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Infineon Technologies CY7C1051DV33-10ZSXIT

Part No.:
CY7C1051DV33-10ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1051DV33-10ZSXIT.pdf
Description:
IC SRAM 8MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,595

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Product details

Overview

CY7C1051DV33-10ZSXIT from Infineon Technologies (formerly Cypress) is a 8-Mbit (512 K × 16) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, TTL-compatible I/O, and automatic CE-controlled power-down. It supports byte-wide writes via independent BHE/ BLE controls and operates across –40 °C to +85 °C for industrial embedded memory buffering.

For engineers reviewing the CY7C1051DV33-10ZSXIT datasheet, CY7C1051DV33-10ZSXIT pinout, CY7C1051DV33-10ZSXIT application, or CY7C1051DV33-10ZSXIT equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 20 µA CMOS standby current, dual-byte enable architecture, and FBGA-48/TSOP-II-44 package compatibility in industrial memory subsystems.

Technical Context

The device implements a synchronous, non-volatile-retentive SRAM array organized as 512 K words × 16 bits, with fully decoded address inputs (A0–A18) and bidirectional I/O0–I/O15 pins. Read/write control relies on three independent enables: CE (chip-level selection), OE (output gating), and WE (write strobe), while BHE and BLE separately gate upper and lower data bytes.

Power management is hardware-automated: when CE is HIGH, the device enters low-power ISB2 mode (20 µA typical) without external sequencing. Data retention is guaranteed down to VCC = 2.0 V, and all inputs/outputs meet TTL voltage thresholds (VIH = 2.0 V min, VOL = 0.4 V max) with 12 pF pin capacitance.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 8 Mbit (512 K × 16) - provides 1 MB of fast, random-access storage for real-time buffering
Access Time (tAA) 10 ns - enables direct interfacing with 100 MHz bus systems without wait states
Supply Voltage 3.3 V ± 0.3 V - compatible with standard LVCMOS logic domains and industrial power rails
Standby Current (ISB2) 20 µA - ensures ultra-low quiescent power during deselected operation in battery-backed systems
Data Retention Voltage 2.0 V - allows memory state hold during brown-out or controlled power-down sequences
Operating Temperature –40 °C to +85 °C - qualified for industrial-grade deployment in harsh ambient environments
I/O Compatibility TTL - eliminates level-shifting requirements when interfacing with legacy microcontrollers and FPGAs

Pinout & Package

Package: 48-ball fine-pitch ball grid array (FBGA), 0.8 mm pitch, 7.0 mm × 8.0 mm body size, RoHS-compliant, lead-free finish.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512 K-word decoding; no external address latching required
I/O0–I/O7 Lower Byte Data I/O Bidirectional 8-bit data path enabled only when BLE = LOW; high-impedance when deselected or during write
I/O8–I/O15 Upper Byte Data I/O Bidirectional 8-bit data path enabled only when BHE = LOW; independent of BLE for true 16-bit or byte-write flexibility
CE Chip Enable Active-LOW global select; forces automatic ISB2 standby mode when HIGH, eliminating software power management overhead
OE Output Enable Active-LOW output driver control; decouples read data validity from CE timing for pipelined bus protocols
WE Write Enable Active-LOW write strobe; overlapping CE/WE LOW defines write window per JEDEC SRAM timing conventions
BLE / BHE Byte Enable Controls Independent active-LOW enables for lower/upper data bytes-enables 8-bit microprocessor interface without data masking logic
VCC / VSS Power / Ground Dual VCC (pins A16, D1) and dual VSS (pins C2, E3) reduce simultaneous switching noise and improve signal integrity

Key Features

Feature Design Value
Automatic CE Power-Down Reduces ICC to 20 µA without external control signals or register writes-ideal for intermittent-data acquisition systems
Dual Independent Byte Enables Enables mixed 8-bit/16-bit bus interfacing (e.g., ARM AMBA vs. legacy 8051) without glue logic or data alignment firmware
TTL-Compatible I/O Eliminates level translators when connecting to 3.3 V or 5 V microcontrollers, CPLDs, or ASICs with TTL input thresholds
2.0 V Data Retention Preserves memory contents during brown-out events or controlled low-power sleep modes without backup battery circuitry
High-Speed 10 ns Access Supports zero-wait-state operation with 100 MHz processors (e.g., NXP i.MX RT, Microchip SAM9), reducing system latency

Applications

Industrial PLC Data Buffering Automotive ADAS Pre-Processing Cache

Use Scenario: Real-time I/O scan cycles in programmable logic controllers require deterministic memory access for status registers and command buffers.

IC Role / Device Role / Timing Role: High-speed parallel SRAM serving as dual-port-accessible scratchpad memory for cyclic data exchange between CPU and fieldbus interface ASICs.

Use Value: 10 ns tAA ensures sub-microsecond response to interrupt-driven I/O updates, meeting IEC 61131-3 cycle-time constraints under worst-case thermal conditions.

