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Infineon Technologies CY7C1059DV33-12ZSXQT
- Part No.:
- CY7C1059DV33-12ZSXQT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1059DV33-12ZSXQT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:24,936
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Product details
Overview
CY7C1059DV33-12ZSXQT from Infineon Technologies (formerly Cypress) is a 8-Mbit (1M × 8) high-speed CMOS static RAM with 12 ns access time, 3.3 V supply, and automatic CE-controlled power-down mode. It features TTL-compatible I/Os, tri-state outputs, and supports memory expansion via dedicated CE, OE, and WE control lines. Used in industrial embedded controllers requiring fast, low-power, non-refresh volatile storage.
For engineers reviewing the CY7C1059DV33-12ZSXQT datasheet, CY7C1059DV33-12ZSXQT pinout, CY7C1059DV33-12ZSXQT application, or CY7C1059DV33-12ZSXQT equivalent, key selection criteria include tAA ≤ 12 ns, ISB2 ≤ 20 µA at 3.3 V, 44-pin TSOP-II package with center power/ground pinout, data retention down to 2.0 V, and industrial temperature range (–40 °C to +85 °C).
Technical Context
The device implements a fully static 1M × 8 memory array with asynchronous random access, using separate address latching and tri-state bidirectional I/O drivers. All control inputs (CE, OE, WE) are edge-agnostic and level-sensitive, enabling seamless integration into bus-based microcontroller and FPGA systems without clock synchronization.
Power management is handled entirely by CE state: when CE is HIGH, the device enters automatic CMOS standby (ISB2 = 20 µA), and retains data down to VCC = 2.0 V. Input/output voltage thresholds comply with TTL logic levels (VIH ≥ 2.0 V, VIL ≤ 0.8 V) while operating from a single 3.3 V ±0.3 V supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 × 8 bits - supports byte-wide data transfers without external demultiplexing |
| Access Time (tAA) | 12 ns - enables direct interfacing with 80 MHz CPU buses without wait states |
| Supply Voltage | 3.3 V ±0.3 V - compatible with standard LVCMOS33 I/O domains and eliminates level-shifting needs |
| Standby Current (ISB2) | 20 µA - allows >10-year battery-backed retention in low-power monitoring nodes |
| Data Retention Voltage | 2.0 V - maintains stored contents during brown-out conditions or controlled power ramp-down |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial control cabinets and outdoor telemetry enclosures |
| Package | 44-pin TSOP-II (Type II) - surface-mount footprint with center VCC/VSS pins for improved signal integrity and thermal dissipation |
Pinout & Package
44-pin Thin Small Outline Package (TSOP-II) with center power/ground pin arrangement (VCC on pins 16/31, VSS on pins 17/32), optimized for reduced noise coupling and thermal performance in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus accepting full 1M-word linear addressing; no internal multiplexing required |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state CMOS I/Os with TTL-compatible thresholds; high-impedance when CE=HIGH, OE=HIGH, or WE=LOW |
| CE | Chip Enable (active LOW) | Primary device select; forces automatic power-down and high-Z I/O when deasserted |
| OE | Output Enable (active LOW) | Controls output driver enable only; does not affect power state or internal array activity |
| WE | Write Enable (active LOW) | Initiates write cycle when CE=LOW; overlapping CE/WE LOW defines write window |
| VCC | Supply Voltage | 3.3 V core and I/O supply; dual pins (16, 31) reduce IR drop and improve decoupling |
| VSS | Ground | Signal and power ground reference; dual pins (17, 32) minimize ground bounce |
| NC | No Connect | Unbonded pins (e.g., pins 11, 12, 14, 33–35); must remain unconnected per design |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ICC to 20 µA without external control logic or sleep-mode registers |
| TTL-Compatible I/O | Accepts 5 V-tolerant input levels (VIH ≥ 2.0 V) while operating at 3.3 V, easing migration from legacy 5 V systems |
| Center-Power TSOP-II | Dual VCC/VSS pins placed centrally lower inductance and improve signal return path integrity for high-speed address/data buses |
| 2.0 V Data Retention | Maintains valid memory contents during brown-out events or controlled low-voltage backup operation |
| Industrial Temperature Range | Guaranteed functionality across –40 °C to +85 °C ambient, eliminating derating calculations for most industrial deployments |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
Use Scenario: Real-time I/O status buffering and program instruction caching in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state read/write access to CPU and DMA engines during cyclic scan execution. Use Value: 12 ns tAA ensures sub-microsecond response to fieldbus interrupts; ISB2 ≤ 20 µA extends uptime during auxiliary power loss. | Use Scenario: Temporary frame storage between image sensor capture and JPEG compression pipeline in portable ultrasound devices. IC Role / Device Role / Timing Role: Byte-accessible buffer holding one full 1024×768 monochrome frame (786 kB) before processing. Use Value: 1M × 8 organization matches 8-bit pixel depth; 3.3 V operation aligns with SoC I/O voltage, avoiding level shifters. |
| Avionics Data Logger | Test & Measurement Capture Buffer |
