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Infineon Technologies CY7C1061AV33-10ZXCT

Part No.:
CY7C1061AV33-10ZXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
54-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1061AV33-10ZXCT.pdf
Description:
IC SRAM 16MBIT PAR 54TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,230

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Product details

Overview

CY7C1061AV33-10ZXCT from Cypress Semiconductor is a 16-Mbit (1,048,576 × 16) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V supply, TTL-compatible I/O, and dual chip enable (CE1/CE2) for seamless memory expansion in embedded controllers and industrial data buffers.

For engineers reviewing the CY7C1061AV33-10ZXCT datasheet, CY7C1061AV33-10ZXCT pinout, CY7C1061AV33-10ZXCT application, or CY7C1061AV33-10ZXCT equivalent, key selection factors include byte-level write control via BHE/ BLE, automatic CE-based power-down (ISB2 = 50 mA), 2.0 V data retention, and TSOP II package compatibility with legacy PCB layouts.

Technical Context

This SRAM implements a full asynchronous interface with independent byte enables (BHE/BLE) enabling selective upper- or lower-byte writes without external logic. Address-to-data valid (tAA = 10 ns) and read cycle time (tRC = 10 ns) are guaranteed under commercial temperature range (0°C to +70°C) at VCC = 3.3 V ±0.3 V.

Power management includes two standby modes: ISB1 (70 mA, TTL-input CE threshold) and ISB2 (50 mA, CMOS-input CE threshold), triggered by CE2 ≤ VIL or CE2 ≤ 0.3 V respectively. Input/output pins enter high-impedance state during deselection, OE HIGH, or active write cycles.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 Mbit (1,048,576 words × 16 bits) - supports 2 MB of word-wide data storage
Access Time (tAA)10 ns - enables direct interfacing with 100 MHz bus systems without wait states
Supply Voltage3.3 V ±0.3 V - compatible with standard LVTTL and LVCMOS 3.3 V logic families
Data Retention Voltage2.0 V - maintains stored data during brown-out or low-power suspend modes
Standby Current (ISB2)50 mA - ultra-low quiescent draw when CE2 is asserted and inputs are stable
Input Capacitance (CIN)6 pF (TSOP II) - minimizes signal loading on address/control buses
Output Drive StrengthIOH = –4.0 mA / IOL = 8.0 mA - ensures robust noise margin with 50 Ω transmission lines

Pinout & Package

Package: 54-pin TSOP II (Pb-free), 14 mm × 20 mm body, 0.8 mm pitch, JEDEC MO-143AC compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address Inputs20-bit address bus supporting full 1M-word decoding
IO0–IO7Lower Data I/OBi-directional 8-bit data path enabled only when BLE = LOW
IO8–IO15Upper Data I/OBi-directional 8-bit data path enabled only when BHE = LOW
CE1, CE2Chip Enable InputsActive-LOW CE1 and active-HIGH CE2 form dual-enable gating for bank selection
WEWrite EnableActive-LOW control initiating write cycles; overrides OE during writes
OEOutput EnableActive-LOW control enabling read data output; disabled during writes
BLE, BHEByte Enable InputsIndependent control of lower/upper byte writes - eliminates need for external byte mux
VCC, VSSPower SupplyDual VCC (3.3 V) and VSS pins distributed across package for low-noise operation

Key Features

FeatureDesign Value
Asynchronous Byte-Write ArchitectureEnables partial-word updates without read-modify-write cycles - reduces bus traffic and latency
Dual Chip Enable (CE1/CE2)Supports hierarchical memory mapping and interleaved banking in multi-SRAM systems
Automatic Power-DownReduces current to 50 mA (ISB2) when CE2 is deasserted - no external control logic required
TTL-Compatible I/O LevelsAccepts 0–3.0 V input pulses and drives 2.4 V/0.4 V outputs - interoperable with legacy 3.3 V microcontrollers
2.0 V Data RetentionMaintains stored contents during system sleep or backup battery mode - extends system uptime

Applications

Industrial PLC Data BuffersAutomotive Engine Control Units

Use Scenario: Real-time logging of sensor readings and actuator commands in programmable logic controllers with deterministic timing requirements.

IC Role / Device Role: High-speed, non-volatile-critical buffer storing transient process variables between CPU fetches.

Use Value: 10 ns tAA ensures zero-wait-state operation with ARM9-based controllers; 50 mA ISB2 lowers thermal load during idle scan cycles.

