Infineon Technologies CY7C1061DV18-15ZSXIT
- Part No.:
- CY7C1061DV18-15ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061DV18-15ZSXIT.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,274
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Product details
Overview
CY7C1061DV18-15ZSXIT from Cypress Semiconductor is a 16-Mbit (1 M × 16) asynchronous CMOS Static RAM with 15 ns access time, 1.7–2.2 V core supply, and dual chip enable (CE1/CE2) for flexible memory expansion in embedded controllers and FPGA co-processors. It supports byte-wide writes via BHE/ BLE, delivers 150 mA active current at 67 MHz, and retains data down to 1.5 V.
For engineers reviewing the CY7C1061DV18-15ZSXIT datasheet, CY7C1061DV18-15ZSXIT pinout, CY7C1061DV18-15ZSXIT application, or CY7C1061DV18-15ZSXIT equivalent, key selection criteria include TSOP II pinout compatibility, 15 ns tAA timing under 1.8 V operation, low-power standby modes (ISB2 = 25 mA), and TTL-compatible I/O signaling in industrial temperature range.
Technical Context
The CY7C1061DV18-15ZSXIT implements a fully static 1,048,576 × 16-bit memory array with independent high- and low-byte enables (BHE/BLE), enabling partial-word writes without read-modify-write cycles. Its dual CE architecture (CE1 LOW + CE2 HIGH for selection) allows hierarchical memory mapping in multi-bank systems.
It features automatic power-down on chip deselect, 1.5 V data retention capability, and high-impedance I/O control synchronized to OE, WE, BHE, and BLE transitions - ensuring clean bus sharing in shared-memory architectures with microprocessors and DSPs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 bits) - supports 2 MB of byte-addressable storage in compact footprint |
| Access Time (tAA) | 15 ns at VCC = 1.7–2.2 V - meets timing requirements for 67 MHz bus interfaces without wait states |
| Supply Voltage | 1.7 V to 2.2 V - compatible with 1.8 V system rails and tolerant of ±0.25 V variation |
| Active Current (ICC) | 150 mA at f = 67 MHz - enables predictable power budgeting in real-time control subsystems |
| Standby Current (ISB2) | 25 mA - reduces idle power in battery-backed or energy-sensitive applications |
| Data Retention Voltage | 1.5 V - maintains stored contents during brown-out or controlled low-power sleep modes |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade embedded deployment |
Pinout & Package
Package: 54-pin Thin Small Outline Package (TSOP II) with center power/ground pinout (revolutionary layout), RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1 M-word decoding; A0 least significant |
| I/O0–I/O7 | Low-Byte Data I/O | Bi-directional 8-bit data path enabled when BLE = LOW during read/write |
| I/O8–I/O15 | High-Byte Data I/O | Bi-directional 8-bit data path enabled when BHE = LOW during read/write |
| CE1, CE2 | Chip Enable Controls | Active-low CE1 and active-high CE2 form AND-gated chip select; enables bank isolation |
| WE | Write Enable | Active-low signal initiating write cycle; overlaps with CE and byte enables to define write window |
| OE | Output Enable | Active-low control for output drivers; decouples SRAM from data bus during reads |
| BLE, BHE | Byte Low/High Enable | Independent 8-bit write masking; eliminates need for external byte gating logic |
| VCC, VSS | Power/Ground | Multiple VCC (pins 16, 35, 45, 47, 51, 54) and VSS (pins 8, 31, 44, 46, 50, 53) pins reduce IR drop and noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable (CE1/CE2) | Enables hierarchical memory banking and seamless integration into multi-master bus systems |
| Independent Byte Enables (BHE/BLE) | Allows true 8-bit or 16-bit writes without external logic, reducing PCB complexity and latency |
| 1.5 V Data Retention | Preserves memory contents during deep-sleep or backup power modes without external capacitor hold-up |
| TTL-Compatible I/O | Eliminates level-shifting components when interfacing with legacy microcontrollers and FPGAs |
| Automatic Power-Down | Reduces ICC to ISB2 (25 mA) upon chip deselect - no software or external control required |
Applications
| Industrial PLC Data Buffer | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Real-time I/O scanning and tag storage in programmable logic controllers with deterministic cycle times. IC Role / Device Role: High-speed, non-refreshing data buffer between CPU and field I/O modules. Use Value: 15 ns tAA ensures sub-microsecond response to interrupt-driven I/O updates without bus arbitration delays. | Use Scenario: Off-chip instruction/data cache for Xilinx Spartan or Intel Cyclone FPGA-based motor control accelerators. IC Role / Device Role: External program/data RAM supporting dual-port-like access via BHE/BLE byte masking. Use Value: Independent byte enables allow simultaneous 8-bit parameter writes and 16-bit coefficient reads within same clock domain. |
| Medical Imaging Frame Store | Automotive ADAS Pre-Processing Buffer |
