Infineon Technologies CY7C1061G-10ZSXI
- Part No.:
- CY7C1061G-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061G-10ZSXI.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061G-10ZSXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/Os, and dual chip enable (CE1/CE2). It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), delivers 10 ns access time at 5 V, and features an ERR output pin for real-time single-bit error detection and correction. It is used in industrial control systems requiring data integrity under extended temperature operation (–40 °C to +85 °C).
For engineers reviewing the CY7C1061G-10ZSXI datasheet, CY7C1061G-10ZSXI pinout, CY7C1061G-10ZSXI application, or CY7C1061G-10ZSXI equivalent, key selection criteria include ECC support for memory reliability, multi-voltage compatibility, TSOP II package constraints, and dual CE timing behavior in high-availability embedded systems.
Technical Context
This SRAM implements on-die ECC logic that detects and corrects single-bit errors during read cycles without external circuitry, using Hamming code with no automatic write-back. The ERR pin asserts high only when a correctable error occurs, enabling system-level fault logging without interrupt overhead.
It supports byte-wide writes via independent BHE (I/O8–I/O15) and BLE (I/O0–I/O7) controls, and operates with either single CE (pin 29) or dual CE (CE1/CE2) configurations - the -10ZSXI variant uses dual CE and 54-pin TSOP II packaging with ERR functionality enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); provides full-word parallel access for microcontroller or FPGA data buffers. |
| Access Time (tAA) | 10 ns at VCC = 4.5–5.5 V; enables direct interface with 100 MHz bus clocks without wait states. |
| ECC Function | On-die single-bit error detection and correction per read cycle; no software or external logic required. |
| Supply Voltage Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V; supports legacy 5 V, modern low-voltage, and mixed-rail system designs. |
| Standby Current (ISB2) | 20 mA typical at VCC = 5 V, TA = 25 °C; enables low-power retention mode during processor sleep. |
| Operating Current (ICC) | 90 mA typical at f = 100 MHz, VCC = 5 V; defines thermal and power delivery requirements for sustained burst reads/writes. |
| Data Retention Voltage | 1.0 V minimum; allows memory state hold during brown-out or controlled power-down sequences. |
Pinout & Package
Package: 54-pin TSOP II (22.4 mm × 11.84 mm × 1.0 mm), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1 / CE2 | Dual chip enable inputs | Active-low CE1 and active-high CE2 form logical CE; enables hierarchical memory banking and selective device activation. |
| WE | Write enable input | Low pulse initiates write cycle; timing referenced to address and data setup/hold windows defined in AC specs. |
| OE | Output enable input | Controls tri-state of I/O[0:15]; must be asserted low after address valid for read access. |
| BLE / BHE | Byte low/high enable inputs | Independent 8-bit write control: BLE enables I/O0–I/O7, BHE enables I/O8–I/O15; supports partial-word updates. |
| ERR | Error indication output | Open-drain output asserted high during single-bit correction; requires external pull-up for logic-level compatibility. |
| A0–A19 | Address inputs | 20-bit address bus selects one of 1M locations; A19 is MSB and maps to pin 31 in ZSXI configuration. |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; high-impedance when CE inactive or OE/BLE/BHE deasserted. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Corrects single-bit errors on every read without CPU intervention or additional memory bandwidth overhead. |
| Multi-voltage operation | Three discrete VCC ranges allow drop-in replacement across 1.8 V, 3.3 V, and 5 V system generations. |
| Dual chip enable architecture | Enables seamless integration into multi-bank memory controllers with independent chip select granularity. |
| ERR output signaling | Hardware-flagged error event enables deterministic logging, diagnostics, or fail-safe state transitions. |
| 1.0 V data retention | Preserves stored contents during ultra-low-power modes or supply sag, reducing need for backup batteries. |
Applications
| Industrial PLC Data Buffer | Railway Signaling Controller Memory |
|---|---|
|
Use Scenario: Storing real-time I/O status and motion control parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary working memory for deterministic scan-cycle execution, interfacing directly with ARM Cortex-M7 or PowerPC-based control processors. Use Value: ECC ensures bit-flip resilience against EMI in electrically noisy plant floors, eliminating uncorrectable memory faults during critical safety loops. |
Use Scenario: Holding interlocking logic tables and train position history in EN 5012x-certified signaling hardware operating in outdoor cabinets. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding validated route data; accessed synchronously with safety-critical watchdog timers. Use Value: 10 ns access time meets tight timing budgets for SIL-4 response windows, while –40 °C to +85 °C rating guarantees operation in unheated trackside enclosures. |
