Infineon Technologies CY7C1061G30-10BVJXIT
- Part No.:
- CY7C1061G30-10BVJXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061G30-10BVJXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061G30-10BVJXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), rated for 10 ns access time at 2.2–3.6 V supply, supporting industrial temperature range (–40 °C to +85 °C), and packaged in 48-ball VFBGA (6 × 8 × 1.0 mm). It features dual chip enable (CE1/CE2), ERR output pin for real-time ECC event indication, and TTL-compatible I/Os - deployed in mission-critical memory subsystems requiring data integrity assurance.
For engineers reviewing the CY7C1061G30-10BVJXIT datasheet, CY7C1061G30-10BVJXIT pinout, CY7C1061G30-10BVJXIT application, or CY7C1061G30-10BVJXIT equivalent, key selection considerations include its 10 ns tAA timing at 3.0 V, dual CE architecture, ERR signal behavior during read cycles, and compatibility with legacy SRAM controllers in avionics, medical imaging buffers, and industrial PLC firmware storage.
Technical Context
This device implements a synchronous, byte-selectable SRAM core with on-die ECC logic that detects and corrects single-bit errors in real time during read operations - without automatic write-back. The ERR pin asserts high only when correction occurs, enabling external fault logging without interrupt overhead.
It supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); this specific variant operates in the 2.2–3.6 V band with guaranteed 10 ns access. Dual CE inputs (CE1/CE2) provide hierarchical chip select control, while BHE/BLE enable independent upper/lower byte writes to the 16-bit data bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits) - provides full 2 MB of byte-addressable storage space for firmware or buffer applications. |
| Access Time (tAA) | 10 ns max at VCC = 3.0 V - enables direct interface with 100 MHz microcontrollers without wait states. |
| ECC Function | Single-bit error detection and correction per 16-bit word - ensures data integrity in radiation-prone or long-duration operation environments. |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with modern low-voltage SoC I/O domains and eliminates level-shifting in 3.3 V systems. |
| Operating Current (ICC) | 90 mA typical at 100 MHz - defines power budget for high-throughput memory access in real-time control loops. |
| Standby Current (ISB2) | 20 mA typical - enables low-power retention mode during system sleep without data loss. |
| Data Retention Voltage | 1.0 V minimum - guarantees non-volatile data hold during brown-out conditions down to ultra-low VCC. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, RoHS-compliant, Pb-free. Pinout corresponds to dual chip enable (CE1/CE2) configuration with ERR output and A19 address MSB located at ball G2 (Package/Grade ID: BVJXI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1 / CE2 | Dual chip enable inputs | CE1 LOW + CE2 HIGH enables memory access; allows hierarchical board-level memory mapping and partial bank disable. |
| WE | Write enable input | Active LOW initiates write cycle; combined with BHE/BLE, selects byte lanes for partial-word updates. |
| OE | Output enable input | Controls tri-state of I/O[0:15]; must be LOW during valid read cycles to drive data onto bus. |
| BHE / BLE | Byte high/low enable inputs | BHE controls I/O[8:15], BLE controls I/O[0:7] - enables 8-bit peripheral interfacing without data masking logic. |
| ERR | Error indication output | Open-drain HIGH pulse indicates successful single-bit correction occurred during last read - used for diagnostic logging or watchdog reset triggering. |
| A[0:19] | Address inputs | 20-bit address bus accesses full 1M-word space; A19 at ball G2 confirms pinout alignment with CY7C1061GE family layout. |
| I/O[0:15] | Bidirectional data bus | 16-bit multiplexed data path; TTL-compatible thresholds simplify interface with legacy microcontrollers and FPGAs. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Corrects single-bit errors on-the-fly during reads - eliminates need for external error-handling firmware or redundant memory banks. |
| ERR output pin | Hardware-asserted signal notifies host processor of corrected errors without polling or interrupt latency - critical for safety-certified systems. |
| Dual chip enable architecture | Enables multi-bank memory expansion with independent enable control - reduces address decoding complexity in large memory maps. |
| Three VCC operating ranges | Supports migration across 1.8 V, 3.3 V, and 5 V system designs using same footprint - simplifies platform reuse and voltage scaling. |
| 1.0 V data retention | Maintains stored content during deep-sleep or brown-out events - extends battery life in portable medical or remote sensor devices. |
Applications
| Avionics Flight Control Memory | Medical Imaging Frame Buffer |
|---|---|
|
Use Scenario: Stores real-time flight control coefficients and sensor fusion outputs in DO-254-compliant airborne systems. IC Role / Device Role / Timing Role: High-reliability SRAM with ECC acts as deterministic, low-latency working memory for FPGA-based flight computers. Use Value: 10 ns tAA ensures sub-microsecond coefficient lookup; ERR signaling satisfies traceable fault reporting requirements per ARP4761. |
Use Scenario: Buffers uncompressed DICOM image frames (e.g., CT/MRI) between acquisition ASIC and compression engine. IC Role / Device Role / Timing Role: 16-bit-wide, ECC-protected memory serves as zero-wait-state frame store with burst-read capability. Use Value: 16 Mbit density accommodates 1024×1024×16-bit frames; 20 mA ISB2 minimizes thermal load during idle acquisition phases. |