Use Scenario: Storing calibration tables and runtime parameters in engine management systems operating across –40°C to +85°C.

IC Role / Device Role: Temperature-stable SRAM holding fuel injection maps and knock sensor history during cold cranking.

Use Value: Guaranteed 10 ns access at –40°C enables reliable real-time lookup; 2.0 V data retention sustains critical values during 12 V battery dips.

Medical Imaging Frame StoresNetwork Packet Buffering

Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transmission.

IC Role / Device Role: Burst-mode SRAM interfaced directly to ADC/DAC controllers for pixel data staging.

Use Value: Dual byte enables (BHE/BLE) allow parallel 16-bit pixel writes while preserving alignment with 8-bit sensor interfaces.

Use Scenario: Line-rate buffering of Ethernet frames in managed switches before forwarding decision and QoS tagging.

IC Role / Device Role: Low-latency packet memory supporting cut-through switching with sub-10 ns read/write turnaround.

Use Value: tHZOE = 5 ns and tLZWE = 3 ns minimize bus contention windows - critical for 1 Gbps+ throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS61LV102416AL-10TLISame density, 10 ns access, but uses single CE and lacks BHE/BLE - requires external byte gating logicNot suitable for systems requiring independent upper/lower byte writes without added componentsSelect only if board layout lacks space for extra logic and byte-select functionality is unused
ON Semiconductor MC10EL1648DTGECL-level 16-bit latch, not SRAM - no internal memory array, requires external storageUsed in high-speed pipeline registers, not data retention applicationsReject for memory replacement; applicable only in clock-domain crossing or level-shifting roles

Compared with IS61LV102416AL-10TLI and MC10EL1648DTG, CY7C1061AV33-10ZXCT uniquely delivers integrated byte-select SRAM functionality with zero external logic, making it optimal for space-constrained industrial controllers needing deterministic 10 ns access and 2.0 V data retention.

Availability

CY7C1061AV33-10ZXCT is available at Aetrix Electronics and suitable for industrial PLC data buffers, automotive engine control units, and medical imaging frame stores requiring stable component supply and long-term manufacturability.

Supply support for CY7C1061AV33-10ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.

The CY7C1061AV33 belongs to Cypress's high-speed asynchronous SRAM product line, engineered for deterministic timing, low-power standby, and robust operation in harsh environments with wide temperature ranges.

FAQ

What is the minimum VCC required for data retention?

The CY7C1061AV33-10ZXCT retains stored data down to 2.0 V on VCC, verified per datasheet specification. This allows continued memory integrity during brown-out conditions or battery-backed suspend modes without external backup circuitry.

Can CE1 and CE2 be tied together for simplified control?

No - CE1 is active-LOW and CE2 is active-HIGH; tying them together violates the required logic polarity. CE2 must be held HIGH for normal operation, while CE1 controls chip selection. Using both enables hierarchical addressing in multi-chip systems.

Does this SRAM require an external clock signal?

No - the CY7C1061AV33-10ZXCT is fully asynchronous. All operations are controlled by edge- or level-sensitive signals (CE1, CE2, WE, OE, BHE, BLE); no clock input or timing reference is needed.

How does the automatic power-down mode activate?

Automatic power-down activates when CE2 is driven LOW (≤ VIL) while CE1 is HIGH, placing the device in ISB1 (70 mA) mode. If CE2 is driven to ≤ 0.3 V with CMOS-compatible thresholds, ISB2 (50 mA) is entered - both modes disable outputs and reduce internal activity.

CY7C1061AV33-10ZXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
54-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TSOP II

CY7C1061AV33-10ZXCT FAQ

1.How can I place an order for CY7C1061AV33-10ZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1061AV33-10ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1061AV33-10ZXCT reliable?

The price and inventory of CY7C1061AV33-10ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061AV33-10ZXCT is usually 5 days.

3.What payment methods are accepted for CY7C1061AV33-10ZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061AV33-10ZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1061AV33-10ZXCT?

CY7C1061AV33-10ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1061AV33-10ZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1061AV33-10ZXCT?

For technical support, including CY7C1061AV33-10ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061AV33-10ZXCT requirements.

6.How does Aetrix verify that CY7C1061AV33-10ZXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1061AV33-10ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061AV33-10ZXCT meets industry standards.

7.What is the process for return or replacement of CY7C1061AV33-10ZXCT?

All CY7C1061AV33-10ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061AV33-10ZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1061AV33-10ZXCT part is unused and in its original packaging.

Return procedure for CY7C1061AV33-10ZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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