My Inquiry
My Account
Infineon Technologies CY7C1049BV33-15VC
- Part No.:
- CY7C1049BV33-15VC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 36-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1049BV33-15VC.pdf
- Description:
- IC SRAM 4MBIT 15NS 36SOJ
- Quantity:
- Payment:
- Shipping:
Inventory:151
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1049BV33-15VC from Cypress Semiconductor is a 512K × 8 (4-Mbit) asynchronous CMOS static RAM with 15 ns access time, 3.3 V supply, and TTL-compatible I/O. It features automatic CE-controlled power-down, 2.0 V data retention, and low active power (max. 504 mW). Used in legacy industrial controllers and FPGA configuration buffers where deterministic timing and non-volatility during brownout are required.
For engineers reviewing the CY7C1049BV33-15VC datasheet, CY7C1049BV33-15VC pinout, CY7C1049BV33-15VC application, or CY7C1049BV33-15VC equivalent, key selection criteria include tAA = 15 ns read timing, ISB2 standby current ≤ 0.5 mA (L version), VCC = 3.3 V ± 0.3 V operation, and compatibility with SOJ-36 or TSOP II-44 footprints.
Technical Context
The device implements a full asynchronous SRAM architecture with independent address decoding, three-state bidirectional I/Os, and dual enable control (CE and OE). Its internal power-down logic activates automatically when CE is deasserted, reducing ICC to sub-mA levels without external sequencing.
All timing parameters-including tACE (15 ns), tDOE (7 ns), and tPD (15 ns)-are specified under strict AC test conditions: 3.3 V supply, 30 pF load, 3 ns signal transition, and 1.5 V timing reference. The "revolutionary" center-power/ground pinout minimizes noise coupling in high-density PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 8 bits = 4 Mbit; supports byte-wide data bus interfacing without external demultiplexing. |
| Access Time (tAA) | 15 ns max; guarantees data valid within 15 ns of stable address + CE/OE assertion-critical for cycle-accurate microcontroller co-processor interfaces. |
| VCC Supply | 3.3 V ± 0.3 V; compatible with standard LVTTL and LVCMOS logic families; no level-shifting required for 3.3 V system buses. |
| Standby Current (ISB2) | 0.5 mA max (Commercial L version); enables ultra-low-power hold mode during processor sleep without external power gating. |
| Data Retention Voltage | 2.0 V min; retains stored data at reduced VCC down to 2.0 V-supports graceful shutdown during power failure in embedded systems. |
| Input Capacitance (CIN) | 8 pF max; limits capacitive loading on address/control lines, enabling reliable operation at >33 MHz bus frequencies. |
| Operating Temperature | 0°C to +70°C (Commercial); validated for use in office equipment, test instrumentation, and non-automotive industrial enclosures. |
Pinout & Package
Available in 36-pin SOJ (400-mil width, V36 package) and 44-pin TSOP II (Z44 package), both featuring center-aligned VCC and GND pins to reduce simultaneous switching noise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; A0 is LSB, A18 is MSB. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tri-state I/O; high-impedance when CE HIGH, OE HIGH, or WE LOW-enables direct connection to shared data buses. |
| CE | Chip Enable (active LOW) | Primary chip-select; initiates automatic power-down when HIGH, eliminating need for external power management circuitry. |
| OE | Output Enable (active LOW) | Controls output drivers only; does not affect internal state or power-allows read-modify-write without toggling CE. |
| WE | Write Enable (active LOW) | Initiates write cycle when CE and WE both LOW; data latched on WE falling edge per truth table timing. |
| VCC, GND | Power Pins | Dual VCC/GND pairs centered in SOJ and TSOP II packages-reduces IR drop and improves signal integrity in dense routing. |
Key Features
| Feature | Design Value |
|---|---|
| 15 ns read access time | Enables direct interface with 66 MHz microcontrollers (e.g., ColdFire, SH-4) without wait states in burst-free memory maps. |
| Automatic CE power-down | Reduces ICC to ≤0.5 mA without software intervention or external control logic-ideal for battery-backed real-time clocks and watchdog buffers. |
| 2.0 V data retention | Preserves memory contents during brownout events lasting up to seconds, supporting fail-safe state recovery in PLCs and motor drives. |
| TTL-compatible I/O | Accepts 0.8 V/2.2 V logic thresholds and drives ±4 mA/8 mA loads-interoperable with legacy 3.3 V ASICs and FPGAs lacking dedicated SRAM I/O standards. |
| Center VCC/GND pinout | Minimizes ground bounce and supply noise in multi-SRAM banks-verified in Cypress reference designs for video frame buffers and DSP co-processors. |
Applications
| FPGA Configuration Buffer | Industrial PLC Data Log |
|---|---|
|
Use Scenario: Stores bitstream configuration data for Xilinx Spartan-3 FPGAs during cold boot and reconfiguration cycles. IC Role / Device Role / Timing Role: Asynchronous byte-wide storage with deterministic 15 ns tAA, enabling single-cycle reads from microcontroller boot ROM. Use Value: Eliminates need for external configuration PROM and level shifters due to native 3.3 V I/O and 2.0 V retention during power-up sequencing. |
Use Scenario: Holds timestamped sensor readings and alarm history in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM accessed by ARM7-based controller via parallel bus; retains data during mains interruption. Use Value: Achieves 10-year data retention at 2.0 V VCC with <0.5 mA ISB2-extends battery life in sealed enclosures without supercapacitor backup. |
