Infineon Technologies CY7C1041GN30-10ZSXIT
- Part No.:
- CY7C1041GN30-10ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041GN30-10ZSXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,820
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Product details
Overview
CY7C1041GN30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous CMOS static RAM with 10 ns access time, 2.2 V–3.6 V supply operation, 38 mA typical active current, and 6 mA typical standby current. It supports byte-level write control via BHE/ BLE pins and operates in industrial temperature range (–40 °C to +85 °C), deployed in real-time data buffering for industrial PLCs and embedded controllers.
For engineers reviewing the CY7C1041GN30-10ZSXIT datasheet, CY7C1041GN30-10ZSXIT pinout, CY7C1041GN30-10ZSXIT application, or CY7C1041GN30-10ZSXIT equivalent, key selection criteria include VCC range compatibility (2.2–3.6 V), 10 ns tAA timing, byte-enable write architecture, and VFBGA-48 package thermal resistance (θJA = 31.35 °C/W).
Technical Context
This SRAM implements a fully decoded 18-bit address bus (A0–A17) driving a 256K-word × 16-bit memory array with independent high- and low-byte I/O paths. Read/write operations are controlled by TTL-compatible CE, OE, WE, BHE, and BLE signals with defined setup/hold timing relative to address and control edges.
It features dual power-down modes: ISB1 (TTL input logic) and ISB2 (CMOS input logic), with ISB2 = 6 mA typical at VCC = 3 V. Data retention is guaranteed at 1.0 V with tCDR = 0 ns and tR = 10 ns (VCC > 2.2 V), enabling low-power suspend states in battery-backed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256K words × 16 bits); supports 32 KB of parallel data storage with no refresh required. |
| Access Time (tAA) | 10 ns max at VCC = 2.2–3.6 V; enables direct interfacing with 100 MHz microcontrollers without wait states. |
| Supply Voltage | 2.2 V to 3.6 V; compatible with modern low-voltage SoCs and FPGA I/O banks without level translation. |
| Active Current (ICC) | 38 mA typical at f = 100 MHz; determines thermal load and PCB copper area requirements for continuous burst access. |
| Standby Current (ISB2) | 6 mA typical with CMOS inputs disabled; sets minimum system power budget during idle cycles. |
| Data Retention Voltage | 1.0 V min; allows operation from backup coin-cell or supercapacitor during main power loss. |
| Operating Temperature | –40 °C to +85 °C industrial grade; validated for use in factory automation and outdoor edge nodes. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVXI footprint (ball pitch = 0.5 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit row/column select lines; fully decoded to access all 256K locations without external logic. |
| I/O0–I/O7 | Lower Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW during write or read. |
| I/O8–I/O15 | Upper Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW during write or read. |
| CE | Chip Enable | Active-LOW global enable; places all I/Os in high-impedance state when HIGH, reducing bus contention. |
| WE | Write Enable | Active-LOW signal initiating write cycle; latches data on rising edge of WE when CE and address stable. |
| OE | Output Enable | Active-LOW control for read output drivers; decouples memory data from bus when deasserted. |
| BLE / BHE | Byte Low/High Enable | Independent 8-bit write masking; enables partial writes without read-modify-write overhead. |
| VCC / VSS | Power / Ground | Dual VCC pins (Balls D2, E2) and dual VSS pins (Balls D1, E1) reduce IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage Operation | Supports 2.2–3.6 V supply range-eliminates need for external voltage regulators in mixed-voltage designs. |
| Byte-Write Architecture | BHE/ BLE pins allow independent 8-bit writes-reduces bus traffic and avoids full-word overwrites in firmware buffers. |
| Low-Power Standby Mode | ISB2 = 6 mA typical at 3 V-enables energy-efficient sleep states in portable and remote sensor nodes. |
| 1.0-V Data Retention | Maintains stored data down to 1.0 V-supports seamless transition to backup power without data loss. |
| VFBGA Thermal Performance | θJA = 31.35 °C/W-enables high-density placement on compact industrial PCBs without forced air cooling. |
Applications
| Industrial PLC Data Buffering | Automotive ADAS Sensor Cache |
|---|---|
Use Scenario: Real-time acquisition of analog sensor inputs and digital I/O status in programmable logic controllers. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state data staging between ADCs and ARM Cortex-M7 processors. Use Value: 10 ns tAA ensures deterministic response to interrupt-driven sampling at 100 kHz update rates. | Use Scenario: Temporary storage of raw camera or radar frame data before compression and transmission in advanced driver assistance systems. IC Role / Device Role / Timing Role: High-speed parallel buffer interfacing directly with MIPI CSI-2 bridge ICs via 16-bit bus. Use Value: Dual-byte write capability reduces memory transaction count by 50% during partial-frame updates. |
