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Infineon Technologies CY7C1041GN30-10ZSXIT

Part No.:
CY7C1041GN30-10ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041GN30-10ZSXIT.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,820

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Product details

Overview

CY7C1041GN30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous CMOS static RAM with 10 ns access time, 2.2 V–3.6 V supply operation, 38 mA typical active current, and 6 mA typical standby current. It supports byte-level write control via BHE/ BLE pins and operates in industrial temperature range (–40 °C to +85 °C), deployed in real-time data buffering for industrial PLCs and embedded controllers.

For engineers reviewing the CY7C1041GN30-10ZSXIT datasheet, CY7C1041GN30-10ZSXIT pinout, CY7C1041GN30-10ZSXIT application, or CY7C1041GN30-10ZSXIT equivalent, key selection criteria include VCC range compatibility (2.2–3.6 V), 10 ns tAA timing, byte-enable write architecture, and VFBGA-48 package thermal resistance (θJA = 31.35 °C/W).

Technical Context

This SRAM implements a fully decoded 18-bit address bus (A0–A17) driving a 256K-word × 16-bit memory array with independent high- and low-byte I/O paths. Read/write operations are controlled by TTL-compatible CE, OE, WE, BHE, and BLE signals with defined setup/hold timing relative to address and control edges.

It features dual power-down modes: ISB1 (TTL input logic) and ISB2 (CMOS input logic), with ISB2 = 6 mA typical at VCC = 3 V. Data retention is guaranteed at 1.0 V with tCDR = 0 ns and tR = 10 ns (VCC > 2.2 V), enabling low-power suspend states in battery-backed systems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size4 Mbit (256K words × 16 bits); supports 32 KB of parallel data storage with no refresh required.
Access Time (tAA)10 ns max at VCC = 2.2–3.6 V; enables direct interfacing with 100 MHz microcontrollers without wait states.
Supply Voltage2.2 V to 3.6 V; compatible with modern low-voltage SoCs and FPGA I/O banks without level translation.
Active Current (ICC)38 mA typical at f = 100 MHz; determines thermal load and PCB copper area requirements for continuous burst access.
Standby Current (ISB2)6 mA typical with CMOS inputs disabled; sets minimum system power budget during idle cycles.
Data Retention Voltage1.0 V min; allows operation from backup coin-cell or supercapacitor during main power loss.
Operating Temperature–40 °C to +85 °C industrial grade; validated for use in factory automation and outdoor edge nodes.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVXI footprint (ball pitch = 0.5 mm).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit row/column select lines; fully decoded to access all 256K locations without external logic.
I/O0–I/O7Lower Byte Data I/OBi-directional 8-bit data path enabled only when BLE = LOW during write or read.
I/O8–I/O15Upper Byte Data I/OBi-directional 8-bit data path enabled only when BHE = LOW during write or read.
CEChip EnableActive-LOW global enable; places all I/Os in high-impedance state when HIGH, reducing bus contention.
WEWrite EnableActive-LOW signal initiating write cycle; latches data on rising edge of WE when CE and address stable.
OEOutput EnableActive-LOW control for read output drivers; decouples memory data from bus when deasserted.
BLE / BHEByte Low/High EnableIndependent 8-bit write masking; enables partial writes without read-modify-write overhead.
VCC / VSSPower / GroundDual VCC pins (Balls D2, E2) and dual VSS pins (Balls D1, E1) reduce IR drop and improve noise immunity.

Key Features

FeatureDesign Value
Multi-Voltage OperationSupports 2.2–3.6 V supply range-eliminates need for external voltage regulators in mixed-voltage designs.
Byte-Write ArchitectureBHE/ BLE pins allow independent 8-bit writes-reduces bus traffic and avoids full-word overwrites in firmware buffers.
Low-Power Standby ModeISB2 = 6 mA typical at 3 V-enables energy-efficient sleep states in portable and remote sensor nodes.
1.0-V Data RetentionMaintains stored data down to 1.0 V-supports seamless transition to backup power without data loss.
VFBGA Thermal PerformanceθJA = 31.35 °C/W-enables high-density placement on compact industrial PCBs without forced air cooling.

Applications

Industrial PLC Data BufferingAutomotive ADAS Sensor Cache

Use Scenario: Real-time acquisition of analog sensor inputs and digital I/O status in programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state data staging between ADCs and ARM Cortex-M7 processors.

Use Value: 10 ns tAA ensures deterministic response to interrupt-driven sampling at 100 kHz update rates.

