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Infineon Technologies CY7C10612G30-10ZSXIT
- Part No.:
- CY7C10612G30-10ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C10612G30-10ZSXIT.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:3,571
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Product details
Overview
CY7C10612G30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16) CMOS static RAM with embedded single-bit error-correcting code (ECC), 10 ns access time, 3.3 V ±0.3 V operation, and TTL-compatible I/O. It serves as high-reliability on-board data buffer or cache memory in industrial control modules requiring deterministic timing and data integrity.
For engineers reviewing the CY7C10612G30-10ZSXIT datasheet, CY7C10612G30-10ZSXIT pinout, CY7C10612G30-10ZSXIT application, or CY7C10612G30-10ZSXIT equivalent, key selection criteria include ECC-enabled read reliability, TSOP II package compatibility with legacy PCB footprints, low 20 mA CMOS standby current, and support for byte-wide (BLE/BHE) write masking in real-time systems.
Technical Context
This SRAM implements a synchronous, single-chip-enable architecture with independent byte enable controls (BLE/BHE) for selective 8-bit writes to lower or upper data words. Its embedded ECC logic operates transparently during every read cycle, correcting single-bit errors without CPU intervention and asserting ERR only on CY7C10612GE variants.
The device uses standard TTL-level input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and drives outputs to VOH ≥ 2.2 V / VOL ≤ 0.4 V under load, ensuring interoperability with legacy microcontrollers and FPGAs. Data retention is guaranteed at 1.0 V supply down to –40 °C, supporting safe power-loss recovery in mission-critical storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 bits) - supports full-word data buffering for 32-bit MCU peripherals without external multiplexing |
| Access Time (tAA) | 10 ns - enables direct interface with 100 MHz bus clocks without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LDO-regulated industrial power rails |
| Active Current (ICC) | 90 mA typical - limits thermal load in dense memory arrays |
| Standby Current (ISB2) | 20 mA typical - reduces quiescent power in always-on edge nodes |
| Data Retention Voltage | 1.0 V - maintains memory state during brown-out conditions lasting >100 ms |
| ECC Function | Single-bit error correction + detection - eliminates soft-error-induced firmware crashes in radiation-prone environments |
Pinout & Package
Package: 54-pin TSOP II (1.0 mm height), JEDEC MO-141AC compliant, lead-free (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus selects one of 1M locations; A19 enables full 16-Mbit addressing |
| I/O0–I/O7 | Data Bus (Lower Byte) | Bi-directional 8-bit data path controlled by BLE; high-impedance when BLE/CE/OE inactive |
| I/O8–I/O15 | Data Bus (Upper Byte) | Bi-directional 8-bit data path controlled by BHE; independent of lower byte for interleaved writes |
| CE | Chip Enable | Active-low global enable; automatic power-down mode when high (ISB2 = 20 mA) |
| OE | Output Enable | Active-low read strobe; disables outputs (high-Z) when high, regardless of CE state |
| WE | Write Enable | Active-low write strobe; latches data on rising edge when CE and BLE/BHE are asserted |
| BLE / BHE | Byte Enable Controls | Independent active-low enables for lower/upper data bytes; allows partial-word writes without read-modify-write |
| VCC / VSS | Power / Ground | Separate VCC pins per side (pins 4, 12, 29, 43, 52) reduce IR drop; dual VSS (pins 1, 31, 46, 54) improve noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Corrects single-bit errors in real time during every read cycle-no software overhead or latency penalty |
| Byte-selectable write architecture | BLE/BHE pins enable true 8-bit writes to either half of the 16-bit word, eliminating bus contention in multi-master systems |
| Low-voltage data retention | Maintains stored data at 1.0 V supply, enabling graceful shutdown and fast resume after power interruption |
| TTL-compatible signaling | Accepts standard 0.8 V / 2.0 V logic thresholds and drives 2.2 V / 0.4 V levels-interoperable with legacy 3.3 V microcontrollers |
| Automatic CE power-down | Reduces ICC to 20 mA (ISB2) when CE is deasserted-no external power management required |
Applications
| Industrial PLC Memory Buffer | Railway Signaling Data Cache |
|---|---|
Use Scenario: Storing real-time I/O status and configuration registers in programmable logic controllers operating in wide-temperature environments. IC Role / Device Role / Timing Role: High-speed, ECC-protected SRAM providing deterministic 10 ns read/write access for scan-cycle execution. Use Value: Prevents undetected memory corruption from EMI in factory-floor cabinets, reducing unplanned downtime. | Use Scenario: Caching critical train position and signal state data in wayside electronic interlocking units. IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM holding safety-critical variables during brief AC mains interruptions. Use Value: Enables 100 ms+ data retention at 1.0 V, meeting EN 5012x functional safety requirements without backup batteries. |
