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Infineon Technologies CY7C1051H30-10ZSXI

Part No.:
CY7C1051H30-10ZSXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1051H30-10ZSXI.pdf
Description:
IC SRAM 8MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,677

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Product details

Overview

CY7C1051H30-10ZSXI from Infineon Technologies (formerly Cypress) is an 8-Mbit (512K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and operation across 2.2–3.6 V. It serves as a high-reliability data buffer in industrial control modules requiring ECC-protected memory for real-time fault mitigation.

For engineers reviewing the CY7C1051H30-10ZSXI datasheet, CY7C1051H30-10ZSXI pinout, CY7C1051H30-10ZSXI application, or CY7C1051H30-10ZSXI equivalent, key selection criteria include tAA = 10 ns timing, ISB2 = 20 mA standby current, ECC correction capability without automatic write-back, and TSOP II package compatibility with legacy PCB layouts.

Technical Context

The device implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read operations, but does not perform automatic write-back upon correction-error handling requires external firmware coordination. Its dual-byte enable architecture (BHE/BLE) enables independent upper- and lower-byte writes to the 16-bit data bus without full-word access overhead.

It operates in three power states: active (ICC = 90 mA typical at 100 MHz), automatic CE power-down (ISB2 = 20 mA), and 1.0-V data retention mode (ICCDR ≤ 30 mA). All I/Os enter high-impedance when CE is HIGH or OE/BHE/BLE are deasserted, supporting bus sharing in multi-device systems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size8 Mbit (512K words × 16 bits); supports full-word parallel access for high-throughput buffering in microcontroller co-processor interfaces.
Access time (tAA)10 ns maximum; enables direct interfacing with 100 MHz synchronous controllers without wait states.
VCC range2.2 V to 3.6 V; compatible with mixed-voltage industrial systems using 2.5 V or 3.3 V supply rails.
ECC functionSingle-bit error correction per 16-bit word; improves system-level reliability in radiation-prone or long-life embedded applications.
Standby current (ISB2)20 mA typical; allows low-power sleep modes while retaining full memory content during intermittent operation.
Data retention voltage1.0 V minimum; sustains stored data during brown-out conditions or controlled power-down sequences.
Package typePb-free 44-pin TSOP II (ZSXI suffix); surface-mount compatible with standard reflow profiles and legacy footprint designs.

Pinout & Package

44-pin TSOP II (Thin Small Outline Package, Type II) with 0.8 mm pitch, 12.0 mm × 20.0 mm body, and standard JEDEC MO-141AC footprint. Pin 1 marked by notch or dot; pins arranged in two rows (22 per side).

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address inputs19-bit address bus supporting 512K-word addressing; A18 enables full memory space decoding.
I/O0–I/O15Bidirectional data bus16-bit parallel interface; high-impedance when CE HIGH or OE/BHE/BLE inactive for bus contention avoidance.
/CEChip enable (active LOW)Primary device select; places all outputs in high-Z when HIGH, enabling multi-SRAM bus sharing.
/OEOutput enable (active LOW)Controls read data output drive; independent of /CE for partial-cycle gating.
/WEWrite enable (active LOW)Initiates write cycle; latches address and data on falling edge when /CE and /OE are asserted appropriately.
/BHEByte high enable (active LOW)Enables write/read of I/O8–I/O15 only; supports 8-bit peripheral interfacing on upper byte lane.
/BLEByte low enable (active LOW)Enables write/read of I/O0–I/O7 only; permits independent access to lower byte without disturbing upper byte.
VCCPower supplyTwo dedicated VCC pins (pins 11 & 34) reduce IR drop and improve noise immunity on 16-bit data paths.
VSSGroundTwo dedicated VSS pins (pins 12 & 33) provide low-inductance return paths for I/O switching currents.

Key Features

FeatureDesign Value
Embedded ECC logicOn-chip Hamming-code encoder/decoder corrects single-bit errors per 16-bit word without external logic or software overhead.
Dual-byte write controlIndependent /BHE and /BLE signals allow granular 8-bit writes-critical for mixed-endian or legacy peripheral register mapping.
Low-voltage data retentionMaintains valid data at VCC = 1.0 V, enabling graceful degradation during power failure or battery-backed operation.
TTL-compatible I/OVIH/VIL thresholds match standard TTL levels, eliminating level-shifter requirements in legacy 5 V-tolerant 3.3 V systems.
Industrial temperature gradeSpecified from –40 °C to +85 °C, validated for continuous operation in motor drives, PLC backplanes, and outdoor telemetry units.

Applications

Industrial PLC Data BufferMedical Imaging Frame Store

Use Scenario: Stores real-time I/O scan data between CPU cycles in programmable logic controller backplanes with strict uptime requirements.

IC Role / Device Role / Timing Role: High-speed SRAM buffer with ECC protection ensures deterministic response times and prevents corrupted state transitions due to soft errors.

Use Value: Eliminates need for external error-checking logic and reduces firmware validation scope for SIL-2 compliant control systems.

