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Infineon Technologies CY7C1061AV33-12ZXC
- Part No.:
- CY7C1061AV33-12ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061AV33-12ZXC.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:3,439
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Product details
Overview
CY7C1061AV33-12ZXC from Cypress Semiconductor is a 16-Mbit (1M × 16) asynchronous CMOS static RAM operating at 3.3 V ±0.3 V, with 12 ns maximum access time (tAA), 2.0 V data retention, TTL-compatible I/O, and dual chip enable (CE1/CE2) for seamless memory expansion in embedded control and industrial systems.
For engineers reviewing the CY7C1061AV33-12ZXC datasheet, CY7C1061AV33-12ZXC pinout, CY7C1061AV33-12ZXC application, or CY7C1061AV33-12ZXC equivalent, key selection criteria include byte-level write control (BHE/ BLE), automatic CE power-down current (50 mA ISB2), high-impedance I/O behavior during deselect/write, and Pb-free 54-pin TSOP II packaging for space-constrained PCB layouts.
Technical Context
The CY7C1061AV33-12ZXC implements a full 1M × 16-bit memory array with independent byte write capability via BHE (IO8–IO15) and BLE (IO0–IO7), enabling partial-word updates without read-modify-write cycles. Its dual CE architecture (CE1 active-low, CE2 active-high) supports hierarchical memory decoding and bank selection in multi-SRAM systems.
It features three distinct power states: active (ICC ≤ 260 mA), automatic CE power-down (ISB2 = 50 mA at CMOS input levels), and data retention (VCCDR = 2.0 V). All I/O pins enter high-impedance state during deselect (CE1 HIGH/CE2 LOW), OE HIGH, BHE/ BLE HIGH, or active write (WE LOW).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 bits) - supports 2 MB of word-addressable storage for firmware buffers or real-time data logging. |
| Access Time (tAA) | 12 ns max - enables direct interface with 80 MHz microcontrollers without wait states. |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and LVCMOS logic families. |
| Data Retention Voltage | 2.0 V - maintains stored data during brown-out or low-power sleep modes. |
| Standby Current (ISB2) | 50 mA max - ensures ultra-low quiescent power when deselected with CMOS-level inputs. |
| I/O Interface | TTL-compatible inputs/outputs - eliminates need for level-shifting circuitry in mixed-voltage designs. |
| Package | 54-pin TSOP II (Pb-free) - surface-mount footprint optimized for automated assembly and thermal reliability. |
Pinout & Package
Package: 54-pin Thin Small Outline Package Type II (TSOP II), Pb-free, JEDEC MO-143AC compliant, body size 22.2 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A16–A19 used only in 1M×16 configuration. |
| IO0–IO7 | Data I/O (Lower Byte) | Bidirectional 8-bit data path enabled by BLE; high-impedance when BLE HIGH or device deselected. |
| IO8–IO15 | Data I/O (Upper Byte) | Bidirectional 8-bit data path enabled by BHE; independent control allows partial-word writes. |
| CE1, CE2 | Chip Enable Inputs | Complementary enables (CE1 LOW + CE2 HIGH = active); enables hierarchical memory mapping and bank isolation. |
| WE | Write Enable | Active-low signal initiating write cycle; overlapping CE and WE defines write window per truth table. |
| OE | Output Enable | Active-low control for output drivers; outputs go high-Z when OE HIGH, even if CE active. |
| BLE, BHE | Byte Enable Inputs | Independent lower/upper byte gating; both LOW enables full 16-bit access; critical for MISRA-compliant memory writes. |
| VCC, VSS | Power Supply Pins | Multiple VCC (pins 15, 31, 44, 47, 51) and VSS (pins 14, 30, 37, 48, 53) pins reduce IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Byte-selectable write | Independent BHE/BLE control enables 8-bit or 16-bit writes without external logic or software masking. |
| Automatic CE power-down | Reduces ICC to 50 mA (ISB2) when CE2 ≤ 0.3 V and CE1 > VCC – 0.3 V - no external control required. |
| 2.0 V data retention | Maintains valid memory contents during VCC brown-out down to 2.0 V - supports fail-safe shutdown sequences. |
| TTL-compatible I/O | VIH = 2.0 V min, VOL = 0.4 V max - interoperates directly with legacy 3.3 V microcontrollers and FPGAs. |
| Pb-free TSOP II package | RoHS-compliant 54-pin TSOP II footprint - meets IPC-7351B standards for reflow and mechanical reliability. |
Applications
| Industrial PLC Data Buffers | Automotive Body Control Modules |
|---|---|
Use Scenario: Storing real-time sensor logs and actuator command history in programmable logic controllers with deterministic 12 ns read latency. IC Role / Device Role / Timing Role: Asynchronous SRAM providing non-blocking, byte-granular data storage with zero wait-state access for ARM Cortex-M4-based control cores. Use Value: Enables deterministic 12 ns memory access for time-critical motion control loops while supporting partial-word writes to reduce bus traffic. | Use Scenario: Holding CAN message buffers and configuration registers in automotive body domain controllers operating across –40°C to +85°C. IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM serving as fast-access scratchpad for ECUs requiring guaranteed data integrity during ignition cycling. Use Value: 2.0 V data retention preserves critical fault codes and calibration data during battery disconnect events. |
| Medical Imaging Frame Stores | Test & Measurement Equipment FIFOs |
Use Scenario: Acting as line buffer between ADC front-end and FPGA image processor in portable ultrasound devices. IC Role / Device Role / Timing Role: High-speed 16-bit parallel SRAM interfacing directly to FPGA I/O banks for burst-mode pixel streaming. Use Value: 12 ns tAA and TTL-compatible drive strength eliminate timing closure issues at 80 MHz pixel clock rates. | Use Scenario: Implementing deep sample capture buffers in handheld oscilloscopes with multi-channel analog front-ends. IC Role / Device Role / Timing Role: Dual-port-capable SRAM (via CE/OE/WE sequencing) used as circular buffer for real-time waveform acquisition. Use Value: Independent BHE/BLE enables simultaneous 8-bit channel A and 8-bit channel B storage without interleaving overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416AL-12MLI | 12 ns tAA, same 1M×16 organization, but uses single CE and lacks BHE/ BLE; 3.3 V only, 54-pin TSOP II. | No byte-write capability - requires external logic or software masking for partial-word updates. | Select when system design does not require independent upper/lower byte control and cost optimization is prioritized. |
| Winbond W9812G6JH-12 | SDRAM, not SRAM; 12 ns CL = 2, requires refresh and initialization; 60-ball FBGA only. | Not pin- or function-compatible; introduces controller complexity and power-up sequence dependencies. | Choose only for high-density, cost-sensitive applications where refresh overhead and timing predictability are acceptable trade-offs. |
Compared with IS61LV102416AL-12MLI, CY7C1061AV33-12ZXC provides true byte-selectable writes and lower standby current (50 mA vs. 75 mA), while Winbond W9812G6JH-12 trades deterministic latency for density and cost - making CY7C1061AV33-12ZXC optimal for real-time deterministic systems.
Availability
CY7C1061AV33-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffers, automotive body control modules, and medical imaging frame stores requiring stable component supply, RoHS compliance, and long-term lifecycle support.
Supply support for CY7C1061AV33-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY7C1061AV33 series targets deterministic, low-latency memory applications in safety-critical embedded systems where asynchronous access, byte granularity, and data retention under brown-out conditions are essential.
FAQ
What is the minimum VCC required to retain data in CY7C1061AV33-12ZXC?
The device guarantees data retention down to 2.0 V (VCCDR), as specified in the DC Electrical Characteristics table. Below this voltage, memory contents are not assured. This feature enables safe operation during controlled power-down sequences and brown-out recovery without external backup power.
Can CY7C1061AV33-12ZXC be used with a 2.5 V microcontroller interface?
No - the device requires 3.3 V ±0.3 V supply and has TTL-compatible input thresholds (VIH min = 2.0 V, VIL max = 0.8 V), but its outputs swing rail-to-rail (VOH min = 2.4 V, VOL max = 0.4 V) and are not 2.5 V tolerant. Direct connection to 2.5 V logic requires level translation.
Does CY7C1061AV33-12ZXC support concurrent read and write operations?
No - it is a single-port asynchronous SRAM with no built-in dual-port or pipelined architecture. Read and write operations are mutually exclusive and governed by the truth table; attempting simultaneous access results in undefined data or bus contention.
How many VCC and VSS pins does the 54-pin TSOP II package have?
The 54-pin TSOP II package has five VCC pins (15, 31, 44, 47, 51) and five VSS pins (14, 30, 37, 48, 53), distributed to minimize power supply inductance and improve noise immunity in high-speed parallel bus applications.
CY7C1061AV33-12ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061AV33-12ZXC FAQ
1.How can I place an order for CY7C1061AV33-12ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061AV33-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061AV33-12ZXC reliable?
The price and inventory of CY7C1061AV33-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061AV33-12ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1061AV33-12ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061AV33-12ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061AV33-12ZXC?
CY7C1061AV33-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061AV33-12ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061AV33-12ZXC?
For technical support, including CY7C1061AV33-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061AV33-12ZXC requirements.
6.How does Aetrix verify that CY7C1061AV33-12ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1061AV33-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061AV33-12ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1061AV33-12ZXC?
All CY7C1061AV33-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061AV33-12ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061AV33-12ZXC part is unused and in its original packaging.
Return procedure for CY7C1061AV33-12ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061AV33-12ZXC Tags
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STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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STMicroelectronics
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