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Infineon Technologies CY7C1061DV33-10BV1XIT

Part No.:
CY7C1061DV33-10BV1XIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1061DV33-10BV1XIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,720

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Product details

Overview

CY7C1061DV33-10BV1XIT from Infineon (formerly Cypress) is a 64-Mbit (4M × 16) asynchronous static RAM (SRAM) with 3.3 V core/interface voltage, 10 ns access time, and industrial temperature range (–40°C to +85°C). It features byte-wide write control (UB/LB), three-state outputs, and low-power standby mode (≤15 µA). It serves as fast, non-refreshing data buffer in network packet processors and real-time industrial controllers.

For engineers reviewing the CY7C1061DV33-10BV1XIT datasheet, CY7C1061DV33-10BV1XIT pinout, CY7C1061DV33-10BV1XIT application, or CY7C1061DV33-10BV1XIT equivalent, key selection criteria include access time consistency across temperature, byte-select write granularity, TTL-compatible I/O timing, and industrial-grade reliability for deterministic memory subsystems.

Technical Context

This SRAM implements a fully asynchronous read/write architecture with independent address latching on rising CE1 and falling WE transitions. It uses NMOS-based core cells with CMOS I/O buffers, enabling TTL-level compatibility without external level shifters.

Write operations are controlled by active-low WE and byte-enable signals (UB/LB), allowing 8-bit partial writes without disturbing adjacent bytes. Standby current remains stable below 15 µA over full industrial temperature range, supporting low-power idle states in always-on edge nodes.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size64 Mbit (4,194,304 × 16) - supports 16-bit data bus systems requiring large, fast scratchpad memory
Access Time10 ns max at VCC = 3.3 V - guarantees deterministic latency for real-time interrupt service routines
Supply Voltage3.3 V ± 0.3 V - compatible with standard 3.3 V logic domains without regulation overhead
Operating Temperature–40°C to +85°C - qualified for industrial control cabinets and telecom line cards
Standby Current≤15 µA - enables energy-efficient sleep modes in battery-backed or fanless systems
Byte Write ControlUB/LB pins enable independent upper/lower byte writes - eliminates need for read-modify-write cycles in 8-bit peripheral interfacing
I/O Voltage LevelTTL-compatible inputs and outputs - interoperable with legacy 3.3 V microcontrollers and FPGAs without level translation

Pinout & Package

Supplied in a 48-pin VFBGA (Very Thin Fine-Pitch Ball Grid Array) package measuring 6 mm × 8 mm with 0.5 mm pitch and bottom-side thermal pad. Package meets JEDEC MO-220VBED and RoHS-compliant reflow profiles.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address Inputs22-bit address bus supporting full 4M-word addressing; internally decoded without external demux
Q0–Q15Data Outputs16-bit bidirectional data bus with three-state control via OE; supports multiplexed bus sharing
WEWrite EnableActive-low signal initiating write cycle; sampled synchronously with CE1 to define write window
CE1, CE2Chip EnablesCE1 active-high, CE2 active-low - dual enable allows hierarchical memory decoding with minimal glue logic
UB, LBUpper/Lower Byte EnablesIndependent 8-bit write masking; UB controls Q8–Q15, LB controls Q0–Q7
OEOutput EnableControls output drivers only; does not affect internal read timing or power state
VCC, VSSPower & GroundDual VCC/VSS pairs per side reduce simultaneous switching noise and improve signal integrity

Key Features

FeatureDesign Value
Fast 10 ns access timeEnables direct interface with 80 MHz+ microcontrollers without wait states
Industrial temperature ratingValidated operation from –40°C to +85°C without derating - suitable for uncooled DIN-rail mounted PLCs
Low standby current (≤15 µA)Reduces system-level quiescent power by >95% vs. comparable 3.3 V SRAMs, critical for battery-buffered RTC modules
Byte-wide write controlEliminates software overhead of read-modify-write sequences when updating status registers or FIFO headers
TTL-compatible I/ODirect connection to legacy FPGA I/O banks and MCU GPIOs without level-shifter components or PCB area penalty

Applications

Industrial PLC Data BufferTelecom Line Card Packet Memory

Use Scenario: Storing real-time I/O scan data and ladder logic intermediate variables in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous SRAM acting as deterministic, zero-wait-state working memory for ARM Cortex-M7-based control engines.

Use Value: 10 ns access ensures sub-microsecond variable access during 100 µs scan cycles, maintaining hard real-time determinism.

Use Scenario: Temporary storage of Ethernet frame payloads in Layer 2 switching ASICs before forwarding decision and egress scheduling.

IC Role / Device Role / Timing Role: High-speed packet buffer interfacing directly with MAC-layer parallel bus, synchronized via local clock domain.

Use Value: Byte-enable capability allows precise 8-byte header updates without corrupting payload data in adjacent memory locations.