| Medical Imaging Frame Store | Avionics Display Buffer |
|
Use Scenario: Temporary storage of raw sensor frames from ultrasound transducers before DSP processing in portable diagnostic devices. IC Role / Device Role / Timing Role: High-bandwidth frame buffer between ADC interface and FPGA-based beamformer, supporting burst transfers at >80 MB/s. Use Value: Dual CE and byte-enable support allows concurrent read/write operations across multiple image regions, improving pipeline throughput. |
Use Scenario: Rendering buffer for multifunction display units in commercial aircraft cockpits, where data integrity is mandated by DO-254. IC Role / Device Role / Timing Role: Safety-critical display memory mapped to ARINC 661-compliant graphics controller with lockstep verification. Use Value: ERR pin integration enables flight software to log memory anomalies without halting display refresh, satisfying continuous operation requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No integrated ECC; requires external logic or software for error handling; 10 ns access at 3.3 V only. | Suitable for cost-sensitive non-safety applications where ECC is optional or implemented externally. | Select when system already includes ECC-capable memory controller and voltage is fixed at 3.3 V. |
| IS61WV102416BLL-10MLI | 10 ns access at 3.3 V; no ERR pin; lower standby current (15 µA vs. 20 mA); no multi-voltage support. | Used in battery-powered portable instruments where ultra-low ISB dominates over ECC capability. | Choose when long-term data retention at microamp levels outweighs need for real-time error flagging. |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061G-10ZSXI uniquely combines on-die ECC with multi-voltage operation and hardware ERR signaling-critical for industrial and transportation systems where memory reliability must be guaranteed without software dependency or voltage redesign.
Availability
CY7C1061G-10ZSXI is available at Aetrix Electronics and suitable for industrial PLCs, railway signaling controllers, medical imaging subsystems, and avionics display units requiring stable component supply across extended temperature and multi-voltage environments.
Supply support for CY7C1061G-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, including industrial-grade SRAMs with advanced data integrity features.
CY7C1061G-10ZSXI belongs to the Cypress legacy SRAM product line designed specifically for mission-critical embedded systems demanding ECC, wide temperature operation, and flexible voltage compatibility.
FAQ
Does CY7C1061G-10ZSXI support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles but does not automatically write the corrected data back to memory. System firmware must initiate a separate write cycle if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet and confirmed in the functional description section.
What is the function of the ERR pin, and how should it be terminated?
The ERR pin is an open-drain output that asserts high when a single-bit error is detected and corrected during a read access. If unused, it must be left floating per datasheet Note 6; if monitored, it requires an external pull-up resistor to VCC to establish a valid logic-high level. No internal pull-up is provided.
Can CY7C1061G-10ZSXI operate reliably at 1.8 V?
Yes - it supports 1.65 V to 2.2 V operation with 15 ns access time (tAA), as specified in the Product Portfolio table. At 1.8 V, typical ICC is 70 mA and ISB2 is 20 mA. The -10ZSXI speed grade is rated for 10 ns only at 4.5–5.5 V; 1.8 V operation uses the -15 speed variant.
How does dual chip enable (CE1/CE2) differ from single CE in timing behavior?
CE1 and CE2 form a logical CE: CE is active only when CE1 = LOW and CE2 = HIGH. This enables hierarchical memory decoding - for example, CE1 driven by upper address bits and CE2 by chip-select logic - allowing finer-grained bank selection than single CE. Timing parameters like tCE and tCO are referenced to the CE transition, not individual pins.
CY7C1061G-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061G-10ZSXI FAQ
1.How can I place an order for CY7C1061G-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G-10ZSXI reliable?
The price and inventory of CY7C1061G-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1061G-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G-10ZSXI?
CY7C1061G-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G-10ZSXI?
For technical support, including CY7C1061G-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G-10ZSXI requirements.
6.How does Aetrix verify that CY7C1061G-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1061G-10ZSXI?
All CY7C1061G-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1061G-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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