Infineon Technologies CY7C1061G18-15BVXI
- Part No.:
- CY7C1061G18-15BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G18-15BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061G18-15BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 15 ns access time, 1.65–2.2 V supply, and featuring ERR output for real-time error indication. It supports dual chip enable (CE1/CE2), byte-level writes via BHE/BLE, and is packaged in 48-ball VFBGA (6 × 8 × 1.0 mm) for space-constrained industrial memory subsystems.
For engineers reviewing the CY7C1061G18-15BVXI datasheet, CY7C1061G18-15BVXI pinout, CY7C1061G18-15BVXI application, or CY7C1061G18-15BVXI equivalent, this device is selected for high-reliability SRAM applications requiring ECC-enabled data integrity, low standby current (20 mA typical), TTL-compatible I/O, and multi-voltage support across 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V rails.
Technical Context
This SRAM implements on-die Hamming-code ECC logic that detects and corrects single-bit errors during read cycles, with ERR pin assertion indicating correction events-no automatic write-back is performed. The device uses asynchronous addressing with CE1/CE2 control logic to define active chip state, and supports independent upper/lower byte writes via BHE and BLE signals tied to I/O8–I/O15 and I/O0–I/O7 respectively.
It operates across three distinct VCC ranges with corresponding speed grades: 15 ns at 1.65–2.2 V, 10 ns at 2.2–3.6 V and 4.5–5.5 V. Data retention is guaranteed down to 1.0 V, and all I/Os enter high-impedance state when deselected or under disabled control conditions (OE, CE, BHE, BLE).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); provides full-word parallel access without external multiplexing. |
| Access Time (tAA) | 15 ns at 1.65–2.2 V; defines maximum clock-to-data valid delay in high-speed synchronous bus interfaces. |
| VCC Range | 1.65 V to 2.2 V (primary grade); enables compatibility with 1.8 V core logic while maintaining ECC functionality. |
| Standby Current (ISB2) | 20 mA typical; ensures low power consumption during idle states in battery-backed or energy-sensitive systems. |
| ECC Function | Single-bit error detection and correction per 16-bit word; reduces uncorrectable error rate to <0.1 FIT/Mb per AN88889. |
| ERR Output | Dedicated open-drain output asserted HIGH on corrected read; enables system-level fault logging without polling. |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm); supports fine-pitch routing and thermal performance suitable for industrial PCBs. |
Pinout & Package
48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 × 8 array, 0.5 mm pitch, 1.0 mm height. Pinout conforms to Figure 2 of datasheet Rev. *T: dual chip enable (CE1/CE2), A19 at ball H6, no ERR pin-consistent with CY7C1061G18-15BVXI ordering code BVXI.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word decoding; A19 placed at ball H6 per BVXI configuration. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE for byte-select writes. |
| CE1, CE2 | Dual Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 form logical CE; enables selective bank activation in multi-SRAM systems. |
| WE | Write Enable Input | Active-LOW signal initiating write cycle; latches data on rising edge of WE when CE and OE are inactive. |
| OE | Output Enable Input | Active-LOW control enabling read data onto I/O lines; high-impedance when deasserted or during write. |
| BHE, BLE | Byte Enable Inputs | Control upper/lower byte write masking; allows partial-word updates without disturbing adjacent bytes. |
| VCC, VSS | Power Supply Terminals | Two VCC balls (F1, G1) and two VSS balls (D1, E1) provide low-inductance power distribution and noise reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | On-die Hamming-code circuitry corrects single-bit errors in real time during reads-no external controller required. |
| Dual chip enable architecture | CE1/CE2 inputs allow hierarchical memory mapping and reduce address decoding complexity in multi-bank systems. |
| Multi-voltage operation | Three discrete VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) enable drop-in replacement across legacy and modern logic families. |
| 1.0 V data retention | Retains stored data at VCC ≥ 1.0 V, supporting graceful shutdown and battery-backed hold modes. |
| TTL-compatible I/O | Input thresholds and output drive levels match standard TTL logic, eliminating level-shifter requirements in mixed-voltage designs. |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Real-time I/O buffering in programmable logic controllers where deterministic latency and data integrity are critical. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between FPGA-based control logic and fieldbus interface, handling burst transfers at ≤100 MHz. Use Value: 15 ns tAA ensures sub-cycle response to motion-control interrupts; ECC prevents silent corruption in safety-critical ladder logic execution. |
Use Scenario: Temporary frame storage in portable ultrasound devices during image acquisition before compression and transmission. IC Role / Device Role / Timing Role: High-bandwidth pixel buffer interfacing directly with ADC output and DSP engine via 16-bit parallel bus. Use Value: Dual VCC support (1.8 V core / 3.3 V I/O) simplifies power domain partitioning; 20 mA ISB2 extends battery life during standby imaging intervals. |
