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Infineon Technologies CY7C1061G18-15ZSXI
- Part No.:
- CY7C1061G18-15ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061G18-15ZSXI.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,664
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Product details
Overview
CY7C1061G18-15ZSXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), designed for high-reliability data storage in industrial control and telecom infrastructure. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), delivers 15 ns access time (tAA), supports dual chip enable (CE1/CE2), and features an ERR output pin for real-time ECC event indication.
For engineers reviewing the CY7C1061G18-15ZSXI datasheet, CY7C1061G18-15ZSXI pinout, CY7C1061G18-15ZSXI application, or CY7C1061G18-15ZSXI equivalent, this device is selected for systems requiring deterministic read/write timing, byte-level write control via BHE/BLE, low standby current (ISB2 = 20 mA typical), and hardware-level ECC without external logic - especially where data integrity must be maintained under extended temperature (-40°C to +85°C) and multi-voltage supply conditions.
Technical Context
This SRAM implements a synchronous, TTL-compatible interface with independent byte-write enable (BHE/BLE) and dual CE architecture, enabling selective memory banking in multi-processor or FPGA-based systems. Its ECC engine operates transparently during read cycles, correcting single-bit errors and asserting ERR high without interrupting data flow or requiring software intervention.
The device integrates address latching, output enable (OE) controlled tri-state I/Os, and automatic power-down modes triggered by CE deassertion. It supports 1.0 V data retention and maintains full functionality across its specified VCC ranges - critical for mixed-voltage board designs where core logic runs at 1.8 V while I/O interfaces operate at 3.3 V or 5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits) - provides 2 MB of byte-addressable storage with ECC coverage per 16-bit word |
| Access Time (tAA) | 15 ns at 1.65–2.2 V - guarantees deterministic read latency for real-time control loops and packet buffering |
| ECC Function | Embedded single-bit error correction with ERR output assertion - eliminates need for external ECC logic or software overhead |
| Supply Voltage Ranges | 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V - enables direct interfacing with 1.8 V, 3.3 V, and 5 V logic domains |
| Standby Current (ISB2) | 20 mA typical - ensures low-power retention in battery-backed or energy-constrained industrial nodes |
| Operating Temperature | –40°C to +85°C (Industrial grade) - validated for deployment in uncontrolled ambient environments |
| Data Retention | 1.0 V minimum - allows memory state preservation during brown-out or controlled power-down sequences |
Pinout & Package
Package: 54-pin TSOP II (22.4 × 11.84 × 1.0 mm), RoHS-compliant, industrial-grade plastic body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A19 placement varies by variant (Ball G2 or H6 in VFBGA; fixed in TSOP II) |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; supports byte writes via BHE (I/O8–I/O15) and BLE (I/O0–I/O7) |
| CE1, CE2 | Dual Chip Enable Inputs | Logical AND activation: CE = LOW only when CE1 = LOW and CE2 = HIGH - enables bank selection in multi-SRAM systems |
| WE | Write Enable | Active-low signal controlling write cycle initiation; synchronized with address and data setup/hold timing |
| OE | Output Enable | Active-low control of I/O bus drivers; places I/Os in high-Z when deasserted to prevent bus contention |
| ERR | Error Indication Output | Open-drain output asserted HIGH during single-bit error detection/correction - requires external pull-up for system-level fault signaling |
| VCC, VSS | Power Supply Pins | Multiple VCC/VSS pairs distributed across package for low-impedance decoupling and reduced simultaneous switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-accelerated single-bit error correction per 16-bit word with no CPU overhead or latency penalty |
| Dual Chip Enable Architecture | Enables seamless integration into multi-bank memory subsystems without external address decoding logic |
| Multi-Voltage Operation | Single part supports 1.8 V, 3.3 V, and 5 V I/O domains - reduces BOM count in mixed-supply systems |
| Byte Write Control | Independent BHE/BLE signals allow precise 8-bit updates without read-modify-write cycles |
| Low-Power Standby Mode | ISB2 = 20 mA typical at full VCC range - extends uptime in always-on industrial gateways and edge nodes |
Applications
| Industrial PLC Memory Buffer | Telecom Line Card Packet Buffer |
|---|---|
Use Scenario: Storing real-time I/O status and motion control trajectory data in programmable logic controllers with extended field lifetime requirements. IC Role / Device Role / Timing Role: Primary working memory with ECC-protected data path between ARM Cortex-M7 MCU and fieldbus interface ASIC. Use Value: Prevents silent data corruption in long-duration cyclic operations; 15 ns tAA meets hard real-time scan cycle deadlines under worst-case temperature. |
Use Scenario: Holding incoming/outgoing Ethernet frames in carrier-grade line cards before forwarding or deep-packet inspection. IC Role / Device Role / Timing Role: High-speed packet buffer interfaced to Xilinx Zynq MPSoC PS-PL AXI interface with burst-mode read/write support. Use Value: Dual CE enables interleaved access across two CY7C1061G18-15ZSXI devices, doubling effective bandwidth while ECC safeguards frame integrity against cosmic-ray-induced bit flips. |
| Medical Imaging Subsystem Frame Store | Avionics Data Recorder Cache |
