My Inquiry
My Account
Infineon Technologies CY7C1061G18-15BVXIT
- Part No.:
- CY7C1061G18-15BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G18-15BVXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,859
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061G18-15BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) synchronous CMOS static RAM with embedded single-bit error-correcting code (ECC), 15 ns access time, 1.65–2.2 V supply operation, and integrated ERR output for real-time error indication. It supports dual chip enable (CE1/CE2), byte-level writes via BHE/BLE, and operates in industrial temperature range (–40 °C to +85 °C) for mission-critical memory subsystems in avionics data loggers.
For engineers reviewing the CY7C1061G18-15BVXIT datasheet, CY7C1061G18-15BVXIT pinout, CY7C1061G18-15BVXIT application, or CY7C1061G18-15BVXIT equivalent, this page delivers verified package mapping (48-ball VFBGA, BVXIT grade), ECC functional behavior, TSOP/VFBGA pin compatibility, and validated alternatives for high-reliability SRAM replacement in safety-aware embedded systems.
Technical Context
The CY7C1061G18-15BVXIT implements a full-cycle ECC engine that detects and corrects single-bit errors during read operations without requiring external logic or software intervention. Its ERR pin asserts high only when correction occurs, enabling deterministic fault logging in real-time systems.
It supports three distinct VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), with the -15BVXIT variant specifically rated for 15 ns tAA at 1.65–2.2 V. Addressing uses A0–A19 (20-bit), I/O0–I/O15 (16-bit bidirectional bus), and dedicated byte enables (BHE/BLE) for partial-word writes - all TTL-compatible with VIL/VIH thresholds defined per voltage tier.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); enables compact 2 MB data buffers without external multiplexing. |
| Access Time (tAA) | 15 ns max at VCC = 1.65–2.2 V; guarantees timing closure in 66 MHz synchronous bus interfaces. |
| ECC Function | Hardware-based single-bit error detection and correction per 16-bit word; no software overhead or write-back latency. |
| Supply Voltage Range | 1.65 V to 2.2 V (primary for -15BVXIT); supports low-power industrial SoC integration with 1.8 V rails. |
| Standby Current (ISB2) | 20 mA typical at VCC = 1.8 V, TA = 25 °C; enables <100 µW retention power with 1.0 V data hold. |
| Operating Current (ICC) | 90 mA typical at f = 100 MHz, VCC = 1.8 V; defines thermal budget for dense memory arrays in sealed enclosures. |
| Package | 48-ball VFBGA (6 mm × 8 mm × 1.0 mm, 0.8 mm ball pitch); supports automated optical inspection and fine-pitch PCB routing. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 × 8 mm body, 1.0 mm height, 0.8 mm ball pitch, RoHS-compliant Pb-free finish. Pinout corresponds to BVXIT grade: dual chip enable (CE1/CE2), ERR output enabled, A19 at ball G2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; A19 placed at ball G2 per BVXIT configuration for pin-compatible migration from legacy Cypress designs. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; supports byte-wide reads/writes via BHE (I/O8–I/O15) and BLE (I/O0–I/O7). |
| CE1, CE2 | Dual Chip Enable Inputs | Active-low CE1 and active-high CE2 form logical CE; enables hierarchical memory decoding in multi-bank systems. |
| WE | Write Enable Input | Active-low control synchronizing write cycles; sampled on rising edge of clock-equivalent timing. |
| OE | Output Enable Input | Active-low gate for data bus drivers; allows shared bus arbitration without external transceivers. |
| BHE, BLE | Byte Enable Inputs | Independent control of upper/lower 8-bit lanes; eliminates need for external byte-masking logic. |
| ERR | Error Indication Output | Open-drain output asserted high during single-bit correction; directly interfaces to FPGA interrupt inputs or microcontroller GPIO. |
| VCC, VSS | Power & Ground | Dual VCC balls (balls E1, F1) and dual VSS balls (balls D1, E2) reduce IR drop and improve signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Corrects single-bit errors in real time with zero CPU intervention; SER FIT rate <0.1 FIT/Mb per AN88889. |
| Dual-Voltage Operation | Supports 1.65–2.2 V (optimized for -15BVXIT), 2.2–3.6 V, and 4.5–5.5 V rails - simplifies legacy-to-modern system upgrades. |
| ERR Pin Assertion Logic | ERR goes HIGH only during successful correction events; avoids false alarms during normal reads or uncorrectable multi-bit errors. |
| Low-Power Retention Mode | Maintains data integrity at 1.0 V VCC with no refresh required; extends battery life in always-on monitoring nodes. |
| TTL-Compatible I/O | VIH/VIL thresholds scale with VCC; ensures interoperability with mixed-voltage ASICs and FPGAs without level shifters. |
Applications
| Avionics Data Logger | Railway Signaling Controller |
|---|---|
|
Use Scenario: Continuous high-speed recording of flight parameter telemetry (AOA, Mach, altitude) with guaranteed data integrity over 10,000+ hour service life. IC Role / Device Role / Timing Role: Primary non-refreshed buffer memory storing 16-bit sensor samples at 100 kHz; ECC prevents latent corruption in radiation-prone environments. Use Value: Eliminates need for periodic memory scrubbing or redundant checksum validation, reducing firmware complexity and CPU load by >35%. |
Use Scenario: Real-time interlocking logic execution in European Train Control System (ETCS) Level 2 balise readers, where memory failure could trigger emergency braking. IC Role / Device Role / Timing Role: Safety-critical scratchpad RAM holding dynamic route tables and movement authority flags; ERR pin feeds into SIL-4 watchdog chain. Use Value: Enables compliance with EN 50129 Annex C.3.2 for "detectable hardware faults" without external ECC ICs or FPGA logic resources. |
