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Infineon Technologies CY7C1049GN30-10VXI
- Part No.:
- CY7C1049GN30-10VXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 36-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1049GN30-10VXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 36SOJ
- Quantity:
- Payment:
- Shipping:
Inventory:4,637
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Product details
Overview
CY7C1049GN30-10VXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (512K × 8) asynchronous CMOS static RAM with 10 ns access time, TTL-compatible I/Os, and dual-voltage support (2.2 V–3.6 V). It operates across industrial temperature (–40 °C to +85 °C), delivers 38 mA typical active current and 6 mA typical standby current, and uses a 44-pin TSOP II package for high-density memory subsystems in embedded controllers and data acquisition systems.
For engineers reviewing the CY7C1049GN30-10VXI datasheet, CY7C1049GN30-10VXI pinout, CY7C1049GN30-10VXI application, or CY7C1049GN30-10VXI equivalent, key selection criteria include tAA = 10 ns timing at 3.0 V, ISB2 = 6 mA low-power standby mode, VCC range compatibility with 3.3 V logic domains, and verified 44-pin TSOP II footprint integration in space-constrained PCB layouts.
Technical Context
This SRAM implements a fully asynchronous interface with independent Chip Enable (CE), Output Enable (OE), and Write Enable (WE) controls. Address decoding covers A0–A18 (512K words), and bidirectional I/O0–I/O7 support byte-wide data transfers without external latches.
It features automatic CE power-down (ISB2 = 6 mA) when CE is deasserted under CMOS input conditions, and maintains valid data retention down to VCC = 1.0 V. All I/Os enter high-impedance state during CE HIGH or OE HIGH, enabling bus sharing in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 4 Mbit (512K words × 8-bit) - supports full byte-accessible storage for firmware buffers or real-time data logging |
| Access time (tAA) | 10 ns at VCC = 3.0 V - enables direct interfacing with 80–100 MHz microcontrollers without wait states |
| VCC operating range | 2.2 V to 3.6 V - compatible with 3.3 V supply rails and tolerant of ±0.4 V variation |
| Active current (ICC) | 38 mA typical at f = 100 MHz - defines dynamic power budget for burst-mode memory access |
| Standby current (ISB2) | 6 mA typical with CE > VCC – 0.2 V - enables low-power sleep modes in battery-backed or energy-sensitive systems |
| Data retention voltage | 1.0 V minimum - allows memory contents to persist during brown-out or controlled power-down sequences |
| I/O compatibility | TTL-compatible inputs/outputs - eliminates level-shifting requirements when interfacing with legacy 3.3 V or 5 V logic families |
Pinout & Package
The CY7C1049GN30-10VXI is housed in a 44-pin Thin Small Outline Package (TSOP II), 400 mil width, with standard lead pitch and JEDEC-compliant footprint for automated assembly and thermal reliability in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address inputs | 19-bit address bus supporting full 512K-word addressing; no internal multiplexing required |
| I/O0–I/O7 | Bidirectional data lines | Byte-wide data path; high-impedance when CE or OE is inactive for shared bus operation |
| CE | Chip Enable | Active-low global enable; drives device into ISB2 standby mode when HIGH under CMOS conditions |
| OE | Output Enable | Active-low control for read data output; decouples I/O drivers without affecting internal memory state |
| WE | Write Enable | Active-low signal qualifying write cycles; latches data on rising edge of WE when CE and OE are asserted |
| VCC, VSS | Power supply pins | Dual VCC/VSS pair (pins 11/12 and 33/34) reduces IR drop and improves noise immunity in high-speed operation |
| NC | No-connect terminals | Pins 1, 21–24, 44 are unconnected internally - must be left floating or tied to GND per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns access time at 3.0 V | Enables zero-wait-state operation with ARM Cortex-M4/M7 and similar 100 MHz+ MCUs |
| 6 mA ISB2 standby current | Reduces system-level quiescent power by >85% versus standard 3.3 V SRAMs in sleep mode |
| 1.0 V data retention | Preserves critical configuration or sensor history during extended power loss down to 1.0 V rail |
| TTL-compatible I/Os | Direct connection to FPGA I/O banks, microcontroller GPIOs, or ASIC interfaces without level shifters |
| 44-pin TSOP II package | Standardized footprint with 0.8 mm pitch supports high-volume SMT assembly and rework-friendly repair |
Applications
| Industrial PLC Data Buffer | Medical Sensor Acquisition Module |
|---|---|
Use Scenario: Storing real-time I/O scan data and ladder logic variables in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: Asynchronous byte-wide memory buffer interfaced directly to a 32-bit RISC CPU's external bus controller. Use Value: 10 ns tAA ensures sub-microsecond memory access latency, meeting <1 µs I/O update deadlines in safety-critical motion control loops. | Use Scenario: Capturing high-fidelity analog sensor streams (ECG, SpO₂) in portable diagnostic devices with intermittent power. IC Role / Device Role / Timing Role: High-reliability data scratchpad holding raw samples prior to DSP processing or wireless transmission. Use Value: 1.0 V data retention preserves last 30 seconds of waveform data during battery swap or low-voltage shutdown events. |
| Automotive Telematics Gateway | Test & Measurement Equipment FIFO |
