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Infineon Technologies CY7C10612G30-10ZSXI
- Part No.:
- CY7C10612G30-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C10612G30-10ZSXI.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,589
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Product details
Overview
CY7C10612G30-10ZSXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16) high-speed CMOS static RAM with embedded single-bit error-correcting code (ECC), 10 ns access time, 3.3 V ±0.3 V operation, and TTL-compatible I/O. It serves as a reliable, low-power memory buffer in industrial control systems requiring data integrity under extended temperature operation.
For engineers reviewing the CY7C10612G30-10ZSXI datasheet, CY7C10612G30-10ZSXI pinout, CY7C10612G30-10ZSXI application, or CY7C10612G30-10ZSXI equivalent, key selection criteria include ECC-enabled data reliability, TSOP II package compatibility, 10 ns timing compliance, and industrial-grade –40 °C to +85 °C operating range.
Technical Context
This SRAM implements a synchronous, byte-wide 1M × 16 architecture with dual enable controls (BHE/BLE) for independent high/low byte access and an ERR output flag (CY7C10612GE variant) signaling single-bit error detection and correction events during read cycles.
It operates with automatic CE power-down modes: ISB2 = 20 mA typical at CMOS input levels and ISB1 = 40 mA typical at TTL input levels, supporting low-power retention down to 1.0 V while maintaining full functionality across its specified industrial voltage and temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 bits) - supports full-word parallel access without external multiplexing |
| Access Time (tAA) | 10 ns - enables direct interface with 100 MHz bus systems without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and 3.3 V logic families |
| ECC Function | Embedded single-bit error correction - detects and corrects bit flips in real time during reads |
| Standby Current (ISB2) | 20 mA typical - ensures low power consumption during idle periods in battery-backed or energy-sensitive systems |
| Data Retention Voltage | 1.0 V - allows memory contents to be preserved during brown-out conditions or controlled power-down sequences |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial control, motor drives, and programmable logic applications |
Pinout & Package
Package: 54-pin TSOP II (Thin Small Outline Package, Type II), 0.8 mm pitch, body size 22.2 mm × 10.16 mm, lead-free (RoHS compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A0 least significant |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; split into low-byte (I/O0–I/O7) and high-byte (I/O8–I/O15) via BLE/BHE |
| CE | Chip Enable | Active-low global device select; enables automatic power-down when deasserted |
| OE | Output Enable | Active-low control for data output drivers; used with CE to gate read data |
| WE | Write Enable | Active-low signal initiating write cycle; must be low with CE for valid writes |
| BLE / BHE | Byte Low / High Enable | Independent active-low controls for writing/reading low or high byte only |
| VCC / VSS | Power / Ground | Multiple VCC (pins 4, 13, 29, 39, 49, 52) and VSS (pins 3, 12, 28, 38, 48, 53) pins reduce IR drop and noise |
| ERR | Error Flag Output | Open-drain output asserted high during single-bit ECC correction event; present on CY7C10612GE variant |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | Real-time single-bit error detection and correction without software overhead or external logic |
| 10 ns Access Time | Meets timing requirements of high-speed microcontroller and FPGA memory interfaces without wait-state insertion |
| Low Standby Power | 20 mA typical ISB2 enables energy-efficient operation in always-on industrial subsystems |
| TTL-Compatible I/O | Supports direct connection to legacy 3.3 V microcontrollers and FPGAs without level-shifting circuitry |
| Industrial Temperature Range | Validated operation from –40 °C to +85 °C ensures reliability in factory automation and motor control environments |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Data Cache |
|---|---|
Use Scenario: Stores real-time I/O mapping and program state in programmable logic controllers during cyclic scan execution. IC Role / Device Role / Timing Role: Non-volatile SRAM buffer with ECC ensuring deterministic response and fault-resilient data storage. Use Value: Prevents silent data corruption in safety-critical control loops by correcting single-bit errors before they propagate to outputs. | Use Scenario: Caches raw sensor frames from X-ray or MRI detectors prior to FPGA-based preprocessing. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory interface between ADC front-end and image processing pipeline. Use Value: 10 ns access time enables pixel-rate buffering without frame loss; ECC maintains diagnostic data integrity across thermal cycles. |
