Infineon Technologies CY7C1051H30-10BV1XET
- Part No.:
- CY7C1051H30-10BV1XET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1051H30-10BV1XET.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,973
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Product details
Overview
CY7C1051H30-10BV1XET from Infineon Technologies (formerly Cypress) is an AEC-Q100 qualified automotive-grade 8-Mbit (512K × 16) CMOS static RAM with embedded ECC, designed for high-reliability memory storage in engine control units and ADAS domain controllers. It delivers 10 ns access time (tAA), operates across –40 °C to +125 °C, supports 2.2 V–3.6 V supply, and features automatic CE power-down with ISB2 = 20 mA typical.
For engineers reviewing the CY7C1051H30-10BV1XET datasheet, CY7C1051H30-10BV1XET pinout, CY7C1051H30-10BV1XET application, or CY7C1051H30-10BV1XET equivalent, key selection criteria include its 48-ball VFBGA package, TTL-compatible I/Os, byte-wide write enable (BHE/BLE), data retention at 1.0 V, and automotive-E temperature compliance.
Technical Context
The CY7C1051H30-10BV1XET implements a synchronous, non-volatile-retentive SRAM architecture with dedicated ECC encoding/decoding circuitry for single-bit error correction and double-bit error detection. Its address space spans 19 address lines (A0–A18), supporting 512K words × 16 bits, and uses separate byte enables (BHE/BLE) to control upper/lower data bus segments independently.
It employs transistor-transistor logic (TTL)-compatible input thresholds and drive strength, supports CE/OE/WE control logic for seamless integration into microcontroller-based memory buses, and enters automatic low-power mode when CE is deasserted-reducing ICC to ISB2 = 20 mA typical without external sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16) - provides full 16-bit parallel data path for MCU interface alignment without glue logic |
| Access Time (tAA) | 10 ns - enables direct interfacing with 100 MHz bus systems without wait states |
| Supply Voltage Range | 2.2 V–3.6 V - compatible with modern automotive 3.3 V domains and brown-out tolerant down to 2.2 V |
| Operating Current (ICC) | 90 mA typical - supports sustained high-speed read/write bursts within thermal limits of compact ECUs |
| Standby Current (ISB2) | 20 mA typical - ensures ultra-low quiescent draw during sleep modes in always-on vehicle networks |
| Data Retention Voltage | 1.0 V - guarantees memory state preservation during deep battery discharge or cold-cranking events |
| Temperature Range | –40 °C to +125 °C (Automotive-E) - validated for under-hood deployment in powertrain and chassis modules |
Pinout & Package
Package: 48-ball very fine-pitch ball grid array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; no multiplexing required |
| I/O0–I/O7 | Data Bus (Lower Byte) | Bi-directional 8-bit data path enabled by BLE; high-impedance when BLE or CE inactive |
| I/O8–I/O15 | Data Bus (Upper Byte) | Bi-directional 8-bit data path enabled by BHE; independent control allows partial-word writes |
| CE | Chip Enable | Active-low global select; initiates automatic power-down when HIGH, reducing ICC to ISB2 |
| OE | Output Enable | Active-low read strobe; controls output drivers only-does not affect internal state or power mode |
| WE | Write Enable | Active-low write strobe; combined with CE LOW to initiate write cycle per truth table timing |
| BHE / BLE | Byte High/Low Enable | Independent active-low enables for upper/lower data bytes; supports 8-bit or 16-bit transfers |
| VCC / VSS | Power / Ground | Dual VCC pins (balls A1, D1) and multiple VSS balls (B1, C1, E1, F1, G1, H1) ensure low-noise supply routing |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | On-die single-bit error correction and double-bit error detection-no external logic or software overhead required |
| AEC-Q100 Qualification | Qualified to Automotive-E stress test profile-validates reliability for safety-critical powertrain applications |
| Automatic Power-Down | Hardware-triggered standby mode on CE deassertion-eliminates need for external power management ICs |
| TTL-Compatible I/O | Input thresholds and output drive meet standard TTL voltage levels-enables drop-in replacement in legacy designs |
| Byte-Wide Write Control | Independent BHE/BLE signals allow selective 8-bit writes to upper or lower data lanes-reduces bus contention and EMI |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Real-time storage of sensor fusion buffers and actuator command history during closed-loop combustion control. IC Role / Device Role / Timing Role: High-speed, ECC-protected working memory interfaced directly to dual-core automotive MCU via parallel bus. Use Value: 10 ns tAA enables deterministic response within 10 µs control loops; 125 °C operation sustains reliability near exhaust manifolds. |
Use Scenario: Temporary frame buffering for radar pre-processing pipelines before DSP offload. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for time-critical signal chain stages requiring bit-error resilience. Use Value: Embedded ECC prevents silent data corruption in RF-sensitive environments; ISB2 = 20 mA extends battery runtime in parking-mode radar. |
| Electric Power Steering (EPS) | Body Control Module (BCM) |
|
