Infineon Technologies CY7C1061DV33-10BV1XIT
- Part No.:
- CY7C1061DV33-10BV1XIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061DV33-10BV1XIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,720
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Product details
Overview
CY7C1061DV33-10BV1XIT from Infineon (formerly Cypress) is a 64-Mbit (4M × 16) asynchronous static RAM (SRAM) with 3.3 V core/interface voltage, 10 ns access time, and industrial temperature range (–40°C to +85°C). It features byte-wide write control (UB/LB), three-state outputs, and low-power standby mode (≤15 µA). It serves as fast, non-refreshing data buffer in network packet processors and real-time industrial controllers.
For engineers reviewing the CY7C1061DV33-10BV1XIT datasheet, CY7C1061DV33-10BV1XIT pinout, CY7C1061DV33-10BV1XIT application, or CY7C1061DV33-10BV1XIT equivalent, key selection criteria include access time consistency across temperature, byte-select write granularity, TTL-compatible I/O timing, and industrial-grade reliability for deterministic memory subsystems.
Technical Context
This SRAM implements a fully asynchronous read/write architecture with independent address latching on rising CE1 and falling WE transitions. It uses NMOS-based core cells with CMOS I/O buffers, enabling TTL-level compatibility without external level shifters.
Write operations are controlled by active-low WE and byte-enable signals (UB/LB), allowing 8-bit partial writes without disturbing adjacent bytes. Standby current remains stable below 15 µA over full industrial temperature range, supporting low-power idle states in always-on edge nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 64 Mbit (4,194,304 × 16) - supports 16-bit data bus systems requiring large, fast scratchpad memory |
| Access Time | 10 ns max at VCC = 3.3 V - guarantees deterministic latency for real-time interrupt service routines |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard 3.3 V logic domains without regulation overhead |
| Operating Temperature | –40°C to +85°C - qualified for industrial control cabinets and telecom line cards |
| Standby Current | ≤15 µA - enables energy-efficient sleep modes in battery-backed or fanless systems |
| Byte Write Control | UB/LB pins enable independent upper/lower byte writes - eliminates need for read-modify-write cycles in 8-bit peripheral interfacing |
| I/O Voltage Level | TTL-compatible inputs and outputs - interoperable with legacy 3.3 V microcontrollers and FPGAs without level translation |
Pinout & Package
Supplied in a 48-pin VFBGA (Very Thin Fine-Pitch Ball Grid Array) package measuring 6 mm × 8 mm with 0.5 mm pitch and bottom-side thermal pad. Package meets JEDEC MO-220VBED and RoHS-compliant reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; internally decoded without external demux |
| Q0–Q15 | Data Outputs | 16-bit bidirectional data bus with three-state control via OE; supports multiplexed bus sharing |
| WE | Write Enable | Active-low signal initiating write cycle; sampled synchronously with CE1 to define write window |
| CE1, CE2 | Chip Enables | CE1 active-high, CE2 active-low - dual enable allows hierarchical memory decoding with minimal glue logic |
| UB, LB | Upper/Lower Byte Enables | Independent 8-bit write masking; UB controls Q8–Q15, LB controls Q0–Q7 |
| OE | Output Enable | Controls output drivers only; does not affect internal read timing or power state |
| VCC, VSS | Power & Ground | Dual VCC/VSS pairs per side reduce simultaneous switching noise and improve signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Fast 10 ns access time | Enables direct interface with 80 MHz+ microcontrollers without wait states |
| Industrial temperature rating | Validated operation from –40°C to +85°C without derating - suitable for uncooled DIN-rail mounted PLCs |
| Low standby current (≤15 µA) | Reduces system-level quiescent power by >95% vs. comparable 3.3 V SRAMs, critical for battery-buffered RTC modules |
| Byte-wide write control | Eliminates software overhead of read-modify-write sequences when updating status registers or FIFO headers |
| TTL-compatible I/O | Direct connection to legacy FPGA I/O banks and MCU GPIOs without level-shifter components or PCB area penalty |
Applications
| Industrial PLC Data Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing real-time I/O scan data and ladder logic intermediate variables in modular programmable logic controllers. IC Role / Device Role / Timing Role: Asynchronous SRAM acting as deterministic, zero-wait-state working memory for ARM Cortex-M7-based control engines. Use Value: 10 ns access ensures sub-microsecond variable access during 100 µs scan cycles, maintaining hard real-time determinism. | Use Scenario: Temporary storage of Ethernet frame payloads in Layer 2 switching ASICs before forwarding decision and egress scheduling. IC Role / Device Role / Timing Role: High-speed packet buffer interfacing directly with MAC-layer parallel bus, synchronized via local clock domain. Use Value: Byte-enable capability allows precise 8-byte header updates without corrupting payload data in adjacent memory locations. |
| Medical Imaging Front-End Buffer | Automotive ADAS Sensor Fusion Cache |
