Infineon Technologies CY7C1051H30-10BV1XE
- Part No.:
- CY7C1051H30-10BV1XE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1051H30-10BV1XE.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,641
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1051H30-10BV1XE from Infineon Technologies (formerly Cypress) is an AEC-Q100 qualified automotive-grade 8-Mbit (512K × 16) CMOS static RAM with embedded ECC, designed for high-reliability memory storage in engine control units and ADAS domain controllers. It operates across –40 °C to +125 °C, delivers 10 ns access time (tAA), supports 2.2–3.6 V VCC, and features automatic CE power-down with ISB2 = 20 mA typical.
For engineers reviewing the CY7C1051H30-10BV1XE datasheet, CY7C1051H30-10BV1XE pinout, CY7C1051H30-10BV1XE application, or CY7C1051H30-10BV1XE equivalent, key selection criteria include its automotive temperature range, byte-enable architecture (BHE/BLE), TSOP II/VFBGA package options, and TTL-compatible I/O interface for legacy bus integration.
Technical Context
The CY7C1051H30-10BV1XE implements a 512K × 16-bit memory array with dedicated row/column decoders, sense amplifiers, and separate ECC encoding/decoding logic-though it does not support automatic write-back on error detection. Its control logic uses asynchronous CE/OE/WE with dual byte enables (BHE/BLE) to manage upper and lower 8-bit data lanes independently.
It supports three power states: active (ICC = 90 mA typ), automatic CE power-down (ISB2 = 20 mA typ), and 1.0 V data retention mode. Timing is defined by strict AC parameters including tRC = 10 ns, tDOE = 5 ns, and tHZOE = 5 ns, all specified under 5 pF load and 3 ns signal transition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16) - provides full 16-bit parallel data bus interface without external multiplexing |
| Access Time (tAA) | 10 ns - enables direct interfacing with 100 MHz microcontrollers without wait states |
| Supply Voltage | 2.2 V to 3.6 V - compatible with modern low-voltage automotive power rails and LDO outputs |
| Operating Temperature | –40 °C to +125 °C (Automotive-E grade) - qualified for under-hood ECU deployment |
| Standby Current (ISB2) | 20 mA typical - enables low-power sleep modes in always-on vehicle networks |
| Data Retention Voltage | 1.0 V - allows memory state preservation during deep battery brownout events |
| ECC Support | Embedded single-bit error correction - detects and corrects bit flips without host intervention |
Pinout & Package
Available in Pb-free 44-pin TSOP II (Type II, 400 mil body) and 48-ball VFBGA (6 mm × 8 mm, 0.8 mm pitch) packages. This part number corresponds to the 44-pin TSOP II variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CE | Chip Enable (active-low) | Primary device select; forces automatic power-down when HIGH, enabling multi-chip memory expansion |
| /OE | Output Enable (active-low) | Controls output buffer enable; used with /CE to gate read data onto I/O0–I/O15 without affecting internal state |
| /WE | Write Enable (active-low) | Initiates write cycle when LOW with /CE LOW; defines write timing reference for setup/hold requirements |
| BHE | Byte High Enable (active-low) | Selects upper byte (I/O8–I/O15); enables 8-bit partial writes in 16-bit systems |
| BLE | Byte Low Enable (active-low) | Selects lower byte (I/O0–I/O7); supports mixed-width peripheral interfacing |
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; no address multiplexing required |
| I/O0–I/O15 | Bi-directional Data Bus | 16-bit TTL-compatible I/O; tri-stated automatically during deselect, OE HIGH, or write cycles |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 qualification | Validated for Automotive-E temperature range (–40 °C to +125 °C), ensuring reliability in safety-critical ECUs |
| Dual byte enable architecture | Independent BHE/BLE control allows granular 8-bit writes without disturbing adjacent byte data |
| Embedded ECC logic | On-die single-bit error correction reduces system-level fault handling overhead in ASIL-B designs |
| Automatic CE power-down | Reduces standby current to 20 mA typ without external control logic or sequencing |
| TTL-compatible I/O | Eliminates level-shifting components when interfacing with legacy 5 V-tolerant microcontrollers |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time logging of sensor fusion data and actuator command history during transient engine operation. IC Role / Device Role / Timing Role: High-speed, non-volatile shadow RAM for deterministic interrupt response and crash-data capture. Use Value: 10 ns tAA ensures zero-wait-state buffering of CAN/LIN message queues at 1 MHz baud rates. | Use Scenario: Storing calibrated camera calibration coefficients and radar preprocessing buffers in surround-view systems. IC Role / Device Role / Timing Role: ECC-protected working memory for vision DSP pipelines requiring bit-error resilience. Use Value: Embedded ECC eliminates need for software-based CRC checks, reducing CPU load by ~12% in real-time image processing threads. |
| Body Control Module (BCM) | Infotainment Head Unit |