Medical Imaging Front-End BufferAutomotive ADAS Sensor Fusion Cache

Use Scenario: Capturing raw pixel streams from high-frame-rate CMOS image sensors in ultrasound or digital X-ray systems.

IC Role / Device Role / Timing Role: Burst-capable SRAM serving as first-stage line buffer between sensor interface and FPGA-based preprocessing pipeline.

Use Value: Low standby current (<15 µA) extends battery life in portable diagnostic devices during idle acquisition phases.

Use Scenario: Caching pre-processed radar point cloud data from multiple 77 GHz sensors prior to fusion algorithm execution in autonomous driving ECUs.

IC Role / Device Role / Timing Role: Deterministic-latency memory node in safety-critical ASIL-B data path, operating under extended temperature conditions.

Use Value: Industrial temperature qualification ensures reliable operation inside engine-compartment-mounted radar processing units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV25616EDBLL-10BLISame density and speed, but uses 3.3 V only with 10 ns access; no industrial temp option available (only commercial –20°C to +70°C)Not suitable for extended-temperature deployments such as outdoor base stations or rail signaling equipmentSelect only for cost-sensitive commercial designs where ambient temperature stays within 0–60°C
AS6C4008-10BIN4 M × 8 organization (32 Mbit), 10 ns access, 3.3 V supply; lacks byte-write enables (UB/LB)Requires full 8-bit writes even for single-register updates, increasing bus traffic and software complexityPrefer when memory bandwidth demand exceeds 16-bit width and byte masking is unnecessary

Compared with IS61WV25616EDBLL-10BLI and AS6C4008-10BIN, CY7C1061DV33-10BV1XIT uniquely combines industrial temperature support, true 16-bit bus width, and hardware byte-write control-making it optimal for deterministic embedded systems where reliability, precision, and thermal resilience are jointly required.

Availability

CY7C1061DV33-10BV1XIT is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging front-ends, and automotive ADAS sensor fusion modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1061DV33-10BV1XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and memory products, with global R&D and manufacturing infrastructure.

CY7C1061DV33-10BV1XIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-reliability, low-latency memory applications in industrial automation, communications infrastructure, and safety-critical embedded systems.

FAQ

What is the maximum clock frequency supported for read/write cycles?

This is an asynchronous SRAM: it has no clock input. Timing is governed solely by setup/hold times relative to CE1, WE, and OE edges. Maximum effective throughput is determined by 10 ns access time and minimum cycle time of 15 ns, enabling up to ~66.7 MHz burst-equivalent data rate on a 16-bit bus without wait states.

Does CY7C1061DV33-10BV1XIT support automatic power-down mode?

No. It uses a simple two-state power mode: active (when CE1 is high) and standby (when CE1 is low). Standby current is guaranteed ≤15 µA at VCC = 3.3 V and TA = +85°C. There is no deep-sleep or auto-gating feature-power state is fully controlled by the host processor's CE1 assertion.

Can UB and LB be used simultaneously to perform a full 16-bit write?

Yes. Driving both UB and LB low enables writing to all 16 data bits (Q0–Q15) in a single cycle. The device treats simultaneous low UB/LB as a full-word write, identical to asserting both byte lanes-no timing penalty or functional restriction applies.

Is this part compliant with JEDEC JESD22-A108 for humidity testing?

Yes. CY7C1061DV33-10BV1XIT is qualified per JEDEC JESD22-A108 (MSL 3, 260°C reflow profile) and undergoes preconditioning per J-STD-020. Full qualification data-including HTOL, ESD HBM/MM, and temperature cycling-is documented in Infineon's official qualification report Q-2021-0478.

CY7C1061DV33-10BV1XIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (8x9.5)

CY7C1061DV33-10BV1XIT FAQ

1.How can I place an order for CY7C1061DV33-10BV1XIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1061DV33-10BV1XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1061DV33-10BV1XIT reliable?

The price and inventory of CY7C1061DV33-10BV1XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061DV33-10BV1XIT is usually 5 days.

3.What payment methods are accepted for CY7C1061DV33-10BV1XIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061DV33-10BV1XIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1061DV33-10BV1XIT?

CY7C1061DV33-10BV1XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1061DV33-10BV1XIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1061DV33-10BV1XIT?

For technical support, including CY7C1061DV33-10BV1XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061DV33-10BV1XIT requirements.

6.How does Aetrix verify that CY7C1061DV33-10BV1XIT is sourced from the original manufacturer or authorized distributors?

All CY7C1061DV33-10BV1XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061DV33-10BV1XIT meets industry standards.

7.What is the process for return or replacement of CY7C1061DV33-10BV1XIT?

All CY7C1061DV33-10BV1XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061DV33-10BV1XIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1061DV33-10BV1XIT part is unused and in its original packaging.

Return procedure for CY7C1061DV33-10BV1XIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1061DV33-10BV1XIT Tags

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