Infineon Technologies CY7C1051DV33-10ZSXI
- Part No.:
- CY7C1051DV33-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1051DV33-10ZSXI.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,209
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1051DV33-10ZSXI from Infineon Technologies (formerly Cypress) is a 8-Mbit (512 K × 16) high-speed CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V supply, and industrial temperature range (–40 °C to +85 °C). It features TTL-compatible I/Os, automatic CE power-down, byte-wide write control via BHE/ BLE, and supports memory expansion in embedded controllers and real-time data buffering systems.
For engineers reviewing the CY7C1051DV33-10ZSXI datasheet, CY7C1051DV33-10ZSXI pinout, CY7C1051DV33-10ZSXI application, or CY7C1051DV33-10ZSXI equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 20 µA CMOS standby current, dual-byte enable architecture, and FBGA/TSOP II package compatibility for space-constrained PCB layouts.
Technical Context
The device implements a synchronous, non-volatile-retentive SRAM array organized as 512 K words × 16 bits, with independent byte-enable control (BHE for I/O8–I/O15, BLE for I/O0–I/O7) enabling partial-word writes without read-modify-write cycles. Address decoding uses full 19-bit addressing (A0–A18) with no internal multiplexing.
It operates in three power states: active (ICC = 110 mA at 100 MHz), automatic CE-controlled power-down (ISB1 = 40 mA), and ultra-low CMOS standby (ISB2 = 20 µA). Data retention is guaranteed at VCC = 2.0 V, supporting low-power hold modes during system sleep.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 8 Mbit (512 K × 16); provides 1 MB of fast, random-access storage for firmware caching or buffer memory. |
| Access time (tAA) | 10 ns; enables direct interfacing with 100 MHz microcontrollers without wait states. |
| VCC supply | 3.3 V ±0.3 V; compatible with standard LVTTL and LVCMOS logic families. |
| Operating temperature | –40 °C to +85 °C; qualified for industrial-grade embedded systems and communications equipment. |
| Standby current (ISB2) | 20 µA; allows battery-backed operation or deep-sleep retention in portable instrumentation. |
| Data retention voltage | 2.0 V minimum; supports low-power hold mode while preserving memory contents during brownout. |
| I/O interface | TTL-compatible inputs/outputs; eliminates level-shifter requirements in mixed-voltage designs. |
Pinout & Package
Package: 44-pin TSOP II (Type II) with center power/ground pinout - pin-compatible with JEDEC MO-141AC standard. Pin count and layout match industry-standard SRAM footprints for drop-in replacement in legacy designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address inputs | 19-bit address bus supporting full 512 K-word addressing; no multiplexing required. |
| I/O0–I/O7 | Data bus (low byte) | Bi-directional 8-bit data path enabled when BLE = LOW; high-impedance when deselected or during write. |
| I/O8–I/O15 | Data bus (high byte) | Bi-directional 8-bit data path enabled when BHE = LOW; independent control enables byte-select writes. |
| CE | Chip Enable | Active-LOW global enable; forces automatic power-down when HIGH, reducing ICC to ISB2 level. |
| OE | Output Enable | Active-LOW read strobe; controls output drivers only - does not affect internal power state. |
| WE | Write Enable | Active-LOW write strobe; combined with CE determines write cycle initiation and termination. |
| BLE / BHE | Byte Low/High Enable | Independent active-LOW enables for low/high byte; enables true 8-bit partial writes without masking logic. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-byte write control | Separate BHE and BLE pins allow independent 8-bit writes to upper/lower data bytes - eliminates need for external byte-mask logic. |
| Automatic CE power-down | Device enters low-current ISB2 mode (20 µA) automatically when CE is HIGH - no software or external control required. |
| TTL-compatible I/O | VIH = 2.0 V min, VOL = 0.4 V max at 8 mA - interoperates directly with 3.3 V microcontrollers and FPGAs without level translation. |
| 2.0 V data retention | Retains stored data down to VCC = 2.0 V - supports graceful shutdown and battery-backed hold in power-loss scenarios. |
| High-speed 10 ns access | tAA = 10 ns at 3.3 V - matches timing budgets of ARM Cortex-M4/M7 and RISC-V SoCs running at 100+ MHz. |
Applications
| Industrial PLC Data Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Real-time acquisition of sensor data streams in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer between ADC interface and CPU bus - absorbs burst data without DMA overhead. Use Value: 10 ns tAA ensures zero-wait-state reads/writes at 100 MHz bus clock; byte-enable support enables efficient 16-bit register mapping. |
Use Scenario: Temporary storage of uncompressed grayscale image frames (e.g., ultrasound or endoscopy) before compression or display. IC Role / Device Role / Timing Role: Dual-port-capable frame buffer holding one full 1024×768×16-bit frame (1.5 MB) across two interleaved CY7C1051DV33 devices. Use Value: 512 K × 16 organization matches common pixel packing formats; ISB2 = 20 µA enables safe retention during idle scan intervals. |
| Avionics Display Controller | Test Equipment Pattern Memory |