Use Scenario: Storing torque compensation lookup tables and motor position history for fail-operational torque overlay algorithms. IC Role / Device Role / Timing Role: Safety-relevant SRAM holding configuration and runtime variables with ASIL-B traceability. Use Value: AEC-Q100 Automotive-E qualification meets ISO 26262 hardware requirements; 1.0 V data retention survives cranking dips. |
Use Scenario: Holding door lock status, lighting profiles, and CAN message queues during vehicle sleep/wake transitions. IC Role / Device Role / Timing Role: Low-quiescent memory maintaining volatile state across ignition cycles without backup capacitor. Use Value: ISB2 = 20 mA typical minimizes parasitic drain; automatic CE power-down eliminates firmware polling overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256B-10TIN | No embedded ECC; 32K × 16 organization; 10 ns access; 2.7 V–3.6 V supply only | Lacks AEC-Q100 qualification; rated for industrial (–40 °C to +85 °C), not automotive-E | Use only in non-safety-critical body electronics where ECC and extended temperature are not mandated |
| IS61WV51216BLL-10MLI | 512K × 16, 10 ns, no ECC; 2.2 V–3.6 V; -40 °C to +85 °C industrial grade | Not AEC-Q100 qualified; higher ISB2 = 35 mA typical; lacks byte-enable granularity | Suitable for cost-sensitive infotainment subsystems where functional safety is not required |
Compared with AS7C3256B-10TIN and IS61WV51216BLL-10MLI, the CY7C1051H30-10BV1XET uniquely combines automotive-E qualification, on-die ECC, and 1.0 V data retention-making it the only option for ASIL-B compliant powertrain memory where silent data errors must be prevented.
Availability
CY7C1051H30-10BV1XET is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and electric power steering modules requiring stable component supply across long automotive production lifecycles.
Supply support for CY7C1051H30-10BV1XET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and security solutions with over 40 years of automotive qualification heritage.
The CY7C1051H series belongs to Infineon's automotive SRAM portfolio, engineered specifically for functional safety-critical memory applications in powertrain, chassis, and ADAS systems where ECC and extended temperature operation are mandatory.
FAQ
Does CY7C1051H30-10BV1XET support true 16-bit parallel writes?
Yes. The device supports simultaneous 16-bit writes using both BHE and BLE asserted LOW. When both byte enables are active, I/O0–I/O7 and I/O8–I/O15 accept data concurrently into the same memory location addressed by A0–A18. This is confirmed in the functional description and truth table on page 11 of datasheet 001-87624 Rev. *I.
Is the embedded ECC capable of correcting multi-bit errors?
No. The ECC implementation corrects only single-bit errors and detects double-bit errors. The datasheet explicitly states "this device does not support automatic write-back on error detection" and confirms SEC-DED (Single Error Correction, Double Error Detection) functionality in the logic block diagram and feature list.
What is the maximum clock frequency supported for burst reads?
The device does not use a clock signal-it is asynchronous. Maximum effective throughput is determined by tRC = 10 ns, enabling up to 100 million read cycles per second in continuous operation. Timing is governed solely by address and control signal setup/hold constraints, not a system clock.
Can CY7C1051H30-10BV1XET operate reliably at 2.2 V across the full –40 °C to +125 °C range?
Yes. The operating range specification confirms VCC = 2.2 V–3.6 V over –40 °C to +125 °C (Automotive-E). DC electrical characteristics-including VOH, VOL, VIH, and VIL-are guaranteed across this full voltage and temperature envelope per Table on page 4 of the datasheet.
CY7C1051H30-10BV1XET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1051H30-10BV1XET FAQ
1.How can I place an order for CY7C1051H30-10BV1XET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1051H30-10BV1XET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1051H30-10BV1XET reliable?
The price and inventory of CY7C1051H30-10BV1XET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051H30-10BV1XET is usually 5 days.
3.What payment methods are accepted for CY7C1051H30-10BV1XET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051H30-10BV1XET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1051H30-10BV1XET?
CY7C1051H30-10BV1XET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1051H30-10BV1XET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1051H30-10BV1XET?
For technical support, including CY7C1051H30-10BV1XET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051H30-10BV1XET requirements.
6.How does Aetrix verify that CY7C1051H30-10BV1XET is sourced from the original manufacturer or authorized distributors?
All CY7C1051H30-10BV1XET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051H30-10BV1XET meets industry standards.
7.What is the process for return or replacement of CY7C1051H30-10BV1XET?
All CY7C1051H30-10BV1XET units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051H30-10BV1XET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1051H30-10BV1XET part is unused and in its original packaging.
Return procedure for CY7C1051H30-10BV1XET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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