Infineon Technologies CY7C1061AV33-12ZXIT
- Part No.:
- CY7C1061AV33-12ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061AV33-12ZXIT.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:2,046
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Product details
Overview
CY7C1061AV33-12ZXIT from Cypress Semiconductor is a 16-Mbit (1,048,576 × 16) asynchronous CMOS static RAM with 3.3 V ±0.3 V supply, 12 ns maximum access time (tAA), 2.0 V data retention, and dual chip enable (CE1/CE2) for flexible memory expansion. It operates in industrial temperature range (–40°C to +85°C) and supports byte-wide writes via BHE/ BLE controls in embedded control, networking buffers, and FPGA configuration storage.
For engineers reviewing the CY7C1061AV33-12ZXIT datasheet, CY7C1061AV33-12ZXIT pinout, CY7C1061AV33-12ZXIT application, or CY7C1061AV33-12ZXIT equivalent, key selection criteria include tAA = 12 ns timing, automatic CE power-down current (ISB2 = 50 mA), TTL-compatible I/O levels, and Pb-free 54-pin TSOP II packaging with verified industrial-grade reliability.
Technical Context
This SRAM implements a full asynchronous interface with independent byte enables (BHE/BLE) enabling selective upper- or lower-byte writes without read-modify-write cycles. Its dual CE architecture (CE1 active-low, CE2 active-high) allows hierarchical memory mapping and seamless bank switching in multi-chip systems.
The device features automatic power-down when deselected (CE1 HIGH/CE2 LOW or CE1 LOW/CE2 LOW), delivering ISB2 = 50 mA standby current at VCC = 3.3 V. Data retention is guaranteed down to 2.0 V, supported by internal voltage regulation and tCDR > 1 ms minimum retention delay after VCC drop.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16) - supports 2 MB of word-addressable storage for real-time buffering |
| Access Time (tAA) | 12 ns - enables direct interfacing with 80 MHz bus systems without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and LVCMOS logic families |
| Data Retention Voltage | 2.0 V - maintains stored data during brown-out or low-power sleep modes |
| Standby Current (ISB2) | 50 mA - ensures ultra-low leakage during deselected operation in battery-backed systems |
| Operating Temperature | –40°C to +85°C - qualified for industrial control, motor drives, and telecom infrastructure |
| Package | 54-pin TSOP II (Pb-free) - surface-mount compatible with automated reflow assembly |
Pinout & Package
Package: 54-pin Thin Small Outline Package Type II (TSOP II), Pb-free, body size 10.16 mm × 20.00 mm × 1.20 mm, JEDEC MO-143AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word decoding; A19 selects highest memory block |
| IO0–IO7 | Lower Byte Data I/O | Bidirectional 8-bit data path enabled only when BLE = LOW during read/write |
| IO8–IO15 | Upper Byte Data I/O | Bidirectional 8-bit data path enabled only when BHE = LOW during read/write |
| CE1, CE2 | Chip Enable Controls | Active-Low CE1 and Active-High CE2 together enable chip; CE2 = LOW forces power-down regardless of CE1 |
| WE | Write Enable | Active-Low signal initiating write cycle; overlapping CE1/CE2 activation required |
| OE | Output Enable | Active-Low control for output drivers; high-Z state when OE = HIGH or chip deselected |
| VCC, VSS | Power Supply | Single 3.3 V supply with dedicated VSS pins per side for noise reduction and signal integrity |
| NC, DNU | No-Connect / Do Not Use | NC pins are unconnected on die; DNU pins must be tied to VSS or left floating per datasheet |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Byte-Controlled Writes | Independent BHE/BLE enables true 8-bit partial writes without disturbing adjacent bytes |
| Dual Chip Enable Architecture | CE1/CE2 logic permits hierarchical memory banking and seamless expansion beyond 16 Mbit |
| Automatic Power-Down Mode | Zero external control needed - device enters ISB2 = 50 mA standby when CE2 = LOW |
| TTL-Compatible I/O Levels | VIH = 2.0 V min, VOL = 0.4 V max - interoperable with legacy 3.3 V microcontrollers and FPGAs |
| Pb-Free TSOP II Packaging | RoHS-compliant 54-pin TSOP II footprint - drop-in replacement for leaded equivalents in existing layouts |
Applications
| Industrial PLC Data Buffering | FPGA Configuration Storage |
|---|---|
Use Scenario: Real-time I/O scanning and cyclic data logging in programmable logic controllers with deterministic latency requirements. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer holding process image data between CPU and field I/O modules; tAA = 12 ns ensures sub-100 ns read latency. Use Value: Eliminates wait states during high-speed scan cycles while maintaining data coherency across power-loss events via 2.0 V retention. | Use Scenario: Storing bitstream configuration for Xilinx Spartan or Intel MAX 10 FPGAs during cold boot and dynamic reconfiguration. IC Role / Device Role / Timing Role: Non-volatile configuration memory accessed at power-up; byte-enable support allows partial reconfigurations without full reload. Use Value: Enables fast (<100 ms) FPGA startup and field-upgradable logic via parallel interface, leveraging BHE/BLE for selective bitstream segments. |
| Telecom Line Card Packet Buffers | Automotive ADAS Sensor Fusion Memory |
