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Infineon Technologies CY7C1051H30-10BVXIT

Part No.:
CY7C1051H30-10BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1051H30-10BVXIT.pdf
Description:
IC SRAM 8MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,924

Please send an inquiry. Send us your inquiry, and we will respond immediately.

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Product details

Overview

CY7C1051H30-10BVXIT from Infineon Technologies (formerly Cypress) is an 8-Mbit (512K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and industrial-grade operation from –40 °C to +85 °C. It supports byte-level writes via BHE/ BLE control and operates across 2.2–3.6 V supply voltage.

For engineers reviewing the CY7C1051H30-10BVXIT datasheet, CY7C1051H30-10BVXIT pinout, CY7C1051H30-10BVXIT application, or CY7C1051H30-10BVXIT equivalent, key selection criteria include ECC-enabled data integrity in mission-critical memory buffers, low ISB2 standby current (20 mA typical), and compatibility with legacy 16-bit parallel bus interfaces in industrial controllers and telecom line cards.

Technical Context

The CY7C1051H30-10BVXIT implements a synchronous, non-volatile-retentive SRAM architecture with dedicated ECC encoder/decoder logic that detects and corrects single-bit errors on read access without automatic write-back. Its address decoding covers A0–A18 (512K words), and data path uses true 16-bit bidirectional I/O0–I/O15 with independent byte enable control.

Operation relies on three active-low control signals-CE, WE, and OE-with timing governed by tAA = 10 ns (address access), tCO = 10 ns (output hold), and tHZ = 3 ns (output high-impedance delay). The device enters low-power ISB2 mode when CE is deasserted and all inputs are at valid logic levels under CMOS input thresholds.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density8 Mbit (512K words × 16 bits); supports full-word or byte-accessed storage in parallel bus systems.
Access Time (tAA)10 ns maximum; enables direct interface with 100 MHz microcontrollers and DSPs without wait states.
ECC FunctionSingle-bit error correction per 16-bit word; improves system reliability in radiation-prone or long-life industrial deployments.
VCC Range2.2 V to 3.6 V; allows interoperability with both 2.5 V and 3.3 V logic domains without level shifters.
ISB2 Standby Current20 mA typical at VCC = max, CE HIGH; reduces power in idle modes for battery-backed or energy-sensitive applications.
Data Retention Voltage1.0 V minimum; maintains stored data during brown-out or controlled low-power suspend sequences.
Package TypePb-free 48-ball FBGA (10 mm × 13 mm, 0.8 mm pitch); optimized for high-density PCB layouts with thermal resistance θJC = 15.75 °C/W.

Pinout & Package

The CY7C1051H30-10BVXIT is packaged in a 48-ball fine-pitch ball grid array (FBGA), RoHS-compliant, with 0.8 mm ball pitch and JEDEC MO-270AC footprint. Thermal performance is characterized by θJA = 31.50 °C/W (4-layer PCB).

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address Inputs19-bit address bus supporting 512K-word addressing; internally decoded to select memory location.
I/O0–I/O7Data Bus (Lower Byte)Bi-directional 8-bit data path enabled by BLE; used for lower-byte reads/writes in 16-bit transfers.
I/O8–I/O15Data Bus (Upper Byte)Bi-directional 8-bit data path enabled by BHE; used for upper-byte reads/writes in 16-bit transfers.
/CEChip EnableActive-low global enable; places device in standby (ISB2) when HIGH, isolating I/Os and reducing current draw.
/WEWrite EnableActive-low signal initiating write cycle; latches address and data when asserted with /CE LOW.
/OEOutput EnableActive-low signal enabling output drivers; controls read data visibility on I/O lines without affecting internal state.
/BLEByte Low EnableActive-low control for I/O0–I/O7; permits 8-bit writes to lower byte while preserving upper byte content.
/BHEByte High EnableActive-low control for I/O8–I/O15; permits 8-bit writes to upper byte while preserving lower byte content.

Key Features

FeatureDesign Value
Embedded ECC LogicHardware-based single-bit error correction per 16-bit word without CPU intervention or firmware overhead.
TTL-Compatible I/OInput thresholds and drive strength match standard TTL levels, enabling direct connection to legacy 5 V-tolerant microcontrollers.
Low-Voltage OperationFunctional down to 2.2 V VCC, supporting mixed-supply systems and extending battery life in portable industrial tools.
Byte-Write SelectivityIndependent /BHE and /BLE control allows precise 8-bit updates without read-modify-write cycles or bus contention.
Industrial Temperature RangeGuaranteed operation from –40 °C to +85 °C, validated for use in motor drives, PLCs, and outdoor telecom equipment.

Applications

Industrial PLC Data BufferTelecom Line Card Memory

Use Scenario: Storing real-time I/O status and configuration registers in programmable logic controllers subject to EMI and voltage transients.

IC Role / Device Role / Timing Role: Primary working memory with ECC protection for critical control variables and ladder logic execution state.