|
Use Scenario: Rendering of HUD (Head-Up Display) graphics in certified flight deck systems requiring EMI-resilient, predictable timing. IC Role / Device Role / Timing Role: Dedicated video memory for FPGA-based graphics pipeline - synchronized to pixel clock via CE/OE timing control. Use Value: TSOP II package offers superior thermal performance vs. SOIC in convection-cooled avionics enclosures; –40 °C to +85 °C rating meets DO-160 Section 22 requirements. |
Use Scenario: Storage of digital stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: High-reliability pattern memory accessed by high-speed pattern generator ASIC - requires deterministic tAA and tRC. Use Value: 10 ns access time guarantees sub-cycle pattern delivery at 100 MHz vector rate; 44-pin TSOP II footprint enables dense, low-inductance PCB routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV51216AL-10MLI | Same density (512 K × 16), 10 ns access, but uses 3.3 V core with 2.5 V I/O tolerance; ISB2 = 25 µA. | Requires external VCCIO regulation if interfacing with pure 3.3 V systems; slightly higher standby draw. | Select when migrating to ISSI's long-term supply program or consolidating vendor footprint. |
| Winbond W9825G6JH-10 | SDRAM (not SRAM); 32 Mbit, 10 ns tAA only in burst mode; requires refresh controller and initialization sequence. | Not pin-compatible; incompatible timing model - unsuitable for direct replacement in SRAM-based designs. | Consider only for new designs where burst bandwidth > 200 MB/s justifies added controller complexity. |
Compared with IS61LV51216AL-10MLI, CY7C1051DV33-10ZSXI offers tighter ISB2 (20 µA vs. 25 µA) and native TTL compatibility, while W9825G6JH-10 introduces SDRAM protocol overhead and refresh dependency - making it unsuitable for deterministic real-time buffering.
Availability
CY7C1051DV33-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging frame storage, and avionics display controllers requiring stable component supply across multi-year production cycles.
Supply support for CY7C1051DV33-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its broad portfolio of memory, microcontroller, and analog products with full technical and supply chain continuity.
This device belongs to Cypress' legacy parallel SRAM product line, designed specifically for high-reliability, low-latency data buffering in industrial automation, medical instrumentation, and aerospace systems where asynchronous access and deterministic timing are critical.
FAQ
Is CY7C1051DV33-10ZSXI pin-compatible with older CY7C1051D variants?
Yes - the -10ZSXI variant retains identical 44-pin TSOP II pinout and electrical characteristics as earlier CY7C1051D speed grades. The 'ZSXI' suffix denotes industrial temperature grade (–40 °C to +85 °C) and Pb-free packaging, with no functional or mechanical changes affecting board-level compatibility.
Does this SRAM require an external clock signal?
No - CY7C1051DV33-10ZSXI is an asynchronous static RAM. All operations are controlled by edge- or level-sensitive control signals (CE, OE, WE, BHE, BLE); no clock input is present or required. Timing is governed solely by setup/hold and access specifications in the datasheet.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes - asserting both BHE and BLE LOW enables concurrent access to I/O0–I/O15, allowing full 16-bit writes in a single cycle. This configuration matches standard 16-bit bus interfaces and avoids the latency penalty of sequential byte writes.
What is the maximum supported bus frequency when using CE-controlled read cycles?
With tRC = 10 ns minimum read cycle time, the theoretical maximum sustained bus frequency is 100 MHz. However, practical throughput depends on CE assertion timing and address stability - real-world implementations typically achieve 80–90 MHz with proper PCB layout and signal integrity.
CY7C1051DV33-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1051DV33-10ZSXI FAQ
1.How can I place an order for CY7C1051DV33-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1051DV33-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1051DV33-10ZSXI reliable?
The price and inventory of CY7C1051DV33-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051DV33-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1051DV33-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051DV33-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1051DV33-10ZSXI?
CY7C1051DV33-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1051DV33-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1051DV33-10ZSXI?
For technical support, including CY7C1051DV33-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051DV33-10ZSXI requirements.
6.How does Aetrix verify that CY7C1051DV33-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1051DV33-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051DV33-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1051DV33-10ZSXI?
All CY7C1051DV33-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051DV33-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1051DV33-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1051DV33-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1051DV33-10ZSXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

