Infineon Technologies CY7C1061G18-15BV1XI
- Part No.:
- CY7C1061G18-15BV1XI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G18-15BV1XI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:241
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Product details
Overview
CY7C1061G18-15BV1XI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), rated for 15 ns access time, 1.65–2.2 V operation, and industrial temperature range (–40 °C to +85 °C). It features TTL-compatible I/Os, ERR output for error indication, and dual chip enable (CE1/CE2) logic - deployed in mission-critical memory buffers for industrial controllers and avionics data recorders.
For engineers reviewing the CY7C1061G18-15BV1XI datasheet, CY7C1061G18-15BV1XI pinout, CY7C1061G18-15BV1XI application, or CY7C1061G18-15BV1XI equivalent, key selection factors include ECC-enabled reliability at 1.8 V supply, VFBGA-48 package compatibility with high-density PCB layouts, byte-level write control via BHE/BLE, and errata-free read-cycle error reporting without automatic write-back.
Technical Context
This SRAM implements on-die Hamming-code ECC logic that detects and corrects single-bit errors during read operations, with ERR pin assertion (high) signaling correction completion. No automatic write-back occurs - corrected data appears only on I/O pins, preserving deterministic timing.
It supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) but the -15BV1XI variant is specifically configured for 1.65–2.2 V operation with 15 ns tAA. Its dual CE architecture (CE1/CE2) enables hierarchical memory banking, while BHE/BLE allow independent upper/lower byte writes to 16-bit words without bus turnaround.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) - provides full 2 MB of byte-addressable storage space for firmware caching or real-time buffer applications. |
| Access Time (tAA) | 15 ns max at VCC = 1.8 V - enables direct interfacing with 66 MHz microcontrollers without wait states. |
| Voltage Range | 1.65 V to 2.2 V - optimized for low-power 1.8 V systems, reducing dynamic power vs. 3.3 V SRAMs by ~60% at same frequency. |
| Active Current (ICC) | 90 mA typical at 100 MHz - defines thermal budget for continuous burst reads in compact enclosures. |
| Standby Current (ISB2) | 20 mA typical - ensures ultra-low leakage during sleep modes in battery-backed systems. |
| ECC Function | Single-bit error detection and correction per 16-bit word - improves FIT rate to <0.1 FIT/Mb, critical for DO-254-compliant avionics. |
| Data Retention | 1.0 V minimum - allows retention during brown-out events down to 1 V, supporting graceful shutdown protocols. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, RoHS-compliant, industrial-grade (I).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word decoding; A19 placed at ball G2 per BV1XI configuration. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; high-impedance when CE/OE/BLE/BHE inactive - eliminates bus contention in multi-SRAM systems. |
| CE1 / CE2 | Dual Chip Enable Inputs | Logical AND gate: device enabled only when CE1 = LOW and CE2 = HIGH - enables bank-select decoding without external logic. |
| WE | Write Enable | Active-low control for write cycles; latches data on rising edge of WE when CE and OE are asserted. |
| OE | Output Enable | Active-low control for read output drivers; decouples memory access from system clock domain. |
| BHE / BLE | Byte High/Low Enable | Independent control of upper (I/O8–I/O15) and lower (I/O0–I/O7) bytes - enables 8-bit peripheral interfacing on 16-bit bus. |
| ERR | Error Report Output | Open-drain active-high signal pulsed during read cycle if single-bit error detected/corrected - requires external pull-up for interrupt generation. |
| VCC / VSS | Power / Ground | Two VCC balls (balls E1, F1) and two VSS balls (balls D1, H1) minimize IR drop and improve noise immunity in high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | On-die Hamming decoder corrects single-bit errors per 16-bit word without CPU intervention - reduces software overhead in safety-critical firmware. |
| Dual CE architecture | CE1/CE2 inputs replace external address decoder logic for 2-bank memory expansion - saves 3–5 gates and routing area on dense PCBs. |
| TTL-compatible I/O | VIH/VIL thresholds match legacy 1.8 V logic families - enables drop-in replacement of older SRAMs without level-shifter redesign. |
| 1.0 V data retention | Maintains stored contents during undervoltage lockout (UVLO) down to 1.0 V - supports deterministic state recovery after power interruption. |
| VFBGA-48 footprint | 6 × 8 mm body with 0.5 mm pitch - achieves >40% board area reduction vs. TSOP-II, critical for UAV flight controllers and medical imaging modules. |
Applications
| Industrial PLC Memory Buffer | Avionics Data Recorder |
|---|---|
|
Use Scenario: Real-time logging of sensor inputs and control outputs in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary non-volatile shadow RAM holding runtime configuration and fault history; accessed at 50–100 MHz burst rates. Use Value: ECC prevents silent data corruption from alpha particles or EMI-induced bit flips - eliminating unreported CRC mismatches in safety audits. |
Use Scenario: Continuous recording of flight telemetry (attitude, engine parameters, GPS) in commercial aircraft black box systems. IC Role / Device Role / Timing Role: High-reliability buffer between ADC interface and flash controller; operates under extended temperature cycling (-40 °C to +85 °C). Use Value: 1.0 V data retention ensures no loss of last 30 seconds of pre-crash data during main power failure - meets ED-112A crash survivability requirements. |