Use Scenario: Caching CAN FD message payloads and GPS position logs in vehicle-to-cloud communication modules operating across wide temperature ranges. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing nonvolatile shadow storage for critical telemetry before flash write cycles. Use Value: –40 °C to +85 °C operation and 6 mA ISB2 ensure reliable buffering during engine-off parking mode with minimal battery drain. | Use Scenario: Acting as a deep FIFO buffer between high-speed ADC front-ends and slower host processors in oscilloscopes and spectrum analyzers. IC Role / Device Role / Timing Role: Asynchronous memory stage absorbing burst sampling rates up to 100 MSPS while smoothing data flow to USB/FPGA interfaces. Use Value: TTL-compatible I/Os and 44-pin TSOP II footprint simplify interposer-based signal integrity optimization for >50 MHz data capture paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV5128AL-10TLI | Same density and speed (10 ns), but single 3.3 V supply only (3.0–3.6 V); no 2.2 V min support | Lacks low-voltage headroom for partial brown-out tolerance; no 1.0 V data retention spec | Select when strict 3.3 V rail stability is guaranteed and retention margin is not required |
| AS6C4008-10TIN | 10 ns speed, 3.3 V only, higher ISB2 (15 mA typical); no industrial temp grade option | Not rated for –40 °C operation; unsuitable for automotive or outdoor industrial use | Choose for commercial-temp consumer electronics where cost is prioritized over thermal robustness |
Compared with IS61LV5128AL-10TLI and AS6C4008-10TIN, CY7C1049GN30-10VXI uniquely supports 2.2 V–3.6 V operation with 1.0 V data retention and industrial temperature rating - making it the only option for designs requiring guaranteed functionality during voltage sag or extended cold storage.
Availability
CY7C1049GN30-10VXI is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical sensor acquisition modules, automotive telematics gateways, and test & measurement equipment requiring stable component supply across long production lifecycles.
Supply support for CY7C1049GN30-10VXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
CY7C1049GN30-10VXI belongs to Infineon's legacy Cypress SRAM portfolio, engineered for high-speed, low-power, and thermally robust memory interfacing in mission-critical embedded systems where timing predictability and data integrity are non-negotiable.
FAQ
Is CY7C1049GN30-10VXI pin-compatible with earlier CY7C1049 series variants?
Yes - CY7C1049GN30-10VXI shares identical 44-pin TSOP II pinout and signal definitions with CY7C1049GN-10VXI and CY7C1049DV-10VXI. The '30' suffix denotes the 2.2 V–3.6 V VCC range variant, and all share A0–A18, I/O0–I/O7, CE, OE, and WE assignments. No PCB redesign is needed for migration within the same package type.
Does this SRAM require an external clock or refresh circuitry?
No - CY7C1049GN30-10VXI is a fully static RAM with no clock input and zero refresh requirement. Data remains valid indefinitely as long as VCC is maintained above 1.0 V and CE is held LOW during active access. Its asynchronous control architecture eliminates timing constraints associated with DRAM or pseudo-SRAM.
What is the maximum supported operating frequency for continuous random access?
The device supports sustained random access at up to 100 MHz (10 ns cycle time), validated by ICC = 38 mA typical at f = 100 MHz in the datasheet. This assumes proper PCB layout with matched trace lengths, controlled impedance, and adequate decoupling - no derating is required for industrial temperature operation.
Can NC pins be safely tied to ground or left floating in layout?
Per the datasheet, NC pins (1, 21–24, 44) are not connected internally and may be left floating. However, Infineon recommends tying them to GND in high-noise environments to reduce parasitic coupling. Do not connect NC pins to VCC or drive them actively - doing so violates absolute maximum ratings and risks latch-up.
CY7C1049GN30-10VXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 36-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-SOJ
CY7C1049GN30-10VXI FAQ
1.How can I place an order for CY7C1049GN30-10VXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1049GN30-10VXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1049GN30-10VXI reliable?
The price and inventory of CY7C1049GN30-10VXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1049GN30-10VXI is usually 5 days.
3.What payment methods are accepted for CY7C1049GN30-10VXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1049GN30-10VXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1049GN30-10VXI?
CY7C1049GN30-10VXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1049GN30-10VXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1049GN30-10VXI?
For technical support, including CY7C1049GN30-10VXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1049GN30-10VXI requirements.
6.How does Aetrix verify that CY7C1049GN30-10VXI is sourced from the original manufacturer or authorized distributors?
All CY7C1049GN30-10VXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1049GN30-10VXI meets industry standards.
7.What is the process for return or replacement of CY7C1049GN30-10VXI?
All CY7C1049GN30-10VXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1049GN30-10VXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1049GN30-10VXI part is unused and in its original packaging.
Return procedure for CY7C1049GN30-10VXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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