Use Scenario: Temporary storage of raw camera or radar frame data before compression and transmission in advanced driver assistance systems.

IC Role / Device Role / Timing Role: High-speed parallel buffer interfacing directly with MIPI CSI-2 bridge ICs via 16-bit bus.

Use Value: Dual-byte write capability reduces memory transaction count by 50% during partial-frame updates.

Medical Imaging Front-EndTest & Measurement Equipment

Use Scenario: Capturing time-aligned waveform samples from multi-channel ECG or EEG front-ends prior to DSP processing.

IC Role / Device Role / Timing Role: Non-refresh volatile memory acting as first-stage FIFO between analog front-end and FPGA-based correlator.

Use Value: 1.0 V data retention preserves last acquired trace during brief AC power interruption.

Use Scenario: Storing calibrated reference waveforms and real-time acquisition buffers in benchtop oscilloscopes and spectrum analyzers.

IC Role / Device Role / Timing Role: High-bandwidth memory mapped into ARM A9 processor's AXI bus for DMA-accelerated capture engines.

Use Value: VFBGA-48 package enables dense layout near high-speed ADCs while maintaining signal integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS61WV25616EDBLL-10MLI10 ns tAA, 2.5 V ±10%, 48-pin TSOP II package (θJA = 68.85 °C/W)Larger thermal resistance limits sustained burst throughput in compact enclosuresSelect when board layout requires through-hole or legacy TSOP footprint and thermal margin >25 °C/W is available.
Renesas R1LV25616AS-10SI10 ns tAA, 2.2–3.6 V, 44-pin SOJ package with higher ISB2 = 12 mA typicalHigher standby current increases battery drain in always-on monitoring devicesSelect when SOJ rework compatibility is required and system duty cycle permits 100% higher ISB2.

Compared with IS61WV25616EDBLL-10MLI and R1LV25616AS-10SI, CY7C1041GN30-10ZSXIT delivers superior thermal performance (θJA = 31.35 °C/W) and lowest standby current (6 mA), making it optimal for space-constrained, battery-sensitive industrial edge nodes requiring sustained high-speed access.

Availability

CY7C1041GN30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive ADAS sensor cache, and medical imaging front-end applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1041GN30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.

CY7C1041GN30-10ZSXIT belongs to Infineon's legacy Cypress SRAM portfolio, engineered for high-reliability, low-latency parallel memory interfacing in deterministic real-time systems where refresh-free operation and precise timing control are critical.

FAQ

What is the maximum clock frequency supported for burst reads?

This is an asynchronous SRAM-no internal clock is used. Data access is governed solely by tAA (10 ns), tOH (output hold time), and address/control setup/hold times. Maximum effective throughput depends on external controller timing margins, but sustained 100 MHz bus operation is verified per ICC test conditions in the datasheet.

Does CY7C1041GN30-10ZSXIT support partial writes without read-modify-write cycles?

Yes. The dedicated BHE (byte high enable) and BLE (byte low enable) pins allow independent write access to upper (I/O8–I/O15) or lower (I/O0–I/O7) bytes. When only one byte enable is asserted LOW with WE and CE, only that 8-bit segment is updated-no prior read is required.

Can this SRAM retain data during complete power removal?

No. Data retention requires minimum VCC ≥ 1.0 V. If main power drops below 1.0 V, data is lost unless a backup source (e.g., supercapacitor or coin cell) maintains VCC above threshold. The device does not include non-volatile storage or on-chip EEPROM.

Is the VFBGA-48 package RoHS and REACH compliant?

Yes. The CY7C1041GN30-10ZSXIT is Pb-free and complies with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Full compliance documentation, including substance declarations and test reports, is available via Infineon's Product Change Notification portal.

CY7C1041GN30-10ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1041GN30-10ZSXIT FAQ

1.How can I place an order for CY7C1041GN30-10ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041GN30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041GN30-10ZSXIT reliable?

The price and inventory of CY7C1041GN30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GN30-10ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7C1041GN30-10ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GN30-10ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041GN30-10ZSXIT?

CY7C1041GN30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041GN30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041GN30-10ZSXIT?

For technical support, including CY7C1041GN30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GN30-10ZSXIT requirements.

6.How does Aetrix verify that CY7C1041GN30-10ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1041GN30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GN30-10ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7C1041GN30-10ZSXIT?

All CY7C1041GN30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GN30-10ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041GN30-10ZSXIT part is unused and in its original packaging.

Return procedure for CY7C1041GN30-10ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1041GN30-10ZSXIT Tags

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