| Railway Signaling Controller | Medical Imaging Frame Store |
|
Use Scenario: Storing interlocking logic states and track occupancy maps in wayside signaling units compliant with EN 50126/128/129. IC Role / Device Role / Timing Role: Dual-port accessible memory bank synchronized to 25 MHz safety processor clock; ERR pin wired to watchdog interrupt. Use Value: SER FIT <0.1 FIT/Mb satisfies SIL-4 hardware fault tolerance targets without requiring redundant memory mirroring. |
Use Scenario: Temporary frame buffering in portable ultrasound machines where image data must be preserved across brief battery swaps. IC Role / Device Role / Timing Role: Low-voltage (1.8 V) SRAM interfaced directly to FPGA video pipeline; supports 16-bit pixel depth at 60 fps. Use Value: VFBGA-48 package enables <12 mm² footprint - allowing integration into handheld probe housings with strict mechanical envelope constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-15BLI | No embedded ECC; requires external error-checking logic or software ECC - increases BOM cost and CPU load. | Suitable for cost-sensitive industrial HMIs where FIT rate not certified. | Select only if ECC is implemented in host processor and system-level FIT budget permits. |
| Microchip 23LC1024-I/P | Serial SPI interface (vs. parallel); 1 Mbit density (1/16th capacity); no built-in ECC - relies on host-driven CRC. | Fits space-constrained designs needing minimal pin count, not high-bandwidth buffering. | Choose for low-pin-count MCU interfaces where 15 ns parallel latency is unnecessary. |
Compared with IS61WV102416BLL-15BLI and 23LC1024-I/P, CY7C1061G18-15BV1XI delivers deterministic hardware ECC correction, 16× higher density than serial alternatives, and 15 ns parallel access - making it uniquely suited for safety-certified, high-throughput memory subsystems where latency, reliability, and density are jointly constrained.
Availability
CY7C1061G18-15BV1XI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, avionics data recorders, and railway signaling controllers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1061G18-15BV1XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
CY7C1061G18-15BV1XI belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for industrial and aerospace applications demanding ECC protection, wide temperature operation, and long-term obsolescence mitigation.
FAQ
Does CY7C1061G18-15BV1XI support automatic error write-back after correction?
No. The device performs single-bit error detection and correction during read cycles and asserts the ERR pin, but corrected data remains only on the I/O bus - it does not automatically rewrite the corrected value back to the memory array. Host firmware must initiate a separate write cycle if persistent correction is required.
What is the function of the ERR pin, and how should it be terminated?
The ERR pin is an open-drain output that goes high during a read cycle when a single-bit error is detected and corrected. If used for interrupt generation, it requires an external pull-up resistor (typically 4.7 kΩ to VCC). If unused, the pin must be left floating per datasheet Note 6 - tying it to VCC or GND may cause functional failure.
Can CY7C1061G18-15BV1XI operate at 2.5 V?
No. The -15BV1XI suffix specifies the 1.65–2.2 V voltage grade. Operation at 2.5 V falls outside its validated range and violates Absolute Maximum Ratings - it may cause excessive leakage, timing violations, or premature wear. For 2.2–3.6 V operation, select CY7C1061G30-10ZSXI or equivalent.
How does the dual CE architecture affect address decoding in multi-SRAM systems?
CE1 and CE2 form a logical AND: the device activates only when CE1 = LOW and CE2 = HIGH. This allows simple bank selection using one address line driving CE1 and its inverse driving CE2 - eliminating need for discrete AND gates or CPLD logic in 2-bank memory expansions.
CY7C1061G18-15BV1XI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G18-15BV1XI FAQ
1.How can I place an order for CY7C1061G18-15BV1XI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G18-15BV1XI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G18-15BV1XI reliable?
The price and inventory of CY7C1061G18-15BV1XI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G18-15BV1XI is usually 5 days.
3.What payment methods are accepted for CY7C1061G18-15BV1XI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G18-15BV1XI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G18-15BV1XI?
CY7C1061G18-15BV1XI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G18-15BV1XI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G18-15BV1XI?
For technical support, including CY7C1061G18-15BV1XI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G18-15BV1XI requirements.
6.How does Aetrix verify that CY7C1061G18-15BV1XI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G18-15BV1XI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G18-15BV1XI meets industry standards.
7.What is the process for return or replacement of CY7C1061G18-15BV1XI?
All CY7C1061G18-15BV1XI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G18-15BV1XI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G18-15BV1XI part is unused and in its original packaging.
Return procedure for CY7C1061G18-15BV1XI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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