Use Scenario: Temporary frame buffering in portable ultrasound devices where power efficiency and reliability are critical. IC Role / Device Role: Low-voltage, low-standby-current memory holding digitized echo frames before compression. Use Value: 1.5 V data retention enables safe suspend-to-RAM during battery swaps without data loss. | Use Scenario: Intermediate pixel buffer in surround-view camera fusion units operating in extended temperature environments. IC Role / Device Role: Industrial-temp SRAM providing glitch-free video line buffering between image sensor interface and SoC preprocessor. Use Value: –40 °C to +85 °C rating and 25 mA ISB2 ensure stable operation in engine bay-mounted ECUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-15NLI | Same density, 15 ns speed, but 2.5 V min VCC (vs. 1.7 V); higher ISB2 (45 mA) | Not suitable for 1.8 V-only systems; requires voltage margin for reliable operation | Select only if system uses 2.5 V rail or has design headroom for higher VCC |
| ON Semiconductor NVSRAM NB102416L15K | Non-volatile variant with integrated EEPROM backup; 20 ns tAA; 3.3 V interface | Provides data persistence after power loss - adds cost and complexity for volatile-only use cases | Choose only when automatic data retention across power cycles is mandatory |
Compared with IS61WV102416BLL-15NLI and NB102416L15K, the CY7C1061DV18-15ZSXIT offers lowest voltage operation (1.7 V), tightest industrial-temp 15 ns timing, and optimal balance of power, pinout, and cost for pure volatile SRAM roles in 1.8 V embedded systems.
Availability
CY7C1061DV18-15ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffers, FPGA co-processor memory, and medical imaging frame stores requiring stable component supply and long-term industrial temperature support.
Supply support for CY7C1061DV18-15ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and consumer electronics with emphasis on reliability and integration.
The CY7C1061DV18 belongs to Cypress's low-voltage asynchronous SRAM product line, engineered specifically for 1.8 V system-on-module and FPGA-adjacent memory applications demanding fast access, low standby power, and industrial temperature resilience.
FAQ
What is the minimum VCC required for full functionality?
The CY7C1061DV18-15ZSXIT requires VCC ≥ 1.7 V for guaranteed read/write operation across the full industrial temperature range. Below 1.7 V, timing parameters (e.g., tAA = 15 ns) and DC specifications (VOH/VOL) are not assured, though data retention remains valid down to 1.5 V with CE deselected.
Can BHE and BLE be asserted simultaneously for full 16-bit access?
Yes - asserting both BHE and BLE LOW enables full 16-bit parallel access to I/O0–I/O15 during read or write operations. This configuration matches standard 16-bit bus interfaces and eliminates partial-word penalties in burst transfers.
How does the TSOP II "revolutionary" pinout improve signal integrity?
The 54-pin TSOP II package places multiple VCC and VSS pins centrally and symmetrically (e.g., pins 16, 35, 45, 47, 51, 54 for VCC; pins 8, 31, 44, 46, 50, 53 for VSS), minimizing ground bounce and supply noise during high-speed toggling of all 16 I/O lines and address bits.
Is this device compatible with 3.3 V I/O systems?
No - the CY7C1061DV18-15ZSXIT is strictly a 1.7–2.2 V core device with TTL-compatible input thresholds (VIH = 1.4 V, VIL = 0.4 V), but its outputs swing only to ~1.4 V (VOH) under 1.8 V VCC. Direct connection to 3.3 V buses requires level translation to avoid overvoltage damage or logic misreads.
CY7C1061DV18-15ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.7V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061DV18-15ZSXIT FAQ
1.How can I place an order for CY7C1061DV18-15ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061DV18-15ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061DV18-15ZSXIT reliable?
The price and inventory of CY7C1061DV18-15ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061DV18-15ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061DV18-15ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061DV18-15ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061DV18-15ZSXIT?
CY7C1061DV18-15ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061DV18-15ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061DV18-15ZSXIT?
For technical support, including CY7C1061DV18-15ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061DV18-15ZSXIT requirements.
6.How does Aetrix verify that CY7C1061DV18-15ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061DV18-15ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061DV18-15ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061DV18-15ZSXIT?
All CY7C1061DV18-15ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061DV18-15ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061DV18-15ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1061DV18-15ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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