Infineon Technologies CY7C1061G18-15BV1XIT
- Part No.:
- CY7C1061G18-15BV1XIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G18-15BV1XIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,102
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061G18-15BV1XIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 15 ns access time, 1.65–2.2 V supply, and featuring TTL-compatible I/Os, ERR output for error indication, and dual chip enable (CE1/CE2) logic. It is used in industrial control systems requiring data integrity under radiation-prone or long-term reliability conditions.
For engineers reviewing the CY7C1061G18-15BV1XIT datasheet, CY7C1061G18-15BV1XIT pinout, CY7C1061G18-15BV1XIT application, or CY7C1061G18-15BV1XIT equivalent, this device supports byte-level writes via BHE/ BLE, high-impedance I/O during deselection, and 1.0 V data retention - critical for low-power hold modes in programmable logic controllers and avionics memory buffers.
Technical Context
This SRAM implements on-die ECC logic that detects and corrects single-bit errors during read cycles without automatic write-back, signaling correction events via the open-drain ERR pin. Its dual CE architecture (CE1/CE2) enables hierarchical memory mapping in multi-bank systems, while address MSB A19 placement at Ball G2 confirms compatibility with legacy Cypress board layouts.
The device supports three VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) with distinct timing and current profiles; for the -15 variant, tAA = 15 ns is guaranteed at 1.65–2.2 V, with typical ICC = 70 mA at 66.7 MHz and ISB2 = 20 mA in deep standby - enabling use in mixed-voltage industrial backplanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 16 Mbit (1,048,576 × 16-bit words) - supports full-word parallel access for microcontroller data buses without external multiplexing. |
| Access time (tAA) | 15 ns max at 1.65–2.2 V - enables direct interface with 66.7 MHz synchronous controllers without wait states. |
| ECC capability | Single-bit error detection and correction per read cycle - reduces uncorrectable error rate to <0.1 FIT/Mb per AN88889. |
| Supply voltage range | 1.65 V to 2.2 V - optimized for low-voltage industrial FPGA/ASIC core domains with tight power budgets. |
| Standby current (ISB2) | 20 mA typical - allows sustained data retention at 1.0 V VCC during brown-out or sleep mode in safety-critical systems. |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm), Package ID BV1XI - surface-mount footprint compatible with automated optical inspection and high-density PCB routing. |
| ERR pin function | Active-HIGH open-drain output indicating single-bit correction event - enables real-time fault logging without interrupt controller overhead. |
Pinout & Package
48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 × 8 array, 0.5 mm pitch, 1.0 mm height. Pinout conforms to Package/Grade ID BV1XI: single chip enable (CE), ERR output present, address MSB A19 located at Ball G2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE | Chip Enable input | Active-LOW enable for memory access; places all I/Os in high-impedance state when HIGH - essential for bus arbitration in multi-device systems. |
| WE | Write Enable input | Active-LOW control for write operations; latches data on I/O0–I/O15 when asserted with valid address - enables precise timing control for burst writes. |
| OE | Output Enable input | Active-LOW gate for read data output; decouples SRAM output drivers from bus when deasserted - prevents contention during DMA transfers. |
| BHE / BLE | Byte High/Low Enable inputs | Independent control of upper (I/O8–I/O15) and lower (I/O0–I/O7) byte lanes - supports 8-bit peripheral interfacing on 16-bit buses. |
| ERR | Error indication output | Open-drain signal asserted HIGH during single-bit correction - connects directly to microcontroller GPIO with pull-up for fault-triggered diagnostics. |
| A0–A19 | Address inputs | 20-bit address bus supporting full 1M-word addressing; A19 at Ball G2 matches legacy Cypress layout for drop-in replacement. |
| I/O0–I/O15 | Bi-directional data bus | 16-bit parallel interface with TTL-compatible thresholds - eliminates level-shifter requirements in 1.8 V/3.3 V mixed-signal designs. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | On-die Hamming-code circuitry corrects single-bit errors per 16-bit word without CPU intervention or additional latency. |
| Multi-voltage operation | Three independent VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) allow reuse across FPGA, MCU, and legacy 5 V subsystems without redesign. |
| Low-power standby | ISB2 = 20 mA typical at 1.65–2.2 V enables >10-year data retention in battery-backed industrial recorders. |
| TTL-compatible I/O | VIH = 1.4 V min and VIL = 0.4 V max at 1.65–2.2 V ensure robust noise margin against EMI in motor drive environments. |
| Configurable byte access | BHE/ BLE pins permit independent 8-bit writes to upper/lower bytes - reduces bus traffic in firmware update routines. |
Applications
| Industrial PLC Data Buffer | Radiation-Tolerant Avionics Memory |
|---|---|
|
Use Scenario: Real-time I/O scanning and ladder logic execution in modular programmable logic controllers with extended temperature cycling. IC Role / Device Role / Timing Role: Primary data scratchpad for runtime variables, retaining state during power interruption and correcting bit flips induced by EMI. Use Value: 1.0 V data retention and 15 ns access enable deterministic scan times under 100 µs; ECC eliminates need for periodic memory scrubbing software. |