Use Value: Prevents silent data corruption in deterministic control loops, eliminating unexplained state faults during extended field deployment.

Use Scenario: Holding packet header metadata and buffering frame payloads in carrier-grade Ethernet line cards operating at 100 Mbps+.

IC Role / Device Role / Timing Role: High-speed parallel SRAM interfaced directly to MAC controller for zero-latency header lookups and descriptor management.

Use Value: 10 ns tAA ensures sub-cycle memory access for time-sensitive forwarding decisions without pipeline stalls.

Medical Imaging Frame StoreAvionics Display Controller Buffer

Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transmission in portable diagnostic devices.

IC Role / Device Role / Timing Role: Dual-port-capable buffer (via external arbitration) holding raw pixel data during sensor acquisition and processing handoff.

Use Value: 1.0 V data retention enables safe suspend-to-RAM during battery swaps without frame loss or reacquisition delay.

Use Scenario: Rendering intermediate graphics layers and overlay buffers in certified cockpit display units requiring DO-254 compliance.

IC Role / Device Role / Timing Role: Deterministic-access memory for GPU-like raster operations, synchronized to display refresh clocks via /OE-controlled output timing.

Use Value: ISB2 < 30 mA standby current meets strict avionics power budget constraints during non-display-active phases.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability parallel SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV51216BLL-10MLINo embedded ECC; requires external error detection logic; 10 ns access, same density and voltage range.Suitable where system-level ECC is already implemented in FPGA or ASIC, reducing BOM cost.Select when ECC is handled upstream and board space is constrained-this part uses smaller 48-pin TSOP II package.
AS6C4008-10TINHigher ICC (120 mA typical), no ECC, 3.3 V only, but offers 10 ns speed and industrial temp grade.Better suited for cost-sensitive industrial HMI panels where data integrity is enforced at software layer.Choose when VCC is fixed at 3.3 V and ECC is not required-lower unit price offsets higher active current.

Compared with IS61WV51216BLL-10MLI and AS6C4008-10TIN, the CY7C1051H30-10BVXIT uniquely delivers hardware ECC in a single chip, reducing FPGA resource usage and eliminating software latency for error correction-critical for real-time control and safety-critical edge nodes.

Availability

CY7C1051H30-10BVXIT is available at Aetrix Electronics and suitable for industrial PLC data buffers, telecom line card memory, medical imaging frame stores, and avionics display controller buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1051H30-10BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and aerospace heritage.

The CY7C1051H series belongs to Infineon's legacy Cypress SRAM portfolio, engineered for high-reliability, low-latency parallel memory applications in harsh-environment control systems and infrastructure equipment.

FAQ

Does CY7C1051H30-10BVXIT support automatic error correction write-back?

No. The device performs single-bit error correction on read access only and does not automatically rewrite corrected data to memory. System firmware must handle any required write-back if persistent correction is needed. This design minimizes latency and avoids unintended overwrites during transient bit flips.

What is the maximum clock frequency supported for burst-mode operation?

The CY7C1051H30-10BVXIT does not support clocked or burst-mode operation-it is an asynchronous SRAM. All timing is controlled by /CE, /WE, and /OE assertion edges. Maximum effective throughput is limited by tCYC = 10 ns minimum cycle time, yielding up to 100 million random accesses per second.

Can /BHE and /BLE be used simultaneously for full 16-bit writes?

Yes. Asserting both /BHE and /BLE LOW while /WE is LOW enables full 16-bit writes to I/O0–I/O15. The device treats this as a standard word write, with no timing penalty versus byte writes-the internal write path handles all 16 bits concurrently.

Is the 48-ball FBGA footprint compatible with CY7C1051DV33-10BVXI?

Yes. Both CY7C1051H30-10BVXIT and CY7C1051DV33-10BVXI share identical 48-ball FBGA mechanical dimensions, pad layout, and ball assignment. They differ only in electrical specs (ECC presence, VCC range, speed grade), allowing drop-in replacement in existing PCB designs where ECC is not required.

CY7C1051H30-10BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1051H30-10BVXIT FAQ

1.How can I place an order for CY7C1051H30-10BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1051H30-10BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1051H30-10BVXIT reliable?

The price and inventory of CY7C1051H30-10BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051H30-10BVXIT is usually 5 days.

3.What payment methods are accepted for CY7C1051H30-10BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051H30-10BVXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1051H30-10BVXIT?

CY7C1051H30-10BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1051H30-10BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1051H30-10BVXIT?

For technical support, including CY7C1051H30-10BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051H30-10BVXIT requirements.

6.How does Aetrix verify that CY7C1051H30-10BVXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1051H30-10BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051H30-10BVXIT meets industry standards.

7.What is the process for return or replacement of CY7C1051H30-10BVXIT?

All CY7C1051H30-10BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051H30-10BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1051H30-10BVXIT part is unused and in its original packaging.

Return procedure for CY7C1051H30-10BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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