| Medical Imaging Front-End | Test & Measurement Equipment |
Use Scenario: Capturing time-aligned waveform samples from multi-channel ECG or EEG front-ends prior to DSP processing. IC Role / Device Role / Timing Role: Non-refresh volatile memory acting as first-stage FIFO between analog front-end and FPGA-based correlator. Use Value: 1.0 V data retention preserves last acquired trace during brief AC power interruption. | Use Scenario: Storing calibrated reference waveforms and real-time acquisition buffers in benchtop oscilloscopes and spectrum analyzers. IC Role / Device Role / Timing Role: High-bandwidth memory mapped into ARM A9 processor's AXI bus for DMA-accelerated capture engines. Use Value: VFBGA-48 package enables dense layout near high-speed ADCs while maintaining signal integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV25616EDBLL-10MLI | 10 ns tAA, 2.5 V ±10%, 48-pin TSOP II package (θJA = 68.85 °C/W) | Larger thermal resistance limits sustained burst throughput in compact enclosures | Select when board layout requires through-hole or legacy TSOP footprint and thermal margin >25 °C/W is available. |
| Renesas R1LV25616AS-10SI | 10 ns tAA, 2.2–3.6 V, 44-pin SOJ package with higher ISB2 = 12 mA typical | Higher standby current increases battery drain in always-on monitoring devices | Select when SOJ rework compatibility is required and system duty cycle permits 100% higher ISB2. |
Compared with IS61WV25616EDBLL-10MLI and R1LV25616AS-10SI, CY7C1041GN30-10ZSXIT delivers superior thermal performance (θJA = 31.35 °C/W) and lowest standby current (6 mA), making it optimal for space-constrained, battery-sensitive industrial edge nodes requiring sustained high-speed access.
Availability
CY7C1041GN30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive ADAS sensor cache, and medical imaging front-end applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1041GN30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
CY7C1041GN30-10ZSXIT belongs to Infineon's legacy Cypress SRAM portfolio, engineered for high-reliability, low-latency parallel memory interfacing in deterministic real-time systems where refresh-free operation and precise timing control are critical.
FAQ
What is the maximum clock frequency supported for burst reads?
This is an asynchronous SRAM-no internal clock is used. Data access is governed solely by tAA (10 ns), tOH (output hold time), and address/control setup/hold times. Maximum effective throughput depends on external controller timing margins, but sustained 100 MHz bus operation is verified per ICC test conditions in the datasheet.
Does CY7C1041GN30-10ZSXIT support partial writes without read-modify-write cycles?
Yes. The dedicated BHE (byte high enable) and BLE (byte low enable) pins allow independent write access to upper (I/O8–I/O15) or lower (I/O0–I/O7) bytes. When only one byte enable is asserted LOW with WE and CE, only that 8-bit segment is updated-no prior read is required.
Can this SRAM retain data during complete power removal?
No. Data retention requires minimum VCC ≥ 1.0 V. If main power drops below 1.0 V, data is lost unless a backup source (e.g., supercapacitor or coin cell) maintains VCC above threshold. The device does not include non-volatile storage or on-chip EEPROM.
Is the VFBGA-48 package RoHS and REACH compliant?
Yes. The CY7C1041GN30-10ZSXIT is Pb-free and complies with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Full compliance documentation, including substance declarations and test reports, is available via Infineon's Product Change Notification portal.
CY7C1041GN30-10ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1041GN30-10ZSXIT FAQ
1.How can I place an order for CY7C1041GN30-10ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041GN30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041GN30-10ZSXIT reliable?
The price and inventory of CY7C1041GN30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041GN30-10ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1041GN30-10ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041GN30-10ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041GN30-10ZSXIT?
CY7C1041GN30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041GN30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041GN30-10ZSXIT?
For technical support, including CY7C1041GN30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041GN30-10ZSXIT requirements.
6.How does Aetrix verify that CY7C1041GN30-10ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1041GN30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041GN30-10ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1041GN30-10ZSXIT?
All CY7C1041GN30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041GN30-10ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041GN30-10ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1041GN30-10ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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