| Industrial PLC Firmware Storage | Railway Signaling Logic State Memory |
|
Use Scenario: Holds runtime ladder logic state tables and I/O mapping in EN 61131-3 programmable controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM preserves program state during brief AC line dips or maintenance power cycling. Use Value: 1.0 V data retention sustains state through 100 ms brown-outs; ECC prevents silent corruption of safety-critical logic variables. |
Use Scenario: Stores interlocking logic states and route validation flags in SIL-4 railway signaling cabinets compliant with EN 50126/128/129. IC Role / Device Role / Timing Role: ECC-enabled SRAM functions as certified safe memory for fail-safe decision engines with hardware error detection. Use Value: ERR output feeds directly into watchdog supervisor IC; SER FIT rate <0.1 FIT/Mb meets ASIL D-equivalent reliability targets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No integrated ECC; requires external error-checking logic or software parity handling. | Suitable for cost-sensitive industrial HMI where ECC is not mandated by safety standard. | Select when system-level ECC can be implemented externally and 10 ns timing remains critical. |
| MT48LC16M16A2P-6A:G | Synchronous DRAM (SDRAM) with no built-in ECC; relies on controller-level ECC or external logic. | Requires clocked interface and refresh management - incompatible with simple SRAM bus protocols. | Choose only if migrating to higher-density, lower-cost memory and redesigning controller interface. |
Compared with IS61WV102416BLL-10MLI and MT48LC16M16A2P-6A:G, CY7C1061G30-10BVJXIT delivers hardware-accelerated, transparent ECC correction with zero software overhead and native SRAM timing - essential for deterministic real-time systems where latency predictability and fault traceability are non-negotiable.
Availability
CY7C1061G30-10BVJXIT is available at Aetrix Electronics and suitable for avionics flight control memory, medical imaging frame buffers, and industrial PLC firmware storage requiring stable component supply, long-term lifecycle support, and documented ECC reliability metrics.
Supply support for CY7C1061G30-10BVJXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions - formed through the acquisition of Cypress Semiconductor in 2020.
This device belongs to the CY7C1061G/E family of ECC-enhanced SRAMs designed specifically for safety-critical embedded systems where data integrity, deterministic timing, and extended temperature operation are mandatory.
FAQ
Does CY7C1061G30-10BVJXIT support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory array. External logic or firmware must initiate a write cycle if persistent correction is required - a design choice to avoid unintended write interference in safety-critical contexts.
What is the function of the ERR pin, and how should it be interfaced?
The ERR pin is an open-drain output that goes HIGH for one clock cycle whenever a single-bit error is detected and corrected during a read operation. It should be pulled up to VCC via a 4.7 kΩ resistor and connected to an interrupt input or status register bit. If unused, it must be left floating per datasheet guidance - not tied HIGH or LOW.
Can CY7C1061G30-10BVJXIT operate at 1.8 V?
No. This variant (suffix "30") is specified for the 2.2 V to 3.6 V supply range only. For 1.65–2.2 V operation, the CY7C1061G18 variant must be selected. Attempting 1.8 V operation on the "30" part violates the guaranteed 10 ns timing spec and may result in data corruption or functional failure.
How does the dual CE architecture improve system design?
CE1 and CE2 allow hierarchical memory enable control: CE1 LOW + CE2 HIGH activates the device, while CE1 HIGH or CE2 LOW disables it. This enables clean partitioning of memory space across multiple devices using minimal address decode logic - reducing gate count in FPGA-based systems and eliminating contention risks in multi-master buses.
CY7C1061G30-10BVJXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061G30-10BVJXIT FAQ
1.How can I place an order for CY7C1061G30-10BVJXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G30-10BVJXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G30-10BVJXIT reliable?
The price and inventory of CY7C1061G30-10BVJXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G30-10BVJXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061G30-10BVJXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G30-10BVJXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G30-10BVJXIT?
CY7C1061G30-10BVJXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G30-10BVJXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G30-10BVJXIT?
For technical support, including CY7C1061G30-10BVJXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G30-10BVJXIT requirements.
6.How does Aetrix verify that CY7C1061G30-10BVJXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061G30-10BVJXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G30-10BVJXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061G30-10BVJXIT?
All CY7C1061G30-10BVJXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G30-10BVJXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G30-10BVJXIT part is unused and in its original packaging.
Return procedure for CY7C1061G30-10BVJXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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