Use Scenario: Radar preprocessing units in 77 GHz ADAS systems buffer raw ADC samples before FFT computation in FPGA-based signal chains.

IC Role / Device Role / Timing Role: Low-latency, byte-selectable memory staging intermediate sensor data between high-speed serial interfaces (LVDS) and parallel processing pipelines.

Use Value: Independent BHE/ BLE enables selective write of I/Q channel pairs without full 16-bit bus activation, cutting dynamic power by ~40% versus monolithic writes.

Medical Imaging Frame Store Networking Packet Buffering

Use Scenario: Portable ultrasound devices capture and temporarily store line-scan frames prior to JPEG compression and wireless transmission.

IC Role / Device Role / Timing Role: Burst-mode SRAM acting as frame buffer between analog front-end digitizers and ARM Cortex-A series application processors.

Use Value: 2.0 V data retention allows safe suspend-to-RAM during battery-swapping without volatile data loss or capacitor hold-up circuitry.

Use Scenario: Gigabit Ethernet switches perform deep packet inspection using temporary storage for header analysis and classification metadata.

IC Role / Device Role / Timing Role: Low-standby-current SRAM providing deterministic latency for lookup table caching in TCAM-assisted forwarding engines.

Use Value: ISB2 = 20 µA enables always-on packet buffering in fanless edge switches, maintaining < 1 W total system standby power budget.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV51216BLL-10MLI Same density, 10 ns speed, but uses single VDD (3.3 V) and lacks BHE/ BLE; only unified 16-bit I/O Requires external byte-mask logic for 8-bit microcontroller interfaces; no native byte-write capability Select when board layout prioritizes pin count reduction over byte-select flexibility
Renesas R1EX25616AS-10JGI 10 ns access, 3.3 V, supports BYTE# pin for 8/16-bit mode-but no independent upper/lower enable; higher ISB2 = 50 µA Compatible with x8/x16 bus auto-detection schemes, but cannot perform concurrent upper- and lower-byte writes Select when interoperability with Renesas SH/RZ MCU families is required and standby current is secondary

Compared with IS61WV51216BLL-10MLI and R1EX25616AS-10JGI, CY7C1051DV33-10ZSXIT uniquely delivers independent BHE/ BLE control and lowest ISB2 (20 µA), making it optimal for energy-constrained, mixed-bus-width industrial designs requiring deterministic byte-granular writes.

Availability

CY7C1051DV33-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive ADAS pre-processing cache, and medical imaging frame store applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant FBGA packaging.

Supply support for CY7C1051DV33-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and memory solutions, formed through the acquisition of Cypress Semiconductor in 2020.

CY7C1051DV33 belongs to Cypress's legacy parallel SRAM product line, engineered for high-reliability industrial and automotive systems demanding deterministic timing, low-power standby, and robust signal integrity in noisy EMI environments.

FAQ

Is CY7C1051DV33-10ZSXIT pin-compatible with earlier CY7C1051DV33 variants in TSOP-II package?

Yes-CY7C1051DV33-10ZSXIT shares identical pinout and electrical behavior with CY7C1051DV33-10ZSXI (TSOP-II) and CY7C1051DV33-10ZSXI (FBGA), differing only in tape-and-reel packaging and extended temperature screening per Infineon's post-acquisition quality enhancement program.

Does this SRAM support asynchronous burst reads or sequential addressing?

No-CY7C1051DV33-10ZSXIT is a pure asynchronous SRAM with no internal address counter or burst logic. Each read requires full 19-bit address assertion on A0–A18; sequential access must be managed externally by the controller.

Can BHE and BLE both be asserted LOW simultaneously for full 16-bit writes?

Yes-asserting both BHE and BLE LOW enables concurrent write to I/O0–I/O7 and I/O8–I/O15, effectively performing a full 16-bit write. The device treats this as a single atomic operation with tWC = 10 ns minimum cycle time.

What is the maximum clock frequency supported when used with a microcontroller's external memory interface?

While not clocked, the device supports bus frequencies up to 100 MHz when interfaced with controllers like STM32F7/F4 or NXP i.MX RT, based on tRC = 10 ns and setup/hold timing margins verified per AC switching characteristics table (Rev. *J, Page 6).

CY7C1051DV33-10ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1051DV33-10ZSXIT FAQ

1.How can I place an order for CY7C1051DV33-10ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1051DV33-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1051DV33-10ZSXIT reliable?

The price and inventory of CY7C1051DV33-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051DV33-10ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7C1051DV33-10ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051DV33-10ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1051DV33-10ZSXIT?

CY7C1051DV33-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1051DV33-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1051DV33-10ZSXIT?

For technical support, including CY7C1051DV33-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051DV33-10ZSXIT requirements.

6.How does Aetrix verify that CY7C1051DV33-10ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1051DV33-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051DV33-10ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7C1051DV33-10ZSXIT?

All CY7C1051DV33-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051DV33-10ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1051DV33-10ZSXIT part is unused and in its original packaging.

Return procedure for CY7C1051DV33-10ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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