| Medical Imaging Front-End | Industrial PLC Motion Buffer |
|
Use Scenario: Storing raw 16-bit ADC samples from ultrasound beamforming arrays prior to GPU-accelerated reconstruction. IC Role / Device Role / Timing Role: Low-latency frame buffer interfacing directly to ADC controller; 15 ns tAA meets 66 MHz pixel clock timing budgets. Use Value: Prevents image artifacts caused by bit-flips in echo data - critical for FDA Class II diagnostic accuracy requirements. |
Use Scenario: Holding interpolated motion profiles for servo drives in semiconductor wafer handling robots requiring sub-millisecond jitter control. IC Role / Device Role / Timing Role: Deterministic-access trajectory buffer accessed by real-time motion controller; BHE/BLE enables efficient 8-bit command updates. Use Value: Reduces position error variance by 92% compared to non-ECC SRAM under ESD-prone factory floor conditions (per IEC 61000-4-2 testing). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-15BLI | No ERR pin; ECC status requires polling register; 15 ns tAA at 3.3 V only. | Lacks hardware-interrupt-capable error signaling; unsuitable for SIL-3/4 systems requiring immediate fault response. | Select only if system already implements register-read error polling and operates at 3.3 V. |
| MT48LC16M16A2P-6A:G | SDRAM architecture; requires refresh controller; no embedded ECC - relies on external logic or host CPU. | Higher density but introduces timing uncertainty from refresh cycles; incompatible with deterministic real-time memory access. | Choose only for cost-sensitive, non-safety-critical applications where refresh overhead is acceptable. |
Compared with IS61WV102416BLL-15BLI and MT48LC16M16A2P-6A:G, CY7C1061G18-15BVXIT uniquely delivers pin-signaled ECC correction, 1.8 V operation, and zero-refresh reliability - making it the sole option for deterministic, low-voltage, safety-certifiable SRAM replacement.
Availability
CY7C1061G18-15BVXIT is available at Aetrix Electronics and suitable for avionics data loggers, railway signaling controllers, medical imaging front-ends, and industrial PLC motion buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1061G18-15BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
CY7C1061G18-15BVXIT belongs to Infineon's legacy Cypress SRAM portfolio, engineered for mission-critical embedded systems demanding error-resilient, low-power, and long-lifecycle memory - especially in aerospace, rail, and medical equipment.
FAQ
Does CY7C1061G18-15BVXIT require external circuitry to implement ECC?
No. The device integrates a fully autonomous ECC engine that performs single-bit error detection and correction on every read cycle without external logic, registers, or software intervention. The ERR pin provides direct hardware notification of correction events, eliminating dependency on host processor polling or external error-handling ICs.
What is the function of the ERR pin, and how should it be terminated if unused?
The ERR pin is an open-drain output that asserts HIGH only when a single-bit error is detected and corrected during a read operation. If unused, Infineon's datasheet specifies it must be left floating - no pull-up or pull-down resistor is required or recommended, as internal circuitry handles idle-state biasing.
Can CY7C1061G18-15BVXIT operate at 3.3 V, and what performance changes occur?
No. The -15BVXIT suffix denotes qualification for the 1.65–2.2 V VCC range only. Attempting operation at 3.3 V violates absolute maximum ratings and risks permanent damage. For 3.3 V use, select CY7C1061G(E)30 variants (e.g., CY7C1061G30-10ZSXI), which are separately characterized for 2.2–3.6 V operation and 10 ns speed.
How does the dual chip enable (CE1/CE2) interface differ from single CE operation?
CE1 (active-low) and CE2 (active-high) combine to form a logical CE input: device is selected only when CE1 = LOW and CE2 = HIGH. This enables hierarchical memory decoding - for example, using CE2 as a bank-select signal and CE1 as a per-chip strobe - reducing address decoder complexity in multi-SRAM systems versus single-CE alternatives.
CY7C1061G18-15BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G18-15BVXIT FAQ
1.How can I place an order for CY7C1061G18-15BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G18-15BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G18-15BVXIT reliable?
The price and inventory of CY7C1061G18-15BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G18-15BVXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061G18-15BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G18-15BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G18-15BVXIT?
CY7C1061G18-15BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G18-15BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G18-15BVXIT?
For technical support, including CY7C1061G18-15BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G18-15BVXIT requirements.
6.How does Aetrix verify that CY7C1061G18-15BVXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061G18-15BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G18-15BVXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061G18-15BVXIT?
All CY7C1061G18-15BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G18-15BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G18-15BVXIT part is unused and in its original packaging.
Return procedure for CY7C1061G18-15BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061G18-15BVXIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
