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Infineon Technologies CY7C1051H30-10BVXI

Part No.:
CY7C1051H30-10BVXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1051H30-10BVXI.pdf
Description:
IC SRAM 8MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:591

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Product details

Overview

CY7C1051H30-10BVXI from Infineon Technologies (formerly Cypress) is an 8-Mbit (512K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and operation across 2.2–3.6 V. It serves as a high-reliability data buffer in industrial control modules requiring ECC protection against soft errors.

For engineers reviewing the CY7C1051H30-10BVXI datasheet, CY7C1051H30-10BVXI pinout, CY7C1051H30-10BVXI application, or CY7C1051H30-10BVXI equivalent, key selection criteria include ECC implementation without automatic write-back, TSOP II package compatibility, 10 ns tAA timing, and dual-byte enable (BHE/ BLE) for partial-word writes in real-time deterministic systems.

Technical Context

The device integrates dedicated ECC encoder/decoder logic adjacent to the memory array, performing on-the-fly single-bit correction during read cycles without CPU intervention. Its address decoding supports full 19-bit addressing (A0–A18) for 512K word access, with separate byte enables enabling independent upper/lower 8-bit writes.

It operates in three power states: active (ICC = 90 mA typ at 100 MHz), standby with CE high (ISB2 = 20 mA typ), and data retention at 1.0 V (ICCDR ≤ 30 mA). Input/output buffers meet TTL voltage thresholds across the full 2.2–3.6 V VCC range, ensuring interoperability with legacy 3.3 V and mixed-voltage controllers.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size8 Mbit (512K words × 16 bits); supports full-word or byte-aligned access without external glue logic
Access time (tAA)10 ns max; enables direct interface with 100 MHz bus clocks without wait states
ECC capabilitySingle-bit error correction per 16-bit word; detects but does not auto-write-back corrected data
VCC range2.2 V to 3.6 V; compatible with both 2.5 V and 3.3 V system rails
Standby current (ISB2)20 mA typical at VCC ≥ 3.4 V; supports low-power hold mode in battery-backed systems
Data retention voltage1.0 V minimum; allows extended retention during brown-out or controlled power-down sequences

Pinout & Package

Package: 44-pin TSOP II (Thin Small Outline Package, Type II), RoHS-compliant, body size 10.16 mm × 20.0 mm × 1.2 mm.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address inputs19-bit address bus supporting full 512K-word addressing; no external address multiplexing required
I/O0–I/O7Data bus (lower byte)Driven or tri-stated based on BLE assertion; enables 8-bit sub-word writes without masking logic
I/O8–I/O15Data bus (upper byte)Driven or tri-stated based on BHE assertion; supports independent upper-byte updates
/CEChip enable (active low)Primary device select; places all I/Os in high-Z when deasserted, enabling multi-SRAM bus sharing
/OEOutput enable (active low)Controls read data output only; allows address setup before data valid window
/WEWrite enable (active low)Initiates write cycle; latches address and data on falling edge with CE and OE inactive
/BLEByte low enable (active low)Enables write/read of I/O0–I/O7 only; used for 8-bit peripheral interfacing
/BHEByte high enable (active low)Enables write/read of I/O8–I/O15 only; supports split-bus architectures

Key Features

FeatureDesign Value
Embedded ECC logicOn-die correction circuitry eliminates need for external ECC controller or software overhead
Dual byte enable (/BHE & /BLE)Hardware-selectable 8-bit access avoids software bit-masking and reduces bus turnaround latency
TTL-compatible I/ODirect interface with legacy 3.3 V microcontrollers and FPGAs without level-shifting
Low ISB2 standby current20 mA typical at full VCC enables use in always-on industrial nodes with thermal constraints
1.0 V data retentionPreserves memory contents during undervoltage events down to 1.0 V, supporting graceful shutdown

Applications

Industrial PLC Data BufferRailway Signaling Memory

Use Scenario: Storing real-time I/O status and configuration registers in programmable logic controllers operating in harsh EMI environments.

IC Role / Device Role / Timing Role: Primary non-refreshing data buffer with ECC protection against cosmic-ray-induced bit flips in long-cycle scan logic.

