Infineon Technologies CY7C1051DV33-12BAXIT
- Part No.:
- CY7C1051DV33-12BAXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
CY7C1051DV33-12BAXIT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,993
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Product details
Overview
CY7C1051DV33-12BAXIT from Cypress Semiconductor is an 8-Mbit (512 K × 16) high-speed CMOS static RAM with 12 ns access time, 3.3 V supply, and industrial temperature range (–40 °C to +85 °C). It supports byte-wide writes via independent BHE/ BLE controls, features automatic CE power-down (ISB2 = 20 mA), TTL-compatible I/O, and is packaged in a Pb-free 48-ball FBGA.
For engineers reviewing the CY7C1051DV33-12BAXIT datasheet, CY7C1051DV33-12BAXIT pinout, CY7C1051DV33-12BAXIT application, or CY7C1051DV33-12BAXIT equivalent, key selection criteria include tAA = 12 ns read timing, dual-byte enable architecture, low-power standby modes, and compatibility with 3.3 V memory bus systems requiring deterministic access latency and data retention at 2.0 V.
Technical Context
The CY7C1051DV33-12BAXIT implements a synchronous, non-volatile-retentive SRAM array organized as 512 K words × 16 bits, using full CMOS circuitry for low power and high noise immunity. Its control logic decodes CE, OE, WE, BHE, and BLE to enable independent high- and low-byte write operations and tri-state output control.
It operates within strict DC and AC timing windows: tRC = 12 ns, tDOE = 6 ns, tHZOE = 6 ns, and supports automatic transition to ISB2 standby mode (20 mA) when CE is deasserted, with guaranteed data retention down to VCC = 2.0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512 K × 16) - supports 16-bit parallel data bus without external width expansion |
| Access Time (tAA) | 12 ns - guarantees valid data on I/O pins within 12 ns of stable address and CE/OE assertion |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and LVCMOS 3.3 V system rails |
| Operating Current (ICC) | 100 mA at f = 100 MHz - defines peak dynamic power draw during continuous read/write cycling |
| Standby Current (ISB2) | 20 mA - maximum current drawn when CE is HIGH and all inputs held at CMOS logic levels |
| Data Retention Voltage | 2.0 V - enables low-power hold mode with full data integrity during brown-out or sleep states |
| Input/Output Compatibility | TTL-compatible - ensures direct interfacing with legacy 5 V-tolerant controllers without level-shifting |
Pinout & Package
Package: 48-ball fine-pitch ball grid array (FBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.5 mm pitch, center power/ground layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512 K-word decoding (A0–A18 required, no internal multiplexing) |
| I/O0–I/O7 | Low-Byte Data I/O | Bidirectional 8-bit data path enabled only when BLE = LOW; high-impedance otherwise |
| I/O8–I/O15 | High-Byte Data I/O | Bidirectional 8-bit data path enabled only when BHE = LOW; independent of BLE state |
| CE | Chip Enable | Primary device select; forces automatic power-down (ISB2) when HIGH and disables all outputs |
| OE | Output Enable | Controls output drivers only; must be LOW with CE LOW for read access; does not affect write path |
| WE | Write Enable | Active-LOW signal initiating write cycle; combined with CE LOW to define write window |
| BLE / BHE | Byte Low/High Enable | Independent gating signals for low/high byte writes; allow partial-word updates without read-modify-write |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Byte Write Control | Separate BHE and BLE inputs enable atomic 8-bit updates to upper or lower byte without disturbing adjacent data |
| Automatic CE Power-Down | Reduces ICC to 20 mA (ISB2) when CE is deasserted, eliminating need for external power-gating logic |
| 2.0-V Data Retention | Maintains stored contents during VCC brownout or suspend-to-RAM states without backup battery or capacitor |
| TTL-Compatible I/O | Accepts 5 V-tolerant input levels and drives LVTTL loads directly, easing integration with mixed-voltage SoCs |
| High-Speed 12 ns Access | Meets timing requirements for real-time DSP buffers, FPGA configuration RAM, and video frame stores |
Applications
| Industrial PLC Data Buffer | FPGA Configuration Memory |
|---|---|
Use Scenario: Storing real-time I/O scan data and ladder logic state variables in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: High-reliability, low-latency SRAM serving as primary working memory for cyclic executive firmware. Use Value: 12 ns tAA ensures sub-microsecond response to fieldbus interrupts; ISB2 < 20 mA reduces thermal load in sealed enclosures. | Use Scenario: Holding configuration bitstreams for Xilinx Spartan or Intel Cyclone FPGAs during power-up and dynamic reconfiguration. IC Role / Device Role / Timing Role: Non-volatile-retentive parallel SRAM providing fast, glitch-free bitstream loading into FPGA configuration registers. Use Value: 2.0 V data retention allows safe suspend/resume; TTL-compatible I/O eliminates level shifters in 3.3 V FPGA power domains. |
| Digital Signal Processor Cache | Medical Imaging Frame Buffer |
Use Scenario: Acting as L1/L2 cache extension for TI C6000 or Analog Devices SHARC processors executing real-time filtering algorithms. IC Role / Device Role / Timing Role: Low-latency, wide-bus SRAM minimizing pipeline stalls during FFT or FIR kernel execution. Use Value: 512 K × 16 organization matches typical DSP word width; tDOE = 6 ns enables back-to-back reads at 100 MHz bus rates. | Use Scenario: Buffering uncompressed 12-bit grayscale frames (e.g., 1024 × 1024) in ultrasound or endoscopy systems before compression or display. IC Role / Device Role / Timing Role: High-bandwidth parallel memory delivering pixel data to video DACs or GPU interfaces without DMA bottlenecks. Use Value: Dual-byte enables simultaneous write of even/odd pixel pairs; FBGA package supports dense PCB layouts near image sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C35128P-12TIN | 512 K × 16, 12 ns, 3.3 V, TSOP II only - lacks FBGA option and BHE/ BLE byte control | Requires external byte masking logic for partial writes; limited to surface-mount space-constrained designs | Select when FBGA is unnecessary and cost sensitivity outweighs flexibility in write granularity |
| IS61LV51216-12ML | 512 K × 16, 12 ns, 3.3 V, 44-pin TSOP II - no BHE/ BLE; single OE/ WE control | Supports full-word writes only; higher tHZOE (10 ns) limits burst read throughput vs. CY7C1051DV33-12BAXIT's 6 ns | Choose for legacy board redesigns where pinout compatibility with older ISSI devices is mandatory |
Compared with AS7C35128P-12TIN and IS61LV51216-12ML, the CY7C1051DV33-12BAXIT provides unique dual-byte enable architecture and FBGA packaging, enabling higher-density layouts and atomic half-word writes-critical for real-time control and FPGA configuration where bus efficiency and thermal management are prioritized.
Availability
CY7C1051DV33-12BAXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration memory, and medical imaging frame buffering requiring stable component supply across extended product lifecycles.
Supply support for CY7C1051DV33-12BAXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer applications.
The CY7C1051DV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic latency, low-power standby, and seamless integration into 3.3 V embedded systems with demanding real-time memory bandwidth needs.
FAQ
What is the minimum VCC required to retain data in CY7C1051DV33-12BAXIT?
The device guarantees full data retention at VCC = 2.0 V under specified conditions (CE > VCC – 0.3 V, inputs held at CMOS logic levels). This allows operation in low-power suspend modes without external backup power sources. Retention is not guaranteed below 2.0 V, and no data loss occurs during controlled ramp-down to this threshold per the tCDR specification.
Does CY7C1051DV33-12BAXIT support true 16-bit concurrent read/write operations?
No - it supports 16-bit-wide data bus access but performs byte-level writes independently via BHE and BLE. A full 16-bit write requires both signals asserted LOW simultaneously. Reads always present all 16 bits when CE and OE are active, regardless of BHE/ BLE state. The architecture enables selective byte updates without read-modify-write cycles.
Can CY7C1051DV33-12BAXIT be used with a 5 V microcontroller interface?
Yes - its inputs are TTL-compatible (VIH up to VCC + 0.3 V, VIL down to –0.3 V), allowing direct connection to 5 V logic outputs. However, its outputs swing only to 3.3 V levels and must not drive 5 V-tolerant inputs requiring >3.5 V HIGH thresholds without external level translation.
Is the 48-ball FBGA package of CY7C1051DV33-12BAXIT lead-free and RoHS compliant?
Yes - the "XIT" suffix denotes a Pb-free, RoHS-compliant 48-ball FBGA package with NiPdAu surface finish. Thermal resistance values (θJA = 28.31 °C/W) and solder reflow profile data are documented in the official Cypress package diagram DS001-00063 Rev. *J, page 12.
CY7C1051DV33-12BAXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (6x8)
CY7C1051DV33-12BAXIT FAQ
1.How can I place an order for CY7C1051DV33-12BAXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1051DV33-12BAXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1051DV33-12BAXIT reliable?
The price and inventory of CY7C1051DV33-12BAXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051DV33-12BAXIT is usually 5 days.
3.What payment methods are accepted for CY7C1051DV33-12BAXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051DV33-12BAXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1051DV33-12BAXIT?
CY7C1051DV33-12BAXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1051DV33-12BAXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1051DV33-12BAXIT?
For technical support, including CY7C1051DV33-12BAXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051DV33-12BAXIT requirements.
6.How does Aetrix verify that CY7C1051DV33-12BAXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1051DV33-12BAXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051DV33-12BAXIT meets industry standards.
7.What is the process for return or replacement of CY7C1051DV33-12BAXIT?
All CY7C1051DV33-12BAXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051DV33-12BAXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1051DV33-12BAXIT part is unused and in its original packaging.
Return procedure for CY7C1051DV33-12BAXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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