Use Scenario: Holds uncompressed grayscale image frames (e.g., ultrasound or X-ray previews) during acquisition before compression and transfer to host.

IC Role / Device Role / Timing Role: Low-latency 16-bit parallel memory providing burst-mode pixel streaming at >60 MB/s sustained bandwidth.

Use Value: Enables zero-frame-loss preview rendering with hardware ECC, reducing risk of diagnostic misinterpretation from bit-flipped pixel data.

Railway Signaling Event LogAvionics Sensor Fusion Cache

Use Scenario: Captures timestamped safety-critical event logs (e.g., door status, brake application) in train control units where data integrity is mandated by EN 50128.

IC Role / Device Role / Timing Role: Nonvolatile-capable SRAM with 1.0 V retention retains logs during power interruption between battery switchover events.

Use Value: Meets CENELEC Class 3 data persistence requirements without supplemental backup capacitors or FRAM cost premium.

Use Scenario: Temporarily aggregates inertial measurement unit (IMU), GPS, and barometer readings for Kalman filter computation in flight control computers.

IC Role / Device Role / Timing Role: ECC-protected scratchpad memory prevents silent corruption of sensor fusion coefficients during high-G vibration environments.

Use Value: Avoids uncorrectable arithmetic drift in navigation state estimation, directly supporting DO-178C Level A software assurance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C35128P-10TINNo embedded ECC; 10 ns access, 512K × 16-bit, 3.3 V only, 44-pin TSOP IIRequires external ECC logic or software correction; higher BOM count and firmware complexitySelect when ECC is handled at system level and cost sensitivity outweighs reliability assurance.
IS61WV51216BLL-10MLI10 ns access, 512K × 16-bit, 2.5 V/3.3 V, no ECC, 48-ball FBGA onlyLacks ECC and TSOP II footprint; incompatible with through-hole or legacy reflow profilesChoose only for new designs targeting space-constrained boards where FBGA is acceptable and ECC is omitted.

Compared with AS7C35128P-10TIN and IS61WV51216BLL-10MLI, CY7C1051H30-10ZSXI uniquely delivers integrated ECC in a drop-in TSOP II package-reducing design risk for industrial and safety-critical applications where bit-error resilience cannot be deferred to software.

Availability

CY7C1051H30-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC data buffers, medical imaging frame stores, and railway signaling event loggers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1051H30-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions for industrial and mission-critical systems.

This device belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-integrity embedded applications where data reliability, predictable timing, and long-term supply stability are non-negotiable.

FAQ

Does CY7C1051H30-10ZSXI support automatic error correction write-back?

No. The device detects and corrects single-bit errors during read operations, but does not automatically rewrite corrected data to memory. External firmware must initiate a write cycle if persistent correction is required. This design avoids unintended write amplification and preserves deterministic timing behavior in real-time systems.

What is the maximum operating frequency supported by CY7C1051H30-10ZSXI?

The device supports up to 100 MHz clock rates in active mode, verified by its ICC = 90 mA typical specification at f = 100 MHz and tAA = 10 ns access time. It does not require external clock input-the timing is asynchronous and governed solely by address and control signal setup/hold relationships.

Can CY7C1051H30-10ZSXI operate at 2.5 V supply voltage?

Yes. Its specified VCC range is 2.2 V to 3.6 V, and all AC/DC parameters-including tAA = 10 ns and ISB2 = 20 mA-are guaranteed across this full range. At 2.5 V, it meets industrial-grade timing and power specs without derating.

Is the 44-pin TSOP II package of CY7C1051H30-10ZSXI RoHS-compliant?

Yes. The "ZSXI" suffix explicitly denotes a Pb-free, RoHS-compliant 44-pin TSOP II package. It uses lead-free solder paste compatible with standard J-STD-020 reflow profiles and meets EU Directive 2011/65/EU requirements without exemptions.

CY7C1051H30-10ZSXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1051H30-10ZSXI FAQ

1.How can I place an order for CY7C1051H30-10ZSXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1051H30-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1051H30-10ZSXI reliable?

The price and inventory of CY7C1051H30-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1051H30-10ZSXI is usually 5 days.

3.What payment methods are accepted for CY7C1051H30-10ZSXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1051H30-10ZSXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1051H30-10ZSXI?

CY7C1051H30-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1051H30-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1051H30-10ZSXI?

For technical support, including CY7C1051H30-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1051H30-10ZSXI requirements.

6.How does Aetrix verify that CY7C1051H30-10ZSXI is sourced from the original manufacturer or authorized distributors?

All CY7C1051H30-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1051H30-10ZSXI meets industry standards.

7.What is the process for return or replacement of CY7C1051H30-10ZSXI?

All CY7C1051H30-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1051H30-10ZSXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1051H30-10ZSXI part is unused and in its original packaging.

Return procedure for CY7C1051H30-10ZSXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1051H30-10ZSXI Tags

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