Infineon Technologies CY7C1061AV33-12ZXCT
- Part No.:
- CY7C1061AV33-12ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061AV33-12ZXCT.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:2,771
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061AV33-12ZXCT from Cypress Semiconductor is a 16-Mbit (1,048,576 × 16) asynchronous CMOS static RAM with 3.3 V ±0.3 V supply, 12 ns maximum access time (tAA), 2.0 V data retention, and automatic CE-controlled power-down. It supports byte-wide writes via independent BLE/BHE controls and operates across commercial temperature range (0°C to +70°C) in a Pb-free 54-pin TSOP II package. Used in legacy embedded controllers requiring fast, low-power, non-volatile SRAM buffering.
For engineers reviewing the CY7C1061AV33-12ZXCT datasheet, CY7C1061AV33-12ZXCT pinout, CY7C1061AV33-12ZXCT application, or CY7C1061AV33-12ZXCT equivalent, key selection criteria include tAA = 12 ns read timing, dual chip enable (CE1/CE2) logic for memory expansion, TTL-compatible I/O levels, and 50 mA CMOS standby current at VCC = 3.3 V.
Technical Context
This SRAM implements a fully asynchronous interface with no internal clocks or refresh circuitry. Read and write operations are controlled solely by CE1, CE2, OE, WE, BLE, and BHE signals - enabling deterministic timing without clock domain constraints. Address decoding is performed by dedicated row/column decoders driving a 1M × 16 memory array.
Power management relies on two distinct standby modes: ISB1 (TTL-input CE power-down, 70 mA max) and ISB2 (CMOS-input CE power-down, 50 mA max). Data retention at 2.0 V is guaranteed with tCDR ≥ 1 ms after VCC drop, and all I/O pins enter high-impedance state during deselection, output disable, or active write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 bits) - supports 2 MB of word-addressable storage without external address multiplexing. |
| Access Time (tAA) | 12 ns max - enables direct interfacing with 80 MHz bus systems without wait states. |
| Supply Voltage | 3.3 V ±0.3 V - compatible with standard LVTTL and LVCMOS 3.3 V I/O domains. |
| Data Retention Voltage | 2.0 V min - allows low-power suspend mode with battery backup or brown-out resilience. |
| Standby Current (ISB2) | 50 mA max - ensures ultra-low quiescent power during inactive periods in portable equipment. |
| Operating Temperature | 0°C to +70°C - qualified for commercial-grade industrial control panels and telecom line cards. |
| Package | 54-pin TSOP II (Pb-free) - surface-mount compatible with standard reflow profiles and automated assembly. |
Pinout & Package
Package: 54-pin Thin Small Outline Package Type II (TSOP II), Pb-free, body size 10.16 mm × 20.00 mm × 1.20 mm, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; no multiplexing required. |
| IO0–IO15 | Bidirectional Data Bus | 16-bit parallel I/O; high-impedance during deselect, OE HIGH, or write cycles. |
| CE1, CE2 | Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 form dual-enable logic for hierarchical memory mapping. |
| WE | Write Enable | Active-LOW signal initiating write; overlaps with CE1/CE2 to define write window. |
| OE | Output Enable | Active-LOW control for read data output; independent of CE state for flexible timing. |
| BLE, BHE | Byte Low/High Enable | Independent 8-bit write masking: BLE controls IO0–IO7; BHE controls IO8–IO15. |
| VCC, VSS | Power Supply | Single 3.3 V supply with multiple VCC/VSS pins for noise reduction and current distribution. |
| NC, DNU | No Connect / Do Not Use | NC pins unconnected internally; DNU pins must be tied to VSS or left floating per datasheet. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous operation | No clock required - eliminates timing synchronization overhead in microcontroller-bus interfaces. |
| Dual chip enable (CE1/CE2) | Enables seamless memory expansion up to 4 devices using shared address/data buses and decoded CE lines. |
| Independent byte write control | BLE/BHE allow partial-word writes without read-modify-write cycles, reducing bus traffic and latency. |
| TTL-compatible I/O | VIH = 2.0 V min and VOL = 0.4 V max ensure interoperability with legacy 3.3 V microcontrollers and FPGAs. |
| Automatic power-down | ISB2 = 50 mA at VCC = 3.3 V when CE2 ≤ 0.3 V - reduces idle power in always-on edge nodes. |
Applications
| Industrial PLC Memory Buffer | Legacy Telecom Line Card Cache |
|---|---|
Use Scenario: Stores real-time I/O status and configuration registers in programmable logic controllers with 8-bit microprocessor buses. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state read/write access to volatile working memory mapped at fixed address ranges. Use Value: 12 ns tAA ensures deterministic response to scan-cycle interrupts; 2.0 V data retention maintains register state during brief AC dropout events. | Use Scenario: Caches packet header metadata and channel assignment tables in T1/E1 framing ICs operating at 2.048 MHz. IC Role / Device Role / Timing Role: Byte-selectable SRAM interfaced directly to ASIC data buses with independent BLE/BHE for header vs payload updates. Use Value: Dual CE logic isolates this SRAM from other memory-mapped peripherals during burst transfers, preventing bus contention. |
| Medical Imaging Control Panel | Automotive Infotainment Head Unit |