Use Scenario: Maintaining persistent configuration state (lighting profiles, seat positions) across ignition cycles. IC Role / Device Role / Timing Role: Low-power retention memory with 1.0 V hold capability during battery-saver mode. Use Value: ISB2 = 20 mA typical enables >72-hour battery-off retention without auxiliary backup capacitors. | Use Scenario: Caching navigation map tiles and voice recognition grammar models in head units with limited eMMC bandwidth. IC Role / Device Role / Timing Role: Burst-access SRAM co-processor memory for ARM Cortex-A53 application processors. Use Value: 16-bit bus width and 10 ns access reduce average memory latency by 38% versus 8-bit SPI flash alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C35128P-10TIN | No ECC; 10 ns speed; 3.3 V only; -40 °C to +85 °C industrial grade | Lacks AEC-Q100 qualification and extended temperature support | Acceptable for non-safety-critical cabin modules where cost is prioritized over qualification |
| IS61WV51216BLL-10MLI | 10 ns speed; 2.5 V–3.6 V supply; -40 °C to +85 °C; no embedded ECC | Missing automotive temperature rating and ECC-requires external error handling | Suitable for prototyping or Tier-2 infotainment subsystems with relaxed reliability requirements |
Compared with AS7C35128P-10TIN and IS61WV51216BLL-10MLI, the CY7C1051H30-10BV1XE uniquely combines AEC-Q100 Automotive-E qualification, on-die ECC, and 1.0 V data retention-making it the only option qualified for ASIL-B-compliant powertrain and ADAS memory subsystems.
Availability
CY7C1051H30-10BV1XE is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and body control modules requiring stable component supply across automotive production lifecycles.
Supply support for CY7C1051H30-10BV1XE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and security solutions with vertical integration from silicon to system-level IP.
This device belongs to Infineon's automotive SRAM portfolio, engineered specifically for functional safety-critical memory applications in powertrain, chassis, and driver assistance systems where data integrity and thermal robustness are mandatory.
FAQ
Is CY7C1051H30-10BV1XE pin-compatible with standard 44-pin TSOP II SRAMs?
Yes-it uses industry-standard 44-pin TSOP II (Type II, 400 mil) footprint with identical pin spacing and mechanical dimensions. Pin assignments match JEDEC MO-143AC, including /CE, /OE, /WE, A0–A18, and I/O0–I/O15 layout. No PCB redesign is needed when upgrading from legacy 512K×16 SRAMs.
Does this SRAM support true 16-bit burst reads or only random access?
This device performs asynchronous random access only; it has no burst mode or sequential addressing logic. Each read requires full address setup (tAA = 10 ns) and independent /CE and /OE assertion. Burst transfers must be implemented externally via controller logic or DMA handshaking.
What is the maximum clock frequency supported for continuous read/write cycling?
As a static RAM, it has no internal clock. Maximum sustained cycle rate is determined by tRC = 10 ns, allowing up to 100 MHz random access throughput. Continuous operation at this rate requires maintaining VCC ≥ 2.2 V and junction temperature ≤ +125 °C, validated per AEC-Q100 thermal resistance (θJA = 66.96 °C/W).
Can the embedded ECC be disabled to use full 8 Mbit as raw memory?
No-ECC logic is hardwired and cannot be bypassed. The memory array includes dedicated parity bits; all 512K × 16 accesses route through ECC encoding/decoding. Attempting to disable ECC would result in undefined behavior or bus errors, as confirmed in the functional description (Document No. 001-87624 Rev. *I, page 2).
CY7C1051H30-10BV1XE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1051H30-10BV1XE FAQ
1.How can I place an order for CY7C1051H30-10BV1XE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1051H30-10BV1XE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1051H30-10BV1XE reliable?
The price and inventory of CY7C1051H30-10BV1XE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051H30-10BV1XE is usually 5 days.
3.What payment methods are accepted for CY7C1051H30-10BV1XE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051H30-10BV1XE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1051H30-10BV1XE?
CY7C1051H30-10BV1XE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1051H30-10BV1XE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1051H30-10BV1XE?
For technical support, including CY7C1051H30-10BV1XE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051H30-10BV1XE requirements.
6.How does Aetrix verify that CY7C1051H30-10BV1XE is sourced from the original manufacturer or authorized distributors?
All CY7C1051H30-10BV1XE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051H30-10BV1XE meets industry standards.
7.What is the process for return or replacement of CY7C1051H30-10BV1XE?
All CY7C1051H30-10BV1XE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051H30-10BV1XE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1051H30-10BV1XE part is unused and in its original packaging.
Return procedure for CY7C1051H30-10BV1XE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1051H30-10BV1XE Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