| Medical Imaging Frame Buffer | Avionics Display Controller Memory |
Use Scenario: Temporary storage of digitized X-ray or ultrasound frames before compression and transfer to host processor. IC Role / Device Role / Timing Role: Low-latency 16-bit parallel memory interfaced directly to image sensor ASICs. Use Value: 10 ns tAA eliminates frame-drop risk during high-throughput acquisition (≥30 fps). | Use Scenario: Holding display list and glyph data in DO-254-compliant cockpit display processors. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with ECC used for HUD rendering buffers in high-altitude flight. Use Value: Single-event upset (SEU) mitigation via hardware ECC meets DAL-B assurance level for display integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-10TIN | No embedded ECC; 10 ns access, same 1M × 8 density but requires two devices for 16-bit width | Lacks hardware error correction-requires software ECC or external logic for fault tolerance | Select when cost sensitivity outweighs reliability requirements and board space permits dual-package layout |
| IS61WV102416BLL-10MLI | 10 ns access, 1M × 16, no ECC, 3.3 V, but uses 48-pin TSOP I (smaller footprint, different pinout) | Higher leakage (ISB2 = 45 µA vs. 20 mA) but lacks ECC-unsuitable for safety-critical contexts | Choose for space-constrained designs where ECC is handled externally and ultra-low standby current is prioritized |
Compared with AS6C1008-10TIN and IS61WV102416BLL-10MLI, CY7C10612G30-10ZSXIT uniquely integrates ECC in a pin-compatible 54-pin TSOP II package, delivering verified single-bit correction without increasing system complexity or footprint.
Availability
CY7C10612G30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, railway signaling data caches, and medical imaging frame buffers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C10612G30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This device belongs to Infineon's legacy Cypress SRAM product line, designed specifically for high-reliability, ECC-enabled data storage in industrial automation, transportation, and medical equipment where bit errors must be corrected in hardware.
FAQ
Is CY7C10612G30-10ZSXIT pin-compatible with CY7C10612G30-10ZSXI?
Yes. Both share identical 54-pin TSOP II pinout, electrical specifications, and ECC functionality. The "T" suffix in CY7C10612G30-10ZSXIT denotes tape-and-reel packaging for automated assembly, while "I" indicates tray packaging-no electrical or mechanical differences exist between them.
Does this SRAM require external ECC circuitry?
No. The CY7C10612G30-10ZSXIT contains fully integrated ECC logic that automatically detects and corrects single-bit errors during every read operation. No external syndrome generator, checker, or correction logic is needed-ECC is transparent to the host controller.
What is the function of the ERR pin on this part?
The ERR pin is not present on CY7C10612G30-10ZSXIT. It is exclusive to the CY7C10612GE variant. This part (G30-10ZSXIT) is the ECC-enabled base version without ERR output-error correction occurs silently without external indication.
Can this SRAM operate at 2.5 V supply?
No. The device is specified only for 3.3 V ± 0.3 V operation (3.0 V to 3.6 V). Operation outside this range violates Absolute Maximum Ratings and may cause data corruption, excessive leakage, or permanent damage. It is not rated for 2.5 V or 1.8 V interfaces.
CY7C10612G30-10ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C10612G30-10ZSXIT FAQ
1.How can I place an order for CY7C10612G30-10ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C10612G30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C10612G30-10ZSXIT reliable?
The price and inventory of CY7C10612G30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C10612G30-10ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C10612G30-10ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C10612G30-10ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C10612G30-10ZSXIT?
CY7C10612G30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C10612G30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C10612G30-10ZSXIT?
For technical support, including CY7C10612G30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C10612G30-10ZSXIT requirements.
6.How does Aetrix verify that CY7C10612G30-10ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C10612G30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C10612G30-10ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C10612G30-10ZSXIT?
All CY7C10612G30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C10612G30-10ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C10612G30-10ZSXIT part is unused and in its original packaging.
Return procedure for CY7C10612G30-10ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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