Infineon Technologies CY7C1061G-10BVJXI
- Part No.:
- CY7C1061G-10BVJXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G-10BVJXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,283
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061G-10BVJXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), designed for high-reliability data storage in industrial control and telecom infrastructure. It operates at 10 ns access time, supports 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V supply ranges, and features an ERR output pin for real-time single-bit error detection and correction during read cycles.
For engineers reviewing the CY7C1061G-10BVJXI datasheet, CY7C1061G-10BVJXI pinout, CY7C1061G-10BVJXI application, or CY7C1061G-10BVJXI equivalent, this device is selected for systems requiring deterministic ECC protection without write-back, low standby current (20 mA typical), TTL-compatible I/O, and 1.0 V data retention - especially where memory integrity must be maintained under extended temperature (-40°C to +85°C) and multi-voltage rail conditions.
Technical Context
This SRAM implements on-die Hamming-code-based ECC logic that detects and corrects single-bit errors in real time during read operations, with no automatic write-back - correction occurs only in the read path. The ERR pin asserts high upon successful correction, enabling system-level fault logging without interrupting memory access flow.
It supports dual chip enable (CE1/CE2) configuration with CE1=LOW and CE2=HIGH for selection, and byte-level writes via BHE (I/O8–I/O15) and BLE (I/O0–I/O7). Address range spans A0–A19 (1M words), with A19 placed at ball G2 in the BVJXI package variant, confirming its dual-CE, ERR-enabled VFBGA configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) - provides full 2 MB of addressable data space with parallel 16-bit bus interface. |
| Access Time | 10 ns (tAA) at VCC = 2.2–3.6 V or 4.5–5.5 V - enables direct interfacing with 100 MHz microcontrollers and FPGAs without wait states. |
| ECC Function | Single-bit error detection and correction per read cycle - ensures data integrity without software overhead or memory controller dependency. |
| Supply Voltage Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - supports legacy 5 V, modern 3.3 V, and ultra-low-power 1.8 V system rails. |
| Standby Current | ISB2 = 20 mA typical - enables low-power hold mode during processor sleep while retaining full memory contents at 1.0 V. |
| Operating Temperature | –40°C to +85°C (Industrial grade) - validated for use in base station control cards, PLC backplanes, and railway signaling modules. |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm), Package ID BVJXI - dual-CE, ERR-enabled, A19 at ball G2; RoHS-compliant, fine-pitch surface-mount compatible with automated assembly. |
Pinout & Package
48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 × 8 mm footprint, 1.0 mm height, 0.5 mm ball pitch. Pinout corresponds to Figure 5 in datasheet Rev. *T: Dual chip enable (CE1/CE2) and ERR output enabled, with address MSB A19 located at ball G2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1, CE2 | Chip Enable inputs (dual) | Device selected only when CE1 = LOW and CE2 = HIGH; enables hierarchical memory decoding in multi-SRAM systems. |
| ERR | Error indication output | Open-drain HIGH pulse signals successful single-bit correction during read - used for diagnostic logging or fail-safe state transitions. |
| BHE, BLE | Byte enable controls | BHE enables upper byte (I/O8–I/O15); BLE enables lower byte (I/O0–I/O7); allows 8-bit sub-word writes without disturbing adjacent data. |
| A0–A19 | Address inputs | 20-bit address bus selects one of 1M locations; A19 at ball G2 confirms BVJXI's dual-CE + ERR configuration per datasheet Figure 5. |
| I/O0–I/O15 | Bi-directional data bus | 16-bit parallel interface with TTL-compatible voltage thresholds - interoperable with legacy microprocessors and modern FPGA I/O banks. |
| VCC, VSS | Power and ground | Dual VCC balls (balls E6, F6) and multiple VSS balls (A1, D1, H1, etc.) ensure low-impedance power delivery and noise suppression in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Hardware-accelerated single-bit error correction per read cycle - eliminates need for external ECC controllers or software parity checks. |
| Multi-voltage support | Three independent VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) - simplifies integration across mixed-voltage PCBs without level shifters. |
| Low-power standby | ISB2 = 20 mA typical at 0 Hz clock - maintains full memory state during system idle with minimal leakage, critical for battery-backed applications. |
| TTL-compatible I/O | VIH/VIL thresholds match standard TTL logic families - enables direct connection to 5 V or 3.3 V microcontrollers without interface buffers. |
| 1.0 V data retention | Retains stored data down to 1.0 V VCC - supports graceful shutdown and brown-out recovery in industrial power systems. |
Applications
| Industrial PLC Memory Buffer | Telecom Line Card Data Cache |
|---|---|
|
Use Scenario: Storing real-time I/O mapping tables and firmware scratchpad in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary 16-bit parallel SRAM buffer with ECC-protected data storage; serves as non-refreshing, low-latency working memory for cyclic scan execution. Use Value: Prevents undetected bit flips in long-duration runtime (≥10 years) under EMI-rich plant-floor conditions, eliminating silent data corruption in safety-critical control loops. |
Use Scenario: Caching packet header metadata and routing tables in carrier-grade Ethernet line cards operating in central office environments. IC Role / Device Role / Timing Role: High-speed, ECC-secured SRAM for lookup table acceleration; interfaces directly to FPGA-based traffic managers at 100 MHz clock rates. Use Value: Ensures deterministic 10 ns read latency with zero uncorrectable errors over 20+ year service life, meeting Telcordia GR-1089 immunity and reliability requirements. |