Use Scenario: Non-volatile configuration storage and telemetry buffering in satellite onboard computers exposed to cosmic radiation. IC Role / Device Role / Timing Role: Error-resilient working memory for flight software, where single-event upsets (SEUs) must be corrected before propagation. Use Value: SER FIT rate <0.1 FIT/Mb ensures less than one uncorrectable error per billion device-hours - meeting ECSS-Q-ST-60-13C Class B requirements. |
| Medical Imaging Frame Buffer | Automotive ADAS Sensor Fusion Cache |
|
Use Scenario: Temporary storage of raw X-ray or MRI pixel data during preprocessing in portable diagnostic equipment. IC Role / Device Role / Timing Role: High-bandwidth 16-bit interface buffer between ADC pipeline and DSP engine, operating at 66.7 MHz. Use Value: 15 ns tAA and 70 mA ICC support continuous 120 MB/s throughput without thermal throttling in fanless enclosures. |
Use Scenario: Intermediate cache for radar + camera sensor fusion algorithms in autonomous driving ECUs with ASIL-B compliance. IC Role / Device Role / Timing Role: Shared memory bank between dual-core lockstep processors, monitored for data corruption via ERR pin assertion. Use Value: ERR output provides hardware-verified fault evidence for ISO 26262 diagnostic coverage reporting without software polling overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-15BLI | No integrated ECC; requires external error-checking logic or software-based Hamming implementation. | Lacks hardware-level error indication; increases firmware complexity and latency for correction path. | Select only if system already implements ECC in software and cost sensitivity outweighs reliability assurance. |
| MT48LC16M16A2P-75:C | Synchronous DRAM with built-in ECC, but requires refresh cycles and has higher latency (tRC = 120 ns vs. SRAM's 15 ns). | Not suitable for deterministic real-time access; introduces jitter in hard real-time control loops. | Prefer only for high-density (>64 Mbit), non-real-time buffering where bandwidth > latency is prioritized. |
Compared with IS61WV102416BLL-15BLI and MT48LC16M16A2P-75:C, CY7C1061G18-15BV1XIT delivers deterministic zero-refresh access, hardware ECC with dedicated ERR signaling, and industrial-grade voltage/temperature tolerance - making it uniquely suited for safety-critical, latency-constrained embedded memory roles.
Availability
CY7C1061G18-15BV1XIT is available at Aetrix Electronics and suitable for industrial PLCs, avionics data loggers, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1061G18-15BV1XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability and functional safety.
CY7C1061G18-15BV1XIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-integrity embedded systems where data corruption resilience, deterministic timing, and industrial temperature operation are mandatory.
FAQ
Does CY7C1061G18-15BV1XIT support automatic error correction write-back?
No. The device detects and corrects single-bit errors during read cycles but does not perform automatic write-back to memory. Correction occurs internally and is signaled via the ERR pin; the corrected data appears on I/O lines, but the original corrupted word remains unchanged in the array unless explicitly rewritten by the host system.
What is the function of the ERR pin, and how should it be terminated?
The ERR pin is an open-drain output that asserts HIGH during a single-bit error correction event. It must be externally pulled up to VCC (1.65–2.2 V) with a 4.7 kΩ resistor. When unused, it may be left floating per datasheet Note 6, but active monitoring requires pull-up and connection to an interrupt-capable GPIO.
Can CY7C1061G18-15BV1XIT operate at 1.8 V with 15 ns access time?
Yes. The -15 speed grade is fully specified for tAA ≤ 15 ns across the entire 1.65–2.2 V VCC range, including 1.8 V nominal operation. Typical ICC at 1.8 V/66.7 MHz is 70 mA, and ISB2 is 20 mA - both guaranteed over –40 °C to +85 °C.
Is the 48-ball VFBGA package (BV1XI) RoHS-compliant and lead-free?
Yes. The BV1XI package designation indicates Pb-free (lead-free) construction per JEDEC J-STD-609, with matte tin surface finish and full compliance to RoHS Directive 2011/65/EU and REACH Regulation EC 1907/2006. No exemptions apply.
CY7C1061G18-15BV1XIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G18-15BV1XIT FAQ
1.How can I place an order for CY7C1061G18-15BV1XIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G18-15BV1XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G18-15BV1XIT reliable?
The price and inventory of CY7C1061G18-15BV1XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G18-15BV1XIT is usually 5 days.
3.What payment methods are accepted for CY7C1061G18-15BV1XIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G18-15BV1XIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G18-15BV1XIT?
CY7C1061G18-15BV1XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G18-15BV1XIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G18-15BV1XIT?
For technical support, including CY7C1061G18-15BV1XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G18-15BV1XIT requirements.
6.How does Aetrix verify that CY7C1061G18-15BV1XIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061G18-15BV1XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G18-15BV1XIT meets industry standards.
7.What is the process for return or replacement of CY7C1061G18-15BV1XIT?
All CY7C1061G18-15BV1XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G18-15BV1XIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G18-15BV1XIT part is unused and in its original packaging.
Return procedure for CY7C1061G18-15BV1XIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061G18-15BV1XIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

