Infineon Technologies CY7C1061AV33-10BAXI
- Part No.:
- CY7C1061AV33-10BAXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
CY7C1061AV33-10BAXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 60FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061AV33-10BAXI from Cypress Semiconductor is a 16-Mbit (1,048,576 × 16) asynchronous CMOS static RAM with 3.3 V ±0.3 V supply, 10 ns access time (tAA), 2.0 V data retention, and dual chip enable (CE1/CE2) for bank selection in memory expansion. It operates across –40°C to +85°C and supports byte-wide writes via BHE/BLE controls in industrial embedded systems requiring deterministic timing and low-power standby.
For engineers reviewing the CY7C1061AV33-10BAXI datasheet, CY7C1061AV33-10BAXI pinout, CY7C1061AV33-10BAXI application, or CY7C1061AV33-10BAXI equivalent, key selection criteria include tAA = 10 ns read latency, ISB2 = 50 mA CMOS power-down current, FBGA-60 package compatibility, and byte-selectable I/O (IO0–IO7 / IO8–IO15) for 16-bit bus partitioning.
Technical Context
This SRAM implements a fully asynchronous interface with independent byte enables (BHE/BLE) enabling simultaneous upper- and lower-byte write operations without bus contention. Address decoding uses a 20-bit address bus (A0–A19) to access the 1M-word array, with CE1/CE2 logic supporting hierarchical memory mapping in multi-bank architectures.
Power management includes two automatic standby modes: ISB1 (TTL-input triggered, 70 mA max) and ISB2 (CMOS-input triggered, 50 mA max), activated when CE2 ≤ 0.3 V and CE1 is inactive. Data retention at 2.0 V allows operation during brown-out conditions while preserving contents.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16) - supports 2 MB of contiguous 16-bit data storage |
| Access Time (tAA) | 10 ns - guarantees data valid within 10 ns of stable address assertion under VCC = 3.3 V |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and LVCMOS 3.3 V I/O domains |
| Data Retention Voltage | 2.0 V - maintains stored data during low-voltage hold mode without refresh |
| Standby Current (ISB2) | 50 mA max - enables ultra-low-power sleep in battery-backed or energy-constrained systems |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade reliability in harsh environments |
| Package | 60-ball FBGA (10 mm × 13 mm, 0.8 mm pitch) - high-density footprint for space-constrained PCBs |
Pinout & Package
The CY7C1061AV33-10BAXI is packaged in a 60-ball fine-pitch ball grid array (FBGA) per package diagram 51-85162, with 0.8 mm pitch and 10 mm × 13 mm body size. Pin assignments follow JEDEC MO-245 standards, with NC (no-connect) and DNU (do-not-use) balls explicitly defined in the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus selecting one of 1,048,576 memory locations |
| IO0–IO7 | Lower-Byte Bidirectional Data | Driven by memory during reads or accepted as input during BLE = LOW writes |
| IO8–IO15 | Upper-Byte Bidirectional Data | Driven by memory during reads or accepted as input during BHE = LOW writes |
| CE1 / CE2 | Chip Enable Controls | Active-low CE1 and active-high CE2 together enable device; CE2 = LOW forces power-down |
| WE | Write Enable | LOW initiates write cycle; HIGH enables read or high-Z output state |
| OE | Output Enable | LOW enables data output on IO pins; HIGH places outputs in high-impedance state |
| BLE / BHE | Byte Low/High Enable | Independent control of lower/upper 8-bit data lanes for partial writes |
| VCC / VSS | Power / Ground | 3.3 V supply (VCC) and ground (VSS) distributed across multiple balls for low-noise operation |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Byte-Selectable Writes | Enables 8-bit sub-word writes using BLE/BHE without affecting adjacent bytes |
| Dual Chip Enable Architecture | CE1/CE2 logic allows hierarchical memory banking and seamless expansion beyond 16 Mbit |
| Low-Power Standby Modes | ISB2 = 50 mA at CMOS inputs ensures minimal leakage during extended idle periods |
| TTL-Compatible I/O | VIH = 2.0 V min and VOL = 0.4 V max ensure interoperability with legacy 3.3 V logic families |
| 2.0 V Data Retention | Maintains stored content during brown-out or backup power mode without external circuitry |
Applications
| Industrial PLC Memory Buffer | Automotive Infotainment Cache |
|---|---|
Use Scenario: Real-time I/O data buffering in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state 16-bit data storage for cyclic process image updates. Use Value: 10 ns tAA ensures full memory access within single CPU clock cycle at 100 MHz bus speeds. | Use Scenario: Temporary storage for audio frame buffers and UI rendering metadata in head-unit systems. IC Role / Device Role / Timing Role: Non-refreshing cache holding compressed audio segments and display tile descriptors. Use Value: 2.0 V data retention preserves critical boot configuration during ignition cycling. |