Use Value: Prevents uncorrectable memory corruption during 20+ year deployments without field maintenance.

Use Scenario: Holding safety-critical interlocking tables and route validation data in EN 5012x-certified signaling systems.

IC Role / Device Role / Timing Role: Deterministic-access SRAM providing sub-10 ns read latency for fail-safe decision engines.

Use Value: Meets SIL-4 integrity requirements via hardware ECC, eliminating software-based checksum overhead.

Medical Imaging Frame StoreAvionics Display Buffer

Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transmission.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame buffer interfaced directly to image sensor ASICs.

Use Value: 10 ns tAA and 16-bit bus support 1.6 GB/s peak throughput for real-time video pipelines.

Use Scenario: Storing rendered cockpit display layers in DO-254-compliant flight deck systems.

IC Role / Device Role / Timing Role: Radiation-tolerant memory holding critical HUD overlay data with guaranteed integrity.

Use Value: 1.0 V data retention ensures display state persistence during engine start transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C35128P-10TINNo integrated ECC; requires external error detection logicSuitable for cost-sensitive designs where ECC is implemented in FPGA or processorSelect if system-level ECC is already present and board space is constrained
IS61WV51216BLL-10MLI10 ns access, no ECC, lower ISB2 (15 µA vs. 20 mA)Better suited for ultra-low-power sleep modes, but lacks bit-error resilienceChoose when power budget dominates over reliability in non-safety-critical logging

Compared with AS7C35128P-10TIN and IS61WV51216BLL-10MLI, CY7C1051H30-10BVXI uniquely delivers on-die ECC correction at 10 ns speed-critical for deterministic systems where software ECC introduces unacceptable latency or complexity.

Availability

CY7C1051H30-10BVXI is available at Aetrix Electronics and suitable for industrial PLCs, railway signaling systems, medical imaging subsystems, and avionics display units requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1051H30-10BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.

This device belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for mission-critical industrial and transportation systems demanding deterministic timing and hardware-level data integrity.

FAQ

Does CY7C1051H30-10BVXI support automatic error correction write-back?

No. The device performs single-bit error correction during read operations and outputs corrected data, but it does not automatically write the corrected value back to the memory array. Error correction is read-only; any write-back must be handled by external logic or firmware.

What is the maximum operating temperature range for this part?

The CY7C1051H30-10BVXI is rated for the Industrial grade temperature range of –40 °C to +85 °C. This is confirmed in the "Operating Range" table on page 5 of the datasheet (Rev. *D), and applies to all electrical specifications including tAA, ICC, and ISB2.

Can this SRAM be used with a 2.5 V microcontroller interface?

Yes. Its VCC range is 2.2 V to 3.6 V, and its TTL-compatible inputs accept VIH ≥ 2.0 V and VIL ≤ 0.6 V at 2.5 V operation-fully meeting standard 2.5 V logic thresholds. Output drive strength remains compliant per DC specs at 2.5 V VCC.

Is the 44-pin TSOP II package lead-free and RoHS-compliant?

Yes. The "Features" section on page 1 explicitly states "Available in Pb-free 44-pin TSOP II", and the ordering code suffix 'VXI' denotes a lead-free, RoHS-compliant TSOP II package per Infineon's packaging nomenclature.

CY7C1051H30-10BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1051H30-10BVXI FAQ

1.How can I place an order for CY7C1051H30-10BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1051H30-10BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1051H30-10BVXI reliable?

The price and inventory of CY7C1051H30-10BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051H30-10BVXI is usually 5 days.

3.What payment methods are accepted for CY7C1051H30-10BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051H30-10BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1051H30-10BVXI?

CY7C1051H30-10BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1051H30-10BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1051H30-10BVXI?

For technical support, including CY7C1051H30-10BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051H30-10BVXI requirements.

6.How does Aetrix verify that CY7C1051H30-10BVXI is sourced from the original manufacturer or authorized distributors?

All CY7C1051H30-10BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051H30-10BVXI meets industry standards.

7.What is the process for return or replacement of CY7C1051H30-10BVXI?

All CY7C1051H30-10BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051H30-10BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1051H30-10BVXI part is unused and in its original packaging.

Return procedure for CY7C1051H30-10BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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