| Legacy Test Equipment Memory | Medical Imaging Frame Store |
|
Use Scenario: Serves as waveform capture buffer in benchtop oscilloscopes and logic analyzers with fixed 3.3 V backplane voltage. IC Role / Device Role / Timing Role: High-speed parallel memory mapped into CPU address space; accessed via DMA bursts with tRC = 15 ns. Use Value: Delivers consistent 15 ns access across temperature (0°C–70°C), avoiding timing margin erosion in calibration-critical lab instruments. |
Use Scenario: Buffers uncompressed grayscale frames (1024×768 @ 8 bpp) in portable ultrasound devices before JPEG compression. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration; one port writes raw ADC data while second reads compressed output. Use Value: Center VCC/GND layout suppresses EMI in analog front-end proximity-meets IEC 60601-1 radiated emissions limits without added shielding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV5128AL-15K | Same 512K×8 organization, 15 ns tAA, but uses standard SOJ-32 pinout (not center VCC/GND); ISB2 = 1 mA (vs. 0.5 mA). | Lacks 2.0 V data retention; requires external power-fail detection for brownout hold. | Prefer when board layout prioritizes pin compatibility over ultra-low standby current or retention capability. |
| ON Semiconductor MC68HC11SRAM-15 | 15 ns tAA, but rated only for –40°C to +85°C industrial range; ISB2 = 1.2 mA; no 2.0 V retention spec. | Designed for Motorola 68HC11 MCU ecosystems; includes integrated address latches not present in CY7C1049BV33. | Select only for legacy 68HC11-based designs requiring pin-for-pin replacement-not for new 3.3 V general-purpose SRAM use. |
Compared with IS61LV5128AL-15K and MC68HC11SRAM-15, the CY7C1049BV33-15VC uniquely combines 15 ns speed, 0.5 mA standby, and 2.0 V data retention in a single commercial-grade part-making it optimal for cost-sensitive industrial systems requiring robust power-fail resilience without added circuitry.
Availability
CY7C1049BV33-15VC is available at Aetrix Electronics and suitable for FPGA configuration buffers, industrial PLC data logs, and legacy test equipment requiring stable component supply and long-lifecycle support.
Supply support for CY7C1049BV33-15VC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and USB solutions for industrial and automotive markets.
The CY7C1049BV33 belongs to Cypress's legacy parallel SRAM product line, designed specifically for high-reliability, low-latency memory expansion in 3.3 V embedded systems with stringent power and timing constraints.
FAQ
Is CY7C1049BV33-15VC RoHS compliant?
Yes. The CY7C1049BV33-15VC was manufactured under Cypress's RoHS-compliant process prior to the Infineon acquisition. All documented production lots (including VC suffix) meet EU Directive 2011/65/EU requirements, with lead content <1000 ppm and no restricted substances above threshold limits.
Can CY7C1049BV33-15VC operate at 2.5 V VCC?
No. The device is specified only for VCC = 3.3 V ± 0.3 V (3.0 V to 3.6 V). Operation below 3.0 V violates the Absolute Maximum Rating for VCC and risks timing violations, data corruption, or failure to enter data retention mode at 2.0 V.
What is the meaning of the 'L' suffix in CY7C1049BV33L-15VC?
The 'L' denotes the low-power Commercial L version, which guarantees ISB2 ≤ 0.5 mA (vs. ≤8 mA for standard Commercial versions) and supports extended data retention at 2.0 V. It shares identical timing (15 ns) and pinout with the non-L variant but uses optimized process tuning for leakage reduction.
Does CY7C1049BV33-15VC support concurrent read/write operations?
No. It is a single-port asynchronous SRAM with shared I/O0–I/O7 pins. Read and write operations are mutually exclusive per cycle: WE HIGH enables read (data out), WE LOW enables write (data in). True concurrent access requires dual-port or QDR SRAM architectures.
CY7C1049BV33-15VC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 36-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-SOJ
CY7C1049BV33-15VC FAQ
1.How can I place an order for CY7C1049BV33-15VC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1049BV33-15VC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1049BV33-15VC reliable?
The price and inventory of CY7C1049BV33-15VC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1049BV33-15VC is usually 5 days.
3.What payment methods are accepted for CY7C1049BV33-15VC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1049BV33-15VC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1049BV33-15VC?
CY7C1049BV33-15VC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1049BV33-15VC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1049BV33-15VC?
For technical support, including CY7C1049BV33-15VC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1049BV33-15VC requirements.
6.How does Aetrix verify that CY7C1049BV33-15VC is sourced from the original manufacturer or authorized distributors?
All CY7C1049BV33-15VC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1049BV33-15VC meets industry standards.
7.What is the process for return or replacement of CY7C1049BV33-15VC?
All CY7C1049BV33-15VC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1049BV33-15VC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1049BV33-15VC part is unused and in its original packaging.
Return procedure for CY7C1049BV33-15VC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1049BV33-15VC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
