Infineon Technologies CY7C1061G-10BV1XI

Overview

CY7C1061G-10BV1XI from Infineon (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), designed for high-reliability data storage in industrial control and telecom infrastructure. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), delivers 10 ns access time at 5 V, supports byte-level writes via BHE/ BLE, and features an ERR output pin indicating corrected single-bit errors during read cycles.

For engineers reviewing the CY7C1061G-10BV1XI datasheet, CY7C1061G-10BV1XI pinout, CY7C1061G-10BV1XI application, or CY7C1061G-10BV1XI equivalent, this device is selected for systems requiring deterministic ECC correction without write-back, low standby current (20 mA typical), TTL-compatible I/O, and 1.0 V data retention - especially where memory integrity must be maintained under extended temperature (-40°C to +85°C) and multi-rail supply conditions.

Technical Context

The CY7C1061G-10BV1XI implements on-die Hamming-code ECC logic that detects and corrects single-bit errors in real time during read operations, with ERR pin assertion confirming correction event. It supports both single CE (CE pin only) and dual CE (CE1/CE2) configurations, with pinout variant BV1XI specifying single CE, ERR output enabled, and A19 at ball G2 in 48-ball VFBGA.

Its architecture enables independent upper- and lower-byte writes using BHE (I/O8–I/O15) and BLE (I/O0–I/O7), while maintaining full 16-bit bidirectional data bus operation. The device enters low-power ISB2 mode (<30 mA max) when CE is deasserted and all inputs are stable at valid logic levels, with no automatic refresh or external timing controller required.

Key Specifications

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, RoHS-compliant, with solder mask defined pads and standard JEDEC MO-276AC footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS61WV102416BLL-10MLI and 23LC1024-I/P, the CY7C1061G-10BV1XI uniquely delivers parallel-interface ECC correction in a compact VFBGA, enabling higher throughput and deterministic fault recovery without architectural redesign - making it irreplaceable in new industrial and telecom designs demanding both speed and data integrity.

Availability

CY7C1061G-10BV1XI is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging subsystems, and railway signaling controllers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1061G-10BV1XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.

This device belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for mission-critical embedded systems where data integrity, multi-voltage flexibility, and industrial temperature resilience are mandatory design constraints.

FAQ

Does CY7C1061G-10BV1XI support automatic error write-back after correction?

No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory array. This behavior is explicitly documented in Note 1 of the datasheet and requires external logic or firmware to initiate write-back if persistent correction is needed.

What is the function of the NC pins in the 48-ball VFBGA package?

NC (No Connect) pins - such as balls C1, D2, G1, and H2 in the BV1XI configuration - are physically present but not bonded to the silicon die. They must remain unconnected on the PCB; routing traces or applying solder paste to these balls may cause mechanical stress or unintended shorts due to package warpage during reflow.

Can the ERR pin be left unconnected if ECC functionality is not used?

Yes. Per Note 6 in the datasheet, the ERR pin is an open-drain output and should be left floating if unused. No pull-up or pull-down resistor is required, and leaving it unconnected does not affect normal SRAM operation or ECC logic - the internal correction still occurs silently without output signaling.

How does the dual VCC/VSS ball layout improve signal integrity?

The 48-ball VFBGA uses two dedicated VCC balls (E1, F1) and two VSS balls (D1, H1) to reduce power delivery impedance and minimize ground bounce. This layout lowers simultaneous switching noise during 16-bit data transitions, maintaining stable VIH/VIL margins for TTL-compatible I/O even at 100 MHz bus toggle rates.