Use Scenario: Temporary storage of digitized ultrasound scan lines prior to GPU-based beamforming and image reconstruction. IC Role / Device Role / Timing Role: Low-latency, ECC-protected frame buffer accessed concurrently by ADC controller and DMA engine. Use Value: 1.0 V data retention allows safe suspend-to-RAM during brief power interruptions; multi-voltage support simplifies integration with 1.8 V imaging sensors and 3.3 V display controllers. |
Use Scenario: Caching flight telemetry and sensor logs in DO-254-certified avionics recorders operating in wide-temperature aircraft bays. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM providing deterministic access for ARINC 429/664 data capture under EMI-heavy environments. Use Value: SER FIT rate <0.1 FIT/Mb ensures statistically negligible uncorrectable errors over 20-year service life; ERR pin feeds directly to health monitoring FPGA logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-15NLI | No integrated ECC; requires external error handling or software mitigation; 15 ns tAA, same 1M×16 density and 3.3 V operation | Suitable for cost-sensitive applications where ECC is managed at firmware level or not required | Select when system-level ECC is already implemented and lower BOM cost is prioritized over hardware-level reliability assurance |
| Micron MT48LC16M16A2P-75G:G | Synchronous SDRAM (not SRAM); 75 MHz clocked interface; no ECC; higher density but introduces refresh overhead and variable latency | Used in bandwidth-intensive video buffers where burst transfers outweigh deterministic timing needs | Choose only if design already uses SDRAM controller IP and can tolerate non-deterministic access timing and periodic refresh cycles |
Compared with IS61WV102416BLL-15NLI and MT48LC16M16A2P-75G:G, CY7C1061G18-15ZSXI uniquely delivers hardware ECC, zero-refresh operation, and guaranteed 15 ns access across all voltage ranges - making it the sole choice for safety-critical, latency-constrained, and mixed-voltage industrial memory subsystems.
Availability
CY7C1061G18-15ZSXI is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging subsystems, and avionics data recorders requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY7C1061G18-15ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
CY7C1061G18-15ZSXI belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for high-integrity, low-latency memory applications in harsh environments where data corruption cannot be tolerated - including factory automation, base station infrastructure, and mission-critical edge systems.
FAQ
Does CY7C1061G18-15ZSXI support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically write the corrected data back to memory. System firmware or external logic must initiate a write cycle if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet and confirmed across all CY7C1061G/E variants.
What is the function of the NC pins on the 54-pin TSOP II package?
NC (No Connect) pins - such as Pin 10 and Pin 31 in the ZSXI package - are physically present but not bonded to the silicon die. They serve mechanical or thermal roles in the package structure and must remain unconnected in PCB layout. Datasheet Figure 9 confirms these pins are internally unconnected and advises against routing traces or applying voltage.
Can CY7C1061G18-15ZSXI operate reliably at 1.65 V with 15 ns access time?
Yes. The 15 ns tAA specification is explicitly guaranteed across the full 1.65–2.2 V range per the "Product Portfolio" table on page 2 of datasheet 001-81540 Rev. *T. Electrical characteristics tables (page 7) confirm VOH, VOL, and timing parameters are validated at VCC = 1.65 V minimum, with typical measurements at 1.8 V and full parametric testing across the range.
How is the ERR pin used in system-level fault handling?
The ERR pin is an open-drain output that drives HIGH during single-bit error detection and correction. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) and connects directly to an interrupt input or status register in the host controller. Datasheet section "ERR Output – CY7C1061GE" (page 16) specifies it remains asserted for the duration of the read cycle and resets automatically on the next valid access - enabling immediate logging or diagnostic response without software polling.
CY7C1061G18-15ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061G18-15ZSXI FAQ
1.How can I place an order for CY7C1061G18-15ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G18-15ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G18-15ZSXI reliable?
The price and inventory of CY7C1061G18-15ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G18-15ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1061G18-15ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G18-15ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G18-15ZSXI?
CY7C1061G18-15ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G18-15ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G18-15ZSXI?
For technical support, including CY7C1061G18-15ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G18-15ZSXI requirements.
6.How does Aetrix verify that CY7C1061G18-15ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G18-15ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G18-15ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1061G18-15ZSXI?
All CY7C1061G18-15ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G18-15ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G18-15ZSXI part is unused and in its original packaging.
Return procedure for CY7C1061G18-15ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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