Infineon Technologies CY7C1061G-10BVXI
- Part No.:
- CY7C1061G-10BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G-10BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061G-10BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), designed for high-reliability data storage in industrial control and telecom infrastructure. It operates at 10 ns access time, supports 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V supply ranges, delivers 90 mA typical active current at 100 MHz, and features an ERR output pin for real-time single-bit error detection and correction during read cycles.
For engineers reviewing the CY7C1061G-10BVXI datasheet, CY7C1061G-10BVXI pinout, CY7C1061G-10BVXI application, or CY7C1061G-10BVXI equivalent, this device is selected for systems requiring deterministic ECC protection without write-back, low-power standby (20 mA ISB2), TTL-compatible I/O, and 1.0 V data retention-especially where pin-compatible migration from legacy Cypress SRAMs is needed.
Technical Context
This SRAM implements a synchronous, byte-selectable memory architecture with dual chip enable (CE1/CE2) logic and independent BHE/BLE controls for upper/lower byte writes. Its ECC engine operates transparently on every read access, generating an active-high ERR signal when a correctable single-bit error is found in the accessed 16-bit word.
The device supports three distinct VCC operating windows-1.65–2.2 V (15 ns speed grade), 2.2–3.6 V (10 ns), and 4.5–5.5 V (10 ns)-with corresponding ICC and ISB2 values validated per voltage band. All packages feature NC pins (e.g., A16, A18 in BVXI configuration) and require proper floating of unused ERR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); enables compact 2 MB data buffers without external multiplexing. |
| Access Time (tAA) | 10 ns at 2.2–3.6 V and 4.5–5.5 V; guarantees sub-100 MHz system timing margin in high-speed control loops. |
| ECC Function | Embedded single-bit error correction with ERR output assertion; detects and corrects errors in real time without CPU intervention. |
| Supply Voltage Ranges | 1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V; allows direct integration into mixed-voltage systems including 1.8 V, 3.3 V, and 5 V domains. |
| Standby Current (ISB2) | 20 mA typical at VCC = 3 V or 5 V; supports low-power hold modes in battery-backed or energy-constrained applications. |
| Data Retention Voltage | 1.0 V minimum; maintains stored data during brown-out or controlled power-down sequences. |
| I/O Compatibility | TTL-compatible inputs/outputs; eliminates level-shifter requirements in legacy 5 V or mixed-signal controller interfaces. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, RoHS-compliant, industrial temperature grade (–40 °C to +85 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A19 placement varies by variant (Ball G2 or H6 in BVXI). |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; byte-accessible via BHE (I/O8–I/O15) and BLE (I/O0–I/O7). |
| CE1, CE2 | Dual Chip Enable Inputs | Active-low CE1 and active-high CE2 form logical CE; enables hierarchical memory decoding in multi-SRAM systems. |
| WE | Write Enable Input | Active-low control for write cycles; latches data on rising edge of WE in conjunction with address setup. |
| OE | Output Enable Input | Active-low control for read output drivers; places I/Os in high-Z when deasserted or device deselected. |
| BHE, BLE | Byte Enable Inputs | Independent gating of upper/lower data bytes; permits 8-bit microcontroller interfacing without data masking logic. |
| ERR | Error Indication Output | Open-drain active-high signal asserted during single-bit error correction; requires external pull-up for system-level fault logging. |
| VCC, VSS | Power Supply Pins | Multiple VCC/VSS balls distributed across package for low-impedance power delivery and reduced simultaneous switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC with ERR output | Real-time single-bit error correction per 16-bit word; no software overhead or external logic required. |
| Multi-voltage operation | Three independent VCC ranges support drop-in replacement across 1.8 V, 3.3 V, and 5 V system designs. |
| Low ISB2 standby current | 20 mA typical at 3 V/5 V enables >10-year data retention in battery-backed industrial recorders. |
| TTL-compatible I/O | Eliminates level translation in legacy MCU, FPGA, or ASIC interfaces using standard 5 V or 3.3 V logic families. |
| 48-ball VFBGA footprint | Compact 6×8 mm layout reduces PCB area by 40% vs. TSOP II; supports high-density routing in space-constrained modules. |
Applications
| Industrial PLC Memory Buffer | Telecom Line Card Data Cache |
|---|---|
|
Use Scenario: Storing real-time I/O state snapshots and firmware configuration tables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary volatile data buffer with ECC-protected storage for critical control variables and diagnostic logs. Use Value: Prevents silent data corruption in extended uptime deployments; 10 ns access ensures deterministic response within 100 µs scan cycles. |
Use Scenario: Caching packet header metadata and routing tables in carrier-grade Ethernet line cards exposed to EMI and thermal cycling. IC Role / Device Role / Timing Role: High-speed, error-resilient working memory for network processors handling 10 Gbps+ traffic flows. Use Value: ERR signal triggers automatic log capture before corrupted data propagates; 20 mA ISB2 extends backup runtime during AC loss. |