| Railway Signaling Controller | Medical Imaging System Frame Buffer |
|
Use Scenario: Holding interlocking logic state variables and sensor fusion outputs in EN 5012x-certified railway signaling interlock units. IC Role / Device Role / Timing Role: Fault-tolerant SRAM with ERR pin tied to watchdog supervisor; stores safety-critical state vectors updated every 50 ms. Use Value: Single-bit ECC correction + ERR assertion satisfies SIL-3 diagnostic coverage requirements per IEC 62425, reducing need for redundant memory channels. |
Use Scenario: Temporary storage of DICOM image tiles during real-time reconstruction in MRI/PET modalities before DRAM transfer. IC Role / Device Role / Timing Role: Burst-mode SRAM frame buffer with byte-enable granularity; accepts pixel data streams from ADCs at 80 MSPS via parallel 16-bit bus. Use Value: 1.0 V data retention enables safe freeze-frame capture during unexpected AC loss, preserving diagnostic image integrity for regulatory audit trails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No integrated ECC; requires external logic or controller-based correction; 10 ns access, 3.3 V only. | Lacks hardware ERR signal and real-time correction - increases firmware complexity and latency in safety-critical reads. | Select only if system already implements ECC in FPGA fabric and cost sensitivity outweighs reliability assurance. |
| IS61WV102416BLL-10MLI | 10 ns access, 3.3 V only, no ECC; higher ISB2 (45 mA typical); 54-pin TSOP II package. | Higher standby current and no error signaling - unsuitable for battery-buffered or long-term unattended deployments. | Consider only for non-critical caching where board space permits larger TSOP and ECC is managed externally. |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061G-10BVJXI uniquely delivers on-die ECC with ERR output, multi-voltage support, and VFBGA packaging - making it the only option among the three that satisfies both industrial temperature reliability and hardware-level fault detection without design-level trade-offs.
Availability
CY7C1061G-10BVJXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, telecom line card caches, railway signaling controllers, and medical imaging frame buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1061G-10BVJXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
CY7C1061G-10BVJXI belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for mission-critical industrial and infrastructure applications demanding hardware ECC, wide voltage operation, and long-term obsolescence mitigation.
FAQ
Does CY7C1061G-10BVJXI perform automatic write-back after ECC correction?
No. The device performs single-bit error correction only in the read path and does not automatically rewrite corrected data to the memory array. The ERR pin signals correction occurrence, but the original erroneous word remains unmodified unless explicitly rewritten by the host system. This behavior is documented in Note 1 of the datasheet and avoids unintended write cycles during diagnostic reads.
What is the function of the ERR pin, and how should it be interfaced?
The ERR pin is an open-drain output that asserts HIGH during a read cycle when a single-bit error is detected and corrected. It must be pulled up externally (typically 10 kΩ to VCC) and monitored asynchronously by the host controller. If unused, the pin should be left floating per datasheet Note 6 - no internal pull-up or pull-down is provided, and driving it actively may damage the output stage.
Can CY7C1061G-10BVJXI operate at 2.5 V VCC?
Yes. The device supports the 2.2 V–3.6 V supply range, and 2.5 V falls within specification. At 2.5 V, tAA remains 10 ns (guaranteed), ICC is 90 mA typical at 100 MHz, and all DC electrical characteristics including VIH (2.0 V min), VOL (0.4 V max), and ISB2 (20 mA typical) remain valid per Table on page 7 of Rev. *T.
How is the BVJXI package variant distinguished from other CY7C1061G options?
BVJXI denotes the 48-ball VFBGA package with dual chip enable (CE1/CE2), ERR output enabled, and A19 address pin located at ball G2 - matching Figure 5 in the datasheet. This distinguishes it from BVXI (same package but A19 at H6) and BV1XI (single CE, A19 at G2), ensuring correct PCB layout and signal routing for ECC-aware memory controllers.
CY7C1061G-10BVJXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G-10BVJXI FAQ
1.How can I place an order for CY7C1061G-10BVJXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G-10BVJXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G-10BVJXI reliable?
The price and inventory of CY7C1061G-10BVJXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G-10BVJXI is usually 5 days.
3.What payment methods are accepted for CY7C1061G-10BVJXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G-10BVJXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G-10BVJXI?
CY7C1061G-10BVJXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G-10BVJXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G-10BVJXI?
For technical support, including CY7C1061G-10BVJXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G-10BVJXI requirements.
6.How does Aetrix verify that CY7C1061G-10BVJXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G-10BVJXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G-10BVJXI meets industry standards.
7.What is the process for return or replacement of CY7C1061G-10BVJXI?
All CY7C1061G-10BVJXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G-10BVJXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G-10BVJXI part is unused and in its original packaging.
Return procedure for CY7C1061G-10BVJXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061G-10BVJXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