| Medical Imaging Frame Store | Avionics Sensor Data Logger |
Use Scenario: Storing raw pixel data from ultrasound or X-ray sensor arrays before compression and transmission. IC Role / Device Role / Timing Role: High-speed parallel memory interfaced directly to ADC output buses for burst capture. Use Value: Dual CE enables interleaved access between acquisition and processing engines without arbitration. | Use Scenario: Recording inertial measurement unit (IMU) and GPS timestamps in flight data recorders. IC Role / Device Role / Timing Role: Radiation-tolerant buffer storing timestamped telemetry during power transitions. Use Value: ISB2 = 50 mA standby current extends battery life during 30-day unpowered storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-10TIN | 1 M × 8 organization, 10 ns tAA, 3.3 V only, 32-pin TSOP-I | Half the data width; requires two devices for 16-bit bus; no BHE/BLE support | Select when board layout favors narrow packages and byte-level granularity is sufficient |
| IS61LV102416-10ML | 1 M × 16 organization, 10 ns tAA, 3.3 V, 54-pin TSOP-II | Same density and timing but lacks CE2 control and 2.0 V retention; higher ISB = 100 mA | Choose for cost-sensitive designs where FBGA footprint is not required and power budget allows |
Compared with AS6C1008-10TIN and IS61LV102416-10ML, the CY7C1061AV33-10BAXI uniquely combines FBGA packaging, dual CE architecture, and 2.0 V data retention-enabling compact, expandable, and brown-out-resilient memory subsystems in industrial and automotive platforms.
Availability
CY7C1061AV33-10BAXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive infotainment caches, and medical imaging frame stores requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1061AV33-10BAXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with headquarters in San Jose, CA.
The CY7C1061AV33 belongs to Cypress's high-speed asynchronous SRAM product line, engineered for deterministic timing, low-power standby, and robust operation in mission-critical embedded systems requiring nonvolatile-like data persistence without refresh overhead.
FAQ
What is the minimum VCC required to initiate a read or write operation?
The device requires VCC ≥ 3.0 V to begin normal operation. After power reaches this threshold, a 1 ms tpower delay must elapse before any access cycle may start. This ensures internal voltage regulation stabilizes prior to memory access.
Can CY7C1061AV33-10BAXI operate with mixed voltage I/O (e.g., 1.8 V address lines)?
No. All inputs-including address, control, and byte-enable signals-must remain within the specified VIH (2.0 V min) and VIL (0.8 V max) ranges referenced to VCC = 3.3 V. Driving inputs below VIH risks metastability or incomplete activation of internal logic.
How does the CE2 pin affect power states beyond chip disable?
When CE2 is driven LOW (≤ 0.3 V), the device enters ISB2 standby mode regardless of CE1 state, reducing ICC to ≤ 50 mA. This is distinct from CE1-driven selection and provides a dedicated hardware-controlled low-power entry point independent of address/control timing.
Is the 60-ball FBGA package RoHS-compliant and lead-free?
Yes. The "X" suffix in CY7C1061AV33-10BAXI explicitly denotes Pb-free (RoHS-compliant) construction per Cypress's ordering nomenclature. The FBGA package uses matte tin surface finish and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements.
CY7C1061AV33-10BAXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-FBGA (8x20)
CY7C1061AV33-10BAXI FAQ
1.How can I place an order for CY7C1061AV33-10BAXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061AV33-10BAXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061AV33-10BAXI reliable?
The price and inventory of CY7C1061AV33-10BAXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061AV33-10BAXI is usually 5 days.
3.What payment methods are accepted for CY7C1061AV33-10BAXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061AV33-10BAXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061AV33-10BAXI?
CY7C1061AV33-10BAXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061AV33-10BAXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061AV33-10BAXI?
For technical support, including CY7C1061AV33-10BAXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061AV33-10BAXI requirements.
6.How does Aetrix verify that CY7C1061AV33-10BAXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061AV33-10BAXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061AV33-10BAXI meets industry standards.
7.What is the process for return or replacement of CY7C1061AV33-10BAXI?
All CY7C1061AV33-10BAXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061AV33-10BAXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061AV33-10BAXI part is unused and in its original packaging.
Return procedure for CY7C1061AV33-10BAXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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