.

Availability

CY7C1041GN30-10BVJXI is available at Aetrix Electronics and suitable for programmable logic controllers, industrial HMIs, railway signaling modules, and medical imaging subsystems requiring stable component supply across extended product lifecycles.

Supply support for CY7C1041GN30-10BVJXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and memory solutions, formed through acquisition of Cypress Semiconductor in 2020.

CY7C1041GN30 belongs to Infineon's legacy Cypress SRAM portfolio, engineered for deterministic, low-latency memory in industrial control and safety-critical embedded systems where refresh-free operation and wide VCC tolerance are mandatory.

FAQ

What is the maximum operating frequency supported by CY7C1041GN30-10BVJXI?

The device has no clock input and operates asynchronously; its maximum usable bus frequency depends on tAA (10 ns), tOH (output hold), and system-level setup/hold timing. At 3.0 V, it reliably supports 80–100 MHz bus clocks with proper PCB layout and termination - confirmed by AC switching characteristics in datasheet Rev. *D, Table 8.

Does CY7C1041GN30-10BVJXI require external refresh circuitry?

No. It is a static RAM (SRAM), not DRAM or SDRAM. Data retention is indefinite as long as VCC remains within specification and CE is asserted during active use. Only during data retention mode (VCC = 1.0 V) is refresh unnecessary - no periodic access or timing constraints apply.

Can BLE and BHE be used simultaneously for full 16-bit writes?

Yes. When both BLE and BHE are LOW, all 16 I/O lines (I/O0–I/O15) are enabled for concurrent write. This is the default condition for full-word writes; the byte enables are optional and used only when writing to one byte while preserving the other.

Is the BVJXI package pin-compatible with BVXI?

No. While both are 48-ball VFBGA, BVJXI swaps the physical ball positions of I/O[7:0] and I/O[15:8] relative to BVXI (per datasheet Note 3, Page 4). Board layout must match the specific package grade - direct substitution without PCB revision will cause data bus inversion.

CY7C1041GN30-10BVJXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1041GN30-10BVJXI FAQ

1.How can I place an order for CY7C1041GN30-10BVJXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041GN30-10BVJXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041GN30-10BVJXI reliable?

The price and inventory of CY7C1041GN30-10BVJXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GN30-10BVJXI is usually 5 days.

3.What payment methods are accepted for CY7C1041GN30-10BVJXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GN30-10BVJXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041GN30-10BVJXI?

CY7C1041GN30-10BVJXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041GN30-10BVJXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041GN30-10BVJXI?

For technical support, including CY7C1041GN30-10BVJXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GN30-10BVJXI requirements.

6.How does Aetrix verify that CY7C1041GN30-10BVJXI is sourced from the original manufacturer or authorized distributors?

All CY7C1041GN30-10BVJXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GN30-10BVJXI meets industry standards.

7.What is the process for return or replacement of CY7C1041GN30-10BVJXI?

All CY7C1041GN30-10BVJXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GN30-10BVJXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041GN30-10BVJXI part is unused and in its original packaging.

Return procedure for CY7C1041GN30-10BVJXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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