Infineon Technologies CY7C1061AV33-10ZXIT
- Part No.:
- CY7C1061AV33-10ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061AV33-10ZXIT.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:4,532
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061AV33-10ZXIT from Cypress Semiconductor is a 16-Mbit (1M × 16) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, TTL-compatible I/O, and dual chip enable (CE1/CE2) for flexible memory expansion in embedded controllers and industrial data buffers.
For engineers reviewing the CY7C1061AV33-10ZXIT datasheet, CY7C1061AV33-10ZXIT pinout, CY7C1061AV33-10ZXIT application, or CY7C1061AV33-10ZXIT equivalent, key selection criteria include tAA = 10 ns read timing, automatic CE power-down current of 50 mA (ISB2), byte-level write control via BLE/BHE, and Pb-free 54-pin TSOP II packaging for space-constrained PCB layouts.
Technical Context
This SRAM implements a full 1,048,576 × 16-bit array with independent byte-write capability: BLE controls IO0–IO7, BHE controls IO8–IO15. Read operations require CE1 LOW/CE2 HIGH, OE LOW, and WE HIGH; writes require CE1 LOW/CE2 HIGH and WE LOW.
It supports three power states: active (ICC ≤ 275 mA), automatic CE power-down (ISB2 = 50 mA at CMOS input levels), and data retention at 2.0 V (VCCDR). Input/output pins enter high-impedance state during deselection, output disable, or write cycles - ensuring clean bus sharing in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 bits) - supports 2 MB of word-accessible storage for firmware caching or real-time buffer applications. |
| Access Time (tAA) | 10 ns - enables direct interface with 100 MHz microcontrollers without wait states. |
| Supply Voltage | 3.3 V ±0.3 V - compatible with standard LVTTL and LVCMOS logic families; requires no level-shifting circuitry. |
| Data Retention Voltage | 2.0 V - allows low-power suspend modes while preserving memory contents during brown-out conditions. |
| Standby Current (ISB2) | 50 mA - achieved when CE2 ≤ 0.3 V and all inputs held at valid CMOS levels, enabling ultra-low quiescent power in idle states. |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including motor drives and programmable logic controllers. |
| Package | 54-pin TSOP II (Pb-free) - surface-mount footprint with 0.8 mm pitch, optimized for automated assembly and thermal reliability. |
Pinout & Package
The CY7C1061AV33-10ZXIT is packaged in a Pb-free 54-pin Thin Small Outline Package Type II (TSOP II), measuring 18.4 mm × 10.16 mm × 1.2 mm, with gull-wing leads and JEDEC MO-143AC compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word decoding; A0–A19 directly map to internal row/column selection. |
| IO0–IO7 | Bi-directional Data (Lower Byte) | Driven by memory during reads when BLE = LOW; latched into array during writes when BLE = LOW and WE = LOW. |
| IO8–IO15 | Bi-directional Data (Upper Byte) | Driven by memory during reads when BHE = LOW; latched into array during writes when BHE = LOW and WE = LOW. |
| CE1 / CE2 | Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 form a two-signal enable pair - prevents partial selection glitches and enables hierarchical memory decoding. |
| WE | Write Enable | Active-LOW signal that initiates write cycles only when CE1/CE2 are asserted; controls data latch timing and write overlap window. |
| OE | Output Enable | Active-LOW signal enabling output drivers; high-impedance state maintained when OE = HIGH or during write cycles regardless of CE status. |
| BLE / BHE | Byte Low/High Enable | Independent active-LOW controls for lower/upper 8-bit data lanes - enables 8-bit peripheral interfacing without external demultiplexing. |
| VCC / VSS | Power / Ground | Dual VCC pins (pins 16, 37, 49, 51) and multiple VSS pins (pins 17, 29, 36, 44, 54) reduce IR drop and improve noise immunity in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns Access Time | Guaranteed tAA ≤ 10 ns across industrial temperature range - eliminates wait-state insertion for most 32-bit MCU interfaces. |
| Byte-Write Architecture | Independent BLE/BHE controls allow simultaneous or selective 8-bit writes - reduces bus contention and simplifies partial-word updates in protocol stacks. |
| Automatic Power-Down | ISB2 = 50 mA at CMOS input thresholds - eliminates need for external power-gating logic in battery-backed or energy-harvesting systems. |
| TTL-Compatible I/O | VIH = 2.0 V min, VOL = 0.4 V max at IOL = 8 mA - ensures interoperability with legacy 3.3 V microcontrollers and FPGAs without level shifters. |
| Pb-Free TSOP II Packaging | RoHS-compliant 54-pin TSOP II with JESD22-A113 qualification - supports lead-free reflow profiles and long-term supply chain sustainability. |
Applications
| Industrial PLC Data Buffers | Medical Imaging Frame Stores |
|---|---|
Use Scenario: Real-time acquisition of sensor data streams in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: High-speed, non-volatile-critical buffer storing I/O scan results between CPU execution cycles. Use Value: 10 ns tAA and byte-select capability enable sub-microsecond register updates without stalling the main controller bus. | Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transmission. IC Role / Device Role / Timing Role: Asynchronous frame buffer interfacing directly with ADCs and DMA controllers. Use Value: Dual CE architecture isolates memory during system reset, preventing corruption during power sequencing events. |