| Avionics Data Logger | Test & Measurement Equipment |
Use Scenario: Captures flight parameter snapshots during transient events in certified avionics black box recorders. IC Role / Device Role / Timing Role: Radiation-tolerant (via ECC) memory node storing timestamped telemetry with guaranteed bit-level fidelity. Use Value: 1.0 V data retention allows sustained memory hold during power interruption; industrial temp rating supports wide ambient ranges. | Use Scenario: Buffers high-speed waveform samples in digital oscilloscopes and logic analyzers before host transfer. IC Role / Device Role / Timing Role: Parallel-access SRAM acting as first-stage capture memory synchronized to sampling clock. Use Value: Dual-byte enables interleaved capture; low ICC (90 mA typ.) minimizes thermal load in compact benchtop enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No embedded ECC; 10 ns access, 3.3 V, 54-pin TSOP II | Requires external error handling logic or software mitigation | Select when ECC is not required and cost sensitivity outweighs data integrity assurance |
| AS6C1008-10TIN | 1M × 8 organization; no ECC; 10 ns; 3.3 V; 32-pin SOJ | Requires two devices for 16-bit width; no byte-enable support | Choose only if board layout constraints favor smaller footprint and system-level ECC is implemented externally |
Compared with IS61WV102416BLL-10MLI and AS6C1008-10TIN, CY7C10612G30-10ZSXI uniquely delivers integrated ECC in a 1M × 16 configuration with native byte enables-reducing BOM count, eliminating external error-handling complexity, and preserving timing margins in space-constrained industrial designs.
Availability
CY7C10612G30-10ZSXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, and avionics data loggers requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY7C10612G30-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and security solutions.
This device belongs to Infineon's legacy Cypress SRAM product line, designed specifically for high-integrity, high-speed memory applications in industrial automation, medical equipment, and aerospace systems where ECC-enhanced reliability is mandatory.
FAQ
Is CY7C10612G30-10ZSXI pin-compatible with CY7C10612G30-10ZSI?
Yes - both share identical 54-pin TSOP II pinout, electrical characteristics, and functional behavior. The 'X' suffix denotes RoHS-compliant packaging (lead-free terminations and halogen-free molding compound), while the base part number remains functionally identical per Infineon's continuity documentation.
Does this SRAM require external ECC circuitry?
No - it integrates hardware-based single-bit error correction logic directly into the memory array and control path. The ERR pin signals correction events, and no external syndrome generator, decoder, or controller is needed for basic ECC operation.
What is the role of the ERR pin, and is it present on all variants?
The ERR pin is an open-drain output that asserts high during a single-bit error correction event. It is present only on CY7C10612GE variants (including CY7C10612G30-10ZSXI); the base CY7C10612G lacks this pin and provides no error indication.
Can this device operate at 2.5 V or 5 V?
No - it is strictly rated for 3.3 V ± 0.3 V (i.e., 3.0 V to 3.6 V). Operation outside this range violates absolute maximum ratings and may cause data corruption, increased leakage, or permanent damage per the datasheet's DC Electrical Characteristics table.
CY7C10612G30-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C10612G30-10ZSXI FAQ
1.How can I place an order for CY7C10612G30-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C10612G30-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C10612G30-10ZSXI reliable?
The price and inventory of CY7C10612G30-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C10612G30-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C10612G30-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C10612G30-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C10612G30-10ZSXI?
CY7C10612G30-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C10612G30-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C10612G30-10ZSXI?
For technical support, including CY7C10612G30-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C10612G30-10ZSXI requirements.
6.How does Aetrix verify that CY7C10612G30-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C10612G30-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C10612G30-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C10612G30-10ZSXI?
All CY7C10612G30-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C10612G30-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C10612G30-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C10612G30-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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