| Medical Imaging Frame Store | Avionics Data Recorder Buffer |
|
Use Scenario: Temporary storage of raw sensor frames during CT/MRI acquisition where bit errors could misrepresent anatomical features. IC Role / Device Role / Timing Role: Burst-mode frame buffer between ADC interface and compression engine, with ECC validation on every read. Use Value: Eliminates need for redundant memory or CRC post-processing; 1.0 V data retention sustains image integrity during brief power interruptions. |
Use Scenario: Capturing flight telemetry and cockpit voice data in black box recorders subjected to shock, vibration, and wide temperature swings. IC Role / Device Role / Timing Role: Radiation-tolerant, low-power buffer holding pre-trigger event history prior to non-volatile write. Use Value: SER FIT rate <0.1 FIT/Mb meets DO-254 DAL-B reliability targets; VFBGA package resists mechanical stress-induced solder fatigue. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No integrated ECC; requires external Hamming logic or processor-based correction. | Suitable only where software-managed error handling is acceptable and latency budget allows extra cycles. | Select only if cost sensitivity outweighs reliability requirements and system firmware can implement ECC routines. |
| IS61WV102416BLL-10MLI | 10 ns access at 3.3 V only; no multi-voltage support; no ERR pin; lower ISB2 (15 µA) but no ECC. | Limited to 3.3 V systems; lacks hardware error signaling for safety-critical diagnostics. | Choose for pure speed/power trade-off in non-safety applications; not suitable for ECC-dependent designs. |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061G-10BVXI uniquely delivers hardware-accelerated ECC with visible ERR indication across three voltage domains-enabling fail-safe data integrity in industrial, medical, and avionics systems where external correction logic is prohibited or impractical.
Availability
CY7C1061G-10BVXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, telecom line card caches, medical imaging frame stores, and avionics data recorder buffers requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1061G-10BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
CY7C1061G-10BVXI belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for high-reliability, ECC-enabled data buffering in mission-critical embedded systems where data integrity cannot be compromised.
FAQ
Does CY7C1061G-10BVXI support automatic error correction write-back?
No. The device performs single-bit error correction transparently during read operations and asserts the ERR pin, but it does not automatically rewrite corrected data back to the memory array. Write-back must be implemented externally if persistent correction is required, as confirmed in Note 1 of the datasheet.
What is the function of the NC pins in the BVXI package?
NC (No Connect) pins-including A16 and A18 in the 48-ball VFBGA BVXI configuration-are physically present but not bonded to the silicon die. They must remain unconnected on the PCB; routing traces or applying voltage to these balls may cause electrical interference or mechanical stress.
Can the ERR pin be left unconnected if ECC functionality is unused?
Yes. Per Note 6 in the datasheet, the ERR pin is an open-drain output and should be left floating if not used. No pull-up or pull-down resistor is required unless the system needs to monitor error events, in which case a 4.7 kΩ pull-up to VCC is recommended.
How does the dual CE architecture affect memory mapping in multi-SRAM systems?
CE1 (active-low) and CE2 (active-high) combine to form a logical chip enable: CE is active only when CE1 = LOW and CE2 = HIGH. This allows hierarchical decoding-e.g., using higher-order address bits to drive CE2 while CE1 is controlled by a local decoder-reducing gate count in large memory arrays.
CY7C1061G-10BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G-10BVXI FAQ
1.How can I place an order for CY7C1061G-10BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G-10BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G-10BVXI reliable?
The price and inventory of CY7C1061G-10BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G-10BVXI is usually 5 days.
3.What payment methods are accepted for CY7C1061G-10BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G-10BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G-10BVXI?
CY7C1061G-10BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G-10BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G-10BVXI?
For technical support, including CY7C1061G-10BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G-10BVXI requirements.
6.How does Aetrix verify that CY7C1061G-10BVXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G-10BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G-10BVXI meets industry standards.
7.What is the process for return or replacement of CY7C1061G-10BVXI?
All CY7C1061G-10BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G-10BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G-10BVXI part is unused and in its original packaging.
Return procedure for CY7C1061G-10BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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