| Avionics Display Controllers | Test Equipment Pattern Generators |
Use Scenario: Storing display list instructions and pixel attribute tables in ruggedized cockpit displays. IC Role / Device Role / Timing Role: Static RAM serving as instruction/data cache for dedicated graphics sequencers. Use Value: –40°C to +85°C rating and 2.0 V data retention ensure reliable operation during rapid cabin temperature transients. | Use Scenario: Holding stimulus patterns for high-speed digital I/O testing in automated test equipment. IC Role / Device Role / Timing Role: Deterministic-access memory mapped to pattern generator address space. Use Value: tHZOE = 6 ns and tLZOE = 1 ns minimize output enable latency, critical for tight timing margins in 100+ MHz test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-10MLI | Same density, 10 ns speed, but uses single CE and lacks CE2; standby current 35 mA (lower). | No dual-CE glitch immunity; requires redesign of address decode logic for CE routing. | Preferred where board space is constrained and CE2 functionality is unused. |
| Winbond W9825G6JH-10 | 16 Mbit SDRAM, not SRAM; requires refresh, clocked interface, and higher pin count. | Not drop-in - needs controller-side timing engine, command sequencing, and power management changes. | Only viable if system already uses SDRAM infrastructure and cost-per-bit is primary driver. |
Compared with IS61WV102416BLL-10MLI and W9825G6JH-10, the CY7C1061AV33-10ZXIT provides guaranteed asynchronous timing, dual-CE robustness for industrial noise environments, and seamless byte-write control - making it optimal for deterministic real-time buffering where predictability outweighs lowest-cost alternatives.
Availability
CY7C1061AV33-10ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffers, medical imaging frame stores, and avionics display controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1061AV33-10ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and mixed-signal ICs for industrial, automotive, and communications markets, with headquarters in San Jose, CA.
The CY7C1061AV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic, low-latency data buffering in real-time control systems where refresh-free operation and precise timing control are mandatory.
FAQ
What is the minimum VCC required for data retention on CY7C1061AV33-10ZXIT?
The device retains stored data down to 2.0 V (VCCDR), as specified in the DC Electrical Characteristics table. This allows operation in brown-out scenarios where main supply drops temporarily but remains above 2.0 V - no external backup battery or capacitor is needed for short-duration hold.
Can CY7C1061AV33-10ZXIT be used with 2.5 V logic interfaces?
No - the device requires 3.3 V ±0.3 V supply and has TTL-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V). While inputs may accept 2.5 V signals, output drive strength and timing parameters are only guaranteed at VCC = 3.3 V; interfacing with 2.5 V systems requires level translation.
Does CY7C1061AV33-10ZXIT support interleaved read/write operations?
No - it is an asynchronous SRAM with no internal arbitration or pipelining. Read and write cycles are discrete, non-overlapping operations controlled by CE, OE, WE, and byte enables. Concurrent access requires external logic or controller sequencing.
How does the dual CE (CE1/CE2) architecture improve system reliability?
The CE1 (active-LOW) and CE2 (active-HIGH) pair prevents false selection during power-up, reset, or noise spikes: both signals must be simultaneously valid before the device activates. This eliminates partial-enable glitches common with single-CE designs in electrically noisy industrial environments.
CY7C1061AV33-10ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061AV33-10ZXIT FAQ
1.How can I place an order for CY7C1061AV33-10ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061AV33-10ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061AV33-10ZXIT reliable?
The price and inventory of CY7C1061AV33-10ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061AV33-10ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061AV33-10ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061AV33-10ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061AV33-10ZXIT?
CY7C1061AV33-10ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061AV33-10ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061AV33-10ZXIT?
For technical support, including CY7C1061AV33-10ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061AV33-10ZXIT requirements.
6.How does Aetrix verify that CY7C1061AV33-10ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061AV33-10ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061AV33-10ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061AV33-10ZXIT?
All CY7C1061AV33-10ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061AV33-10ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061AV33-10ZXIT part is unused and in its original packaging.
Return procedure for CY7C1061AV33-10ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061AV33-10ZXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