| Avionics Data Logger | Test & Measurement Equipment |
|
Use Scenario: Non-volatile event capture in flight data recorders where radiation-induced bit flips must be mitigated without system reset. IC Role / Device Role / Timing Role: Primary working memory for cyclic redundancy-checked telemetry packets prior to EEPROM backup. Use Value: <0.1 FIT/Mb SER rate meets DO-254 DAL-B reliability targets; ERR pin triggers diagnostic flagging without CPU intervention. |
Use Scenario: Acquisition memory in digital oscilloscopes capturing high-speed analog waveforms at >100 MS/s sampling rates. IC Role / Device Role / Timing Role: Ring buffer for pre-trigger/post-trigger waveform storage, accessed via high-speed address sequencer. Use Value: 48-ball VFBGA footprint minimizes trace length and signal skew; TTL-compatible I/O ensures clean timing margins with FPGA-based capture logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No integrated ECC; requires external error-handling logic or software correction. | Suitable only where system-level ECC is already implemented or FIT rate requirements are less stringent. | Select when cost sensitivity outweighs need for autonomous hardware-level correction. |
| MT28EW128ABA1HPC-0SIT | Serial Quad SPI interface; 128 Mbit density; built-in ECC but asynchronous read latency >50 ns. | Used in firmware storage or infrequent-access configuration memory-not for high-speed parallel buffering. | Choose for space-constrained designs needing higher density and serial interface simplicity over parallel bandwidth. |
Compared with CY7C1061G18-15BVXI, IS61WV102416BLL-10MLI lacks on-die ECC and increases system-level validation burden, while MT28EW128ABA1HPC-0SIT trades parallel throughput and low-latency access for serial density and simplified layout-neither matches the 15 ns + hardware ECC + 16-bit bus combination of the CY7C1061G18-15BVXI.
Availability
CY7C1061G18-15BVXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, avionics data loggers, and test & measurement equipment requiring stable component supply across extended temperature and voltage ranges.
Supply support for CY7C1061G18-15BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, emphasizing automotive, industrial, and aerospace-grade components with rigorous qualification and long-term supply commitment.
CY7C1061G18-15BVXI belongs to the Cypress SRAM product line originally designed for mission-critical embedded systems demanding ECC protection, low-power operation, and multi-voltage interoperability in harsh environments.
FAQ
Does CY7C1061G18-15BVXI support automatic error correction write-back?
No. The device performs single-bit error detection and correction during read cycles only, and does not automatically write the corrected data back to the memory array. System firmware must explicitly initiate a write if persistent correction is required. This behavior is documented in Note 1 of the datasheet Rev. *T.
What is the function of the ERR pin on CY7C1061G18-15BVXI?
The ERR pin is an open-drain output that asserts HIGH during a read cycle when a single-bit error is detected and corrected in the accessed 16-bit word. It remains LOW otherwise. If unused, the pin must be left floating per Note 6 in the datasheet-no pull-up or pull-down is required.
Can CY7C1061G18-15BVXI operate at 2.5 V supply?
Yes. The device supports the 2.2 V to 3.6 V VCC range, and at 2.5 V it achieves 10 ns access time (CY7C1061G(E)30 speed grade). However, CY7C1061G18-15BVXI is specifically rated for 15 ns operation within the 1.65–2.2 V range; using 2.5 V would require selecting a different speed variant such as CY7C1061GE30-10ZSXI.
Is the 48-ball VFBGA package of CY7C1061G18-15BVXI RoHS compliant?
Yes. The BVXI suffix denotes a Pb-free, RoHS-compliant 48-ball VFBGA package with NiPdAu surface finish, qualified per JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and rated for reflow peak temperatures up to 260 °C.
CY7C1061G18-15BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G18-15BVXI FAQ
1.How can I place an order for CY7C1061G18-15BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G18-15BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G18-15BVXI reliable?
The price and inventory of CY7C1061G18-15BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G18-15BVXI is usually 5 days.
3.What payment methods are accepted for CY7C1061G18-15BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G18-15BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G18-15BVXI?
CY7C1061G18-15BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G18-15BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G18-15BVXI?
For technical support, including CY7C1061G18-15BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G18-15BVXI requirements.
6.How does Aetrix verify that CY7C1061G18-15BVXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G18-15BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G18-15BVXI meets industry standards.
7.What is the process for return or replacement of CY7C1061G18-15BVXI?
All CY7C1061G18-15BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G18-15BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G18-15BVXI part is unused and in its original packaging.
Return procedure for CY7C1061G18-15BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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