Use Scenario: High-reliability cyclic data logging of flight parameters (GPS, IMU, engine telemetry) in certified airborne equipment. IC Role / Device Role / Timing Role: Non-refresh volatile storage capturing burst telemetry at 100 kHz sample rate with guaranteed data integrity. Use Value: Industrial temp rating and Q-grade option support DO-254 compliance; 2.0 V retention enables safe shutdown during power fault. | Use Scenario: Deep-memory waveform capture in handheld oscilloscopes and logic analyzers with real-time triggering. IC Role / Device Role / Timing Role: High-speed acquisition buffer feeding ADC samples directly to FPGA-based pattern analysis engine. Use Value: 12 ns access time sustains 83 MHz sampling without dead time; TSOP-II package fits compact front-end PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV10248-12MLI | Same 1M × 8 organization, 12 ns tAA, 3.3 V, but uses standard TSOP-I pinout (VCC/VSS at corners) and lacks 2.0 V data retention | Suitable for cost-sensitive consumer electronics where brown-out resilience is not required | Select if board layout already uses TSOP-I footprint and retention voltage is not critical |
| Winbond W9812G2JHX-12 | SDRAM (not SRAM), requires refresh, 12 ns CL, 3.3 V, 1M × 16 - different architecture and interface protocol | Applicable only in systems with SDRAM controller support and tolerance for periodic refresh overhead | Choose only when migrating to higher-density, lower-cost DRAM and redesigning controller firmware |
Compared with IS61LV10248-12MLI, CY7C1059DV33-12ZSXQT provides superior data retention and optimized TSOP-II thermal/power routing; versus W9812G2JHX-12, it delivers true zero-refresh operation and simpler interface timing, critical for deterministic real-time systems.
Availability
CY7C1059DV33-12ZSXQT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, and avionics data loggers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1059DV33-12ZSXQT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability and industrial longevity.
This device belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-speed, low-power, non-refresh volatile memory applications in harsh-environment industrial and aerospace systems.
FAQ
Is CY7C1059DV33-12ZSXQT pin-compatible with earlier CY7C1059DV33 variants?
Yes - all CY7C1059DV33 speed grades (-10, -12) share identical 44-pin TSOP-II pinout, including center VCC/VSS placement and NC pin assignments. No PCB redesign is needed when upgrading from -10 to -12 or vice versa, though timing margins must be re-verified per system clock frequency.
Does this SRAM require external refresh circuitry?
No - the CY7C1059DV33-12ZSXQT is a true static RAM with no refresh requirement. Data remains valid indefinitely as long as VCC stays within specification and CE is asserted during active use or held HIGH for standby. This eliminates refresh overhead and timing complexity in MCU/FPGA designs.
What is the significance of "ZSXQT" in the part number?
The suffix "ZSXQT" denotes Infineon's industrial-grade qualification: Z = lead-free (Pb-free), S = TSOP-II package, X = tape-and-reel packaging, Q = extended reliability screening (including burn-in and enhanced testing), and T = temperature range –40 °C to +85 °C. It confirms full industrial qualification per AEC-Q100 stress test requirements.
Can this device operate with 2.5 V supply?
No - the CY7C1059DV33-12ZSXQT is specified only for 3.3 V ±0.3 V operation (i.e., 3.0 V to 3.6 V). Operation below 3.0 V violates the Absolute Maximum Ratings and may cause data corruption or failure to meet tAA/tWC specifications. For 2.5 V systems, consider Infineon's CY62167EV30 family instead.
CY7C1059DV33-12ZSXQT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1059DV33-12ZSXQT FAQ
1.How can I place an order for CY7C1059DV33-12ZSXQT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1059DV33-12ZSXQT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1059DV33-12ZSXQT reliable?
The price and inventory of CY7C1059DV33-12ZSXQT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1059DV33-12ZSXQT is usually 5 days.
3.What payment methods are accepted for CY7C1059DV33-12ZSXQT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1059DV33-12ZSXQT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1059DV33-12ZSXQT?
CY7C1059DV33-12ZSXQT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1059DV33-12ZSXQT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1059DV33-12ZSXQT?
For technical support, including CY7C1059DV33-12ZSXQT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1059DV33-12ZSXQT requirements.
6.How does Aetrix verify that CY7C1059DV33-12ZSXQT is sourced from the original manufacturer or authorized distributors?
All CY7C1059DV33-12ZSXQT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1059DV33-12ZSXQT meets industry standards.
7.What is the process for return or replacement of CY7C1059DV33-12ZSXQT?
All CY7C1059DV33-12ZSXQT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1059DV33-12ZSXQT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1059DV33-12ZSXQT part is unused and in its original packaging.
Return procedure for CY7C1059DV33-12ZSXQT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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