Use Scenario: Temporary packet storage in Ethernet switch line cards handling 1 Gbps traffic with bursty ingress/egress patterns. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via CE1/CE2 arbitration; supports concurrent read/write to separate banks. Use Value: Sustains zero-packet-loss forwarding under 100% line-rate load using deterministic 12 ns access and automatic power gating between bursts. | Use Scenario: Intermediate frame storage for radar and camera sensor fusion in Tier-1 automotive ECUs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-reliability scratchpad memory for timestamp-aligned sensor preprocessing; industrial temp grade ensures operation in engine bay proximity. Use Value: Guarantees data integrity during thermal cycling and voltage transients via 2.0 V retention and ISB2 = 50 mA low-power hold mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-12MLI | Same density, 12 ns tAA, but uses single CE and no CE2; lower ICC (220 mA) and ISB (30 µA) | Lacks CE2-based power-down hierarchy; requires external logic for multi-bank deselection | Select for cost-sensitive designs where hierarchical CE control is unnecessary and ultra-low standby is critical |
| Winbond W9812G6JH-12 | 16 Mbit SDR SDRAM (not SRAM); 12 ns CL, requires refresh and initialization sequence | Not pin-compatible; needs controller-side DRAM initialization and periodic refresh management | Select only when system already includes SDRAM controller and higher density-per-pin is prioritized over simplicity |
Compared with IS61WV102416BLL-12MLI and W9812G6JH-12, the CY7C1061AV33-12ZXIT provides deterministic zero-refresh operation, dual CE power management, and true byte-selective writes-critical for real-time deterministic systems where predictability outweighs raw density or standby current.
Availability
CY7C1061AV33-12ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration storage, and telecom line card packet buffers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1061AV33-12ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1061AV33 belongs to Cypress's high-speed asynchronous SRAM product line, designed specifically for deterministic, low-latency memory interfacing in real-time embedded systems where refresh-free operation and industrial temperature resilience are mandatory.
FAQ
What is the minimum VCC required to retain data in CY7C1061AV33-12ZXIT?
Data retention is guaranteed at VCC ≥ 2.0 V. The device maintains stored contents indefinitely at this voltage level, provided ambient temperature remains within the industrial range (–40°C to +85°C) and tCDR ≥ 1 ms is observed after VCC drops below 3.0 V. No external circuitry is needed-the internal regulator sustains core memory array bias.
Can CY7C1061AV33-12ZXIT operate with CE1 and CE2 both asserted simultaneously?
No-CE1 and CE2 use complementary logic: CE1 must be LOW and CE2 must be HIGH for normal operation. If both are asserted (e.g., CE1 = LOW and CE2 = LOW), the device enters automatic power-down mode (ISB2 = 50 mA), disabling all I/O and placing outputs in high-impedance state regardless of OE or WE status.
How does byte enable (BLE/BHE) affect write timing parameters?
BLE and BHE do not alter tWC, tAW, or tSD values-they only gate data transfer to respective IO byte lanes. Write timing is defined by CE1/CE2 and WE overlap; when BLE = LOW, IO0–IO7 are written; when BHE = LOW, IO8–IO15 are written. Both can be active simultaneously for full 16-bit writes without timing penalty.
Is the 54-pin TSOP II package of CY7C1061AV33-12ZXIT RoHS-compliant?
Yes-the "Z" suffix in CY7C1061AV33-12ZXIT denotes Pb-free construction. The package meets RoHS Directive 2011/65/EU and J-STD-609 Category 3 marking requirements, with lead content < 0.1 wt% and fully compatible with standard SnAgCu reflow profiles.
CY7C1061AV33-12ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061AV33-12ZXIT FAQ
1.How can I place an order for CY7C1061AV33-12ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061AV33-12ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061AV33-12ZXIT reliable?
The price and inventory of CY7C1061AV33-12ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061AV33-12ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061AV33-12ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061AV33-12ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061AV33-12ZXIT?
CY7C1061AV33-12ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061AV33-12ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061AV33-12ZXIT?
For technical support, including CY7C1061AV33-12ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061AV33-12ZXIT requirements.
6.How does Aetrix verify that CY7C1061AV33-12ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061AV33-12ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061AV33-12ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061AV33-12ZXIT?
All CY7C1061AV33-12ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061AV33-12ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061AV33-12ZXIT part is unused and in its original packaging.
Return procedure for CY7C1061AV33-12ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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