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Infineon Technologies CY7C1061G30-10ZSXI
- Part No.:
- CY7C1061G30-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061G30-10ZSXI.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,129
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Product details
Overview
CY7C1061G30-10ZSXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), designed for high-reliability industrial memory subsystems operating at 10 ns access time across 2.2–3.6 V supply. It features TTL-compatible I/O, ERR output signaling correction events, and dual chip enable (CE1/CE2) control logic.
For engineers reviewing the CY7C1061G30-10ZSXI datasheet, CY7C1061G30-10ZSXI pinout, CY7C1061G30-10ZSXI application, or CY7C1061G30-10ZSXI equivalent, this device is selected for systems requiring deterministic ECC protection, low standby current (20 mA typical), and compatibility with legacy SRAM interfaces in avionics data recorders, industrial PLCs, and medical imaging buffers.
Technical Context
This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles without external circuitry. The ERR pin asserts high only when correction occurs, enabling system-level fault logging without interrupt overhead.
It supports byte-wide writes via independent BHE (I/O8–I/O15) and BLE (I/O0–I/O7) controls, and operates across three voltage ranges - here configured for 2.2–3.6 V - with guaranteed 10 ns tAA and 1.0 V data retention capability under power loss conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 16 Mbit (1,048,576 words × 16 bits); enables 2 MB of byte-addressable, non-refreshed storage |
| Access time (tAA) | 10 ns at 2.2–3.6 V; ensures timing compliance with 100 MHz bus clocks in synchronous controllers |
| ECC function | On-die single-bit error detection and correction per 16-bit word; no external logic required |
| Standby current (ISB2) | 20 mA typical at VCC = 3 V, TA = 25 °C; supports low-power hold modes in battery-backed systems |
| Supply voltage range | 2.2 V to 3.6 V; compatible with 3.3 V LVTTL and mixed-voltage FPGA I/O banks |
| Data retention voltage | 1.0 V minimum; maintains stored contents during brown-out or controlled power-down sequences |
| Package | 54-pin TSOP II (ZSXI); surