Infineon Technologies CY7C1051DV33-12ZSXIT
- Part No.:
- CY7C1051DV33-12ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1051DV33-12ZSXIT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,817
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Product details
Overview
CY7C1051DV33-12ZSXIT from Infineon Technologies (formerly Cypress) is a 8-Mbit (512 K × 16) high-speed CMOS static RAM with 12 ns access time, 3.3 V supply, and industrial temperature range (–40 °C to +85 °C). It features TTL-compatible I/Os, automatic CE power-down, byte-wide write control via BHE/ BLE, and dual-package support (48-ball FBGA & 44-pin TSOP II). Used in real-time data buffering for industrial controllers and network packet memory.
For engineers reviewing the CY7C1051DV33-12ZSXIT datasheet, CY7C1051DV33-12ZSXIT pinout, CY7C1051DV33-12ZSXIT application, or CY7C1051DV33-12ZSXIT equivalent, key selection criteria include tAA = 12 ns read timing, ISB2 = 20 µA CMOS standby current, byte-select capability, and 3.3 V single-supply operation with 2.0 V data retention.
Technical Context
This SRAM implements a synchronous, non-volatile-retentive memory array organized as 512 K words × 16 bits, with independent byte enable (BHE/BLE) for selective 8-bit writes. Its logic-level compatibility with TTL ensures seamless integration into legacy 3.3 V bus systems without level-shifting.
The device uses automatic CE-driven power-down to reduce ISB2 to 20 µA when deselected, and supports three distinct low-power states: active (ICC = 100 mA @ 100 MHz), standby (ISB1 = 35 mA with TTL inputs), and data retention (VCC = 2.0 V, ICCDR ≤ 20 mA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 8 Mbit (512 K × 16) - provides 1 MB of fast random-access storage for burst-mode data capture |
| Access Time (tAA) | 12 ns - enables direct interfacing with 83 MHz microcontrollers without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVCMOS I/O domains and eliminates need for dual-rail supplies |
| Standby Current (ISB2) | 20 µA - allows battery-backed operation during system sleep modes |
| Data Retention Voltage | 2.0 V - maintains stored contents during brown-out conditions down to 2.0 V VCC |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial automation and outdoor embedded equipment |
| Package Options | 48-ball FBGA (9 mm × 8 mm) and 44-pin TSOP II - supports both space-constrained and wave-solderable PCB layouts |
Pinout & Package
The CY7C1051DV33-12ZSXIT is packaged in a RoHS-compliant 48-ball fine-pitch ball grid array (FBGA) with 0.8 mm pitch and 9 mm × 8 mm body size. Pinout follows JEDEC MO-246AC standard with center power/ground distribution.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512 K-word decoding; A18 is MSB |
| I/O0–I/O7 | Data Bus (Lower Byte) | Bi-directional 8-bit data path enabled by BLE = LOW during read/write |
| I/O8–I/O15 | Data Bus (Upper Byte) | Bi-directional 8-bit data path enabled by BHE = LOW during read/write |
| CE | Chip Enable | Active-LOW global select; forces device into automatic power-down when HIGH |
| OE | Output Enable | Active-LOW read strobe; controls output buffer enable independently of CE |
| WE | Write Enable | Active-LOW write strobe; initiates write cycle when CE and WE both LOW |
| BLE / BHE | Byte Enable Controls | Independent active-LOW enables for lower/upper data bytes; enables 8-bit partial writes |
| VCC / VSS | Power / Ground | Dual VCC (pins A1, D1, F1, G1) and dual VSS (pins B1, E1, H1, C2) reduce IR drop and noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Byte-select write architecture | Enables 8-bit writes without masking or read-modify-write cycles, reducing bus traffic in mixed-data-width systems |
| Automatic CE power-down | Reduces standby current to 20 µA without external control logic or mode registers |
| TTL-compatible I/O levels | Accepts 0.8 V / 2.0 V input thresholds and drives 0.4 V / 2.4 V outputs - interoperable with legacy 3.3 V ASICs and FPGAs |
| 2.0 V data retention | Maintains valid memory contents during undervoltage events, enabling graceful shutdown and fast resume |
| Dual-package availability | Same logic and timing across 48-ball FBGA and 44-pin TSOP II - simplifies prototyping-to-production migration |
Applications
| Industrial PLC Data Buffering | Network Packet Memory |
|---|---|
Use Scenario: Real-time acquisition of sensor inputs and actuator commands in programmable logic controllers with deterministic scan cycles. IC Role / Device Role: High-speed scratchpad memory for temporary storage of I/O image tables and intermediate calculation results. Use Value: 12 ns tAA ensures sub-microsecond access to update critical control variables without pipeline stalls. | Use Scenario: Temporary storage of Ethernet frame payloads in Layer 2 switches before forwarding or filtering decisions. IC Role / Device Role: Dual-port-capable SRAM used as first-in-first-out (FIFO) buffer between MAC and switching fabric interfaces. Use Value: Byte-enable pins allow partial writes of variable-length frames, minimizing bus contention during back-to-back packet bursts. |
| Medical Imaging Frame Store | Automotive ADAS Preprocessing Buffer |
Use Scenario: Capturing raw pixel data from high-resolution X-ray or ultrasound sensors prior to DSP-based enhancement. IC Role / Device Role: Burst-mode write buffer accepting parallel 16-bit pixel streams at up to 83 MHz clock rate. Use Value: 100 mA ICC at fMAX supports sustained high-bandwidth writes without thermal throttling in sealed enclosures. | Use Scenario: Storing pre-fused sensor fusion outputs (radar + camera) for real-time object tracking in advanced driver assistance systems. IC Role / Device Role: Low-latency working memory for vision processing SoCs requiring deterministic memory access under ASIL-B constraints. Use Value: –40 °C to +85 °C rating and 2.0 V data retention ensure reliable operation during cold cranking and engine bay thermal transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV51216AL-12TQLI | 12 ns tAA, 3.3 V, same 512 K × 16 organization; lacks BHE/ BLE byte enables | Requires external gating or full-word writes; less flexible for partial updates | Select when byte-select functionality is unnecessary and cost-per-bit is prioritized |
| AS6C4008-12ZIN | 12 ns tAA, 3.3 V, 512 K × 16; higher ISB2 = 35 µA and no 2.0 V data retention | Not suitable for brown-out retention or ultra-low-power sleep modes | Select for cost-sensitive consumer applications where extended retention is not required |
Compared with IS61LV51216AL-12TQLI and AS6C4008-12ZIN, the CY7C1051DV33-12ZSXIT uniquely combines byte-select write control, 2.0 V data retention, and 20 µA ISB2 - making it optimal for industrial systems requiring partial updates and fail-safe memory state preservation.
Availability
CY7C1051DV33-12ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet memory, and medical imaging frame store applications requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1051DV33-12ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and automotive qualifications.
The CY7C1051DV33 belongs to Infineon's legacy Cypress SRAM product line, designed specifically for high-reliability, low-latency parallel memory interfacing in industrial control, networking, and medical equipment where deterministic timing and robust power management are critical.
FAQ
Is CY7C1051DV33-12ZSXIT pin-compatible with earlier CY7C1051DV33 speed grades?
Yes - all CY7C1051DV33 variants (–10, –12, –15) share identical pinouts and package footprints across both 44-pin TSOP II and 48-ball FBGA packages. Timing parameters differ, but mechanical and electrical interface compatibility is maintained per Infineon's continuity commitment post-acquisition.
Does this SRAM require an external clock signal?
No - the CY7C1051DV33-12ZSXIT is an asynchronous SRAM. It operates without a clock; data access is controlled solely by CE, OE, WE, and address setup/hold timing. All timing parameters (e.g., tAA = 12 ns) are defined relative to control signal edges, not clock cycles.
Can BHE and BLE be asserted simultaneously for full 16-bit access?
Yes - asserting both BHE and BLE LOW enables concurrent read or write of all 16 data bits (I/O0–I/O15). This configuration matches standard 16-bit bus operations and is explicitly supported in the device's truth table and functional description.
What is the maximum operating frequency supported by the 12 ns speed grade?
The –12 speed grade supports a maximum read cycle time (tRC) of 12 ns, corresponding to a theoretical maximum bus frequency of 83.3 MHz. This assumes proper signal integrity, load capacitance ≤ 30 pF, and input transition times ≤ 3 ns as specified in the AC switching characteristics table.
CY7C1051DV33-12ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1051DV33-12ZSXIT FAQ
1.How can I place an order for CY7C1051DV33-12ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1051DV33-12ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1051DV33-12ZSXIT reliable?
The price and inventory of CY7C1051DV33-12ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051DV33-12ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1051DV33-12ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051DV33-12ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1051DV33-12ZSXIT?
CY7C1051DV33-12ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1051DV33-12ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1051DV33-12ZSXIT?
For technical support, including CY7C1051DV33-12ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051DV33-12ZSXIT requirements.
6.How does Aetrix verify that CY7C1051DV33-12ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1051DV33-12ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051DV33-12ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1051DV33-12ZSXIT?
All CY7C1051DV33-12ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051DV33-12ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1051DV33-12ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1051DV33-12ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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