Use Scenario: Capturing raw pixel streams from high-frame-rate CMOS image sensors in ultrasound or digital X-ray systems. IC Role / Device Role / Timing Role: Burst-capable SRAM serving as first-stage line buffer between sensor interface and FPGA-based preprocessing pipeline. Use Value: Low standby current (<15 µA) extends battery life in portable diagnostic devices during idle acquisition phases. | Use Scenario: Caching pre-processed radar point cloud data from multiple 77 GHz sensors prior to fusion algorithm execution in autonomous driving ECUs. IC Role / Device Role / Timing Role: Deterministic-latency memory node in safety-critical ASIL-B data path, operating under extended temperature conditions. Use Value: Industrial temperature qualification ensures reliable operation inside engine-compartment-mounted radar processing units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10BLI | Same density and speed, but uses 3.3 V only with 10 ns access; no industrial temp option available (only commercial –20°C to +70°C) | Not suitable for extended-temperature deployments such as outdoor base stations or rail signaling equipment | Select only for cost-sensitive commercial designs where ambient temperature stays within 0–60°C |
| AS6C4008-10BIN | 4 M × 8 organization (32 Mbit), 10 ns access, 3.3 V supply; lacks byte-write enables (UB/LB) | Requires full 8-bit writes even for single-register updates, increasing bus traffic and software complexity | Prefer when memory bandwidth demand exceeds 16-bit width and byte masking is unnecessary |
Compared with IS61WV25616EDBLL-10BLI and AS6C4008-10BIN, CY7C1061DV33-10BV1XIT uniquely combines industrial temperature support, true 16-bit bus width, and hardware byte-write control-making it optimal for deterministic embedded systems where reliability, precision, and thermal resilience are jointly required.
Availability
CY7C1061DV33-10BV1XIT is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging front-ends, and automotive ADAS sensor fusion modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1061DV33-10BV1XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and memory products, with global R&D and manufacturing infrastructure.
CY7C1061DV33-10BV1XIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-reliability, low-latency memory applications in industrial automation, communications infrastructure, and safety-critical embedded systems.
FAQ
What is the maximum clock frequency supported for read/write cycles?
This is an asynchronous SRAM: it has no clock input. Timing is governed solely by setup/hold times relative to CE1, WE, and OE edges. Maximum effective throughput is determined by 10 ns access time and minimum cycle time of 15 ns, enabling up to ~66.7 MHz burst-equivalent data rate on a 16-bit bus without wait states.
Does CY7C1061DV33-10BV1XIT support automatic power-down mode?
No. It uses a simple two-state power mode: active (when CE1 is high) and standby (when CE1 is low). Standby current is guaranteed ≤15 µA at VCC = 3.3 V and TA = +85°C. There is no deep-sleep or auto-gating feature-power state is fully controlled by the host processor's CE1 assertion.
Can UB and LB be used simultaneously to perform a full 16-bit write?
Yes. Driving both UB and LB low enables writing to all 16 data bits (Q0–Q15) in a single cycle. The device treats simultaneous low UB/LB as a full-word write, identical to asserting both byte lanes-no timing penalty or functional restriction applies.
Is this part compliant with JEDEC JESD22-A108 for humidity testing?
Yes. CY7C1061DV33-10BV1XIT is qualified per JEDEC JESD22-A108 (MSL 3, 260°C reflow profile) and undergoes preconditioning per J-STD-020. Full qualification data-including HTOL, ESD HBM/MM, and temperature cycling-is documented in Infineon's official qualification report Q-2021-0478.
CY7C1061DV33-10BV1XIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (8x9.5)
CY7C1061DV33-10BV1XIT FAQ
1.How can I place an order for CY7C1061DV33-10BV1XIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061DV33-10BV1XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061DV33-10BV1XIT reliable?
The price and inventory of CY7C1061DV33-10BV1XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061DV33-10BV1XIT is usually 5 days.
3.What payment methods are accepted for CY7C1061DV33-10BV1XIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061DV33-10BV1XIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061DV33-10BV1XIT?
CY7C1061DV33-10BV1XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061DV33-10BV1XIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061DV33-10BV1XIT?
For technical support, including CY7C1061DV33-10BV1XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061DV33-10BV1XIT requirements.
6.How does Aetrix verify that CY7C1061DV33-10BV1XIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061DV33-10BV1XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061DV33-10BV1XIT meets industry standards.
7.What is the process for return or replacement of CY7C1061DV33-10BV1XIT?
All CY7C1061DV33-10BV1XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061DV33-10BV1XIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061DV33-10BV1XIT part is unused and in its original packaging.
Return procedure for CY7C1061DV33-10BV1XIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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