Use Scenario: Holds UI state variables and touchscreen calibration coefficients in diagnostic equipment with ARM7-based controllers. IC Role / Device Role / Timing Role: Non-refreshing memory buffer accessed via GPIO-emulated parallel bus with software-controlled CE timing. Use Value: Pb-free TSOP II package meets RoHS compliance for medical device certification; 50 mA ISB2 extends battery runtime in portable units. | Use Scenario: Stores audio codec configuration and equalizer presets in head units using Renesas SH-4 processors. IC Role / Device Role / Timing Role: Word-wide SRAM mapped into processor's external memory space with OE-controlled read strobes synchronized to audio frame boundaries. Use Value: 3.3 V supply compatibility eliminates level-shifting components; tHZOE = 6 ns ensures clean data capture during rapid preset switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102416-12TQLI | 12 ns tAA, same density/package, but requires VCC = 3.3 V ±0.15 V (tighter tolerance); ISB = 30 mA typical. | Lower standby current suits battery-backed systems; tighter VCC spec demands improved regulation. | Select when lower ISB justifies added PSU precision and qualification effort. |
| AS6C1008-12ZIN | 12 ns tAA, 1M × 8 organization; requires two devices for 16-bit bus; 54-pin TSOP II, Pb-free. | Needs external byte-width glue logic or dual-device address mirroring; higher board area cost. | Select only if existing design uses 8-bit SRAMs and layout cannot accommodate 16-bit width. |
Compared with IS61LV102416-12TQLI and AS6C1008-12ZIN, CY7C1061AV33-12ZXCT offers native 16-bit width with dual CE logic and guaranteed 2.0 V data retention - simplifying bus interface design and enhancing robustness in voltage-variable environments.
Availability
CY7C1061AV33-12ZXCT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, legacy telecom line card caches, and medical imaging control panels requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1061AV33-12ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY7C1061AV33 belongs to Cypress's legacy asynchronous SRAM product line, engineered for pin-compatible replacement of older 3.3 V SRAMs in systems where deterministic timing, low standby power, and data retention under brown-out conditions are critical.
FAQ
What is the minimum VCC required for valid read/write operation?
The device requires VCC ≥ 3.0 V for functional operation. Valid SRAM access begins 1 ms after VCC reaches 3.0 V (tpower). Below 3.0 V, only data retention at 2.0 V is guaranteed - no read/write is permitted. This threshold is defined in the "AC Test Loads and Waveforms" section and verified across temperature and process corners.
Can CE1 and CE2 be driven by the same signal?
No - CE1 is active-LOW and CE2 is active-HIGH; driving them with identical logic levels violates the required dual-enable condition (CE1 = LOW AND CE2 = HIGH). Doing so forces the device into power-down mode (ISB) or high-impedance state. Proper decoding requires complementary CE signals or a simple inverter between them.
How does byte write control interact with OE during mixed read/write sequences?
OE controls output driver enable independently of BLE/BHE. During a write, OE must be HIGH to prevent bus contention; BLE/BHE then gate which byte lanes accept input data. During a read, OE must be LOW to enable outputs, and BLE/BHE determine which byte lanes drive valid data - allowing simultaneous read of one byte and write to another in pipelined protocols.
Is the 54-pin TSOP II package RoHS-compliant?
Yes - the "ZXC" suffix in CY7C1061AV33-12ZXCT explicitly denotes Pb-free (RoHS-compliant) construction per Cypress ordering nomenclature. The package uses matte tin lead finish and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) for standard reflow processing.
CY7C1061AV33-12ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061AV33-12ZXCT FAQ
1.How can I place an order for CY7C1061AV33-12ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061AV33-12ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061AV33-12ZXCT reliable?
The price and inventory of CY7C1061AV33-12ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061AV33-12ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C1061AV33-12ZXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061AV33-12ZXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061AV33-12ZXCT?
CY7C1061AV33-12ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061AV33-12ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061AV33-12ZXCT?
For technical support, including CY7C1061AV33-12ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061AV33-12ZXCT requirements.
6.How does Aetrix verify that CY7C1061AV33-12ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1061AV33-12ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061AV33-12ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1061AV33-12ZXCT?
All CY7C1061AV33-12ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061AV33-12ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061AV33-12ZXCT part is unused and in its original packaging.
Return procedure for CY7C1061AV33-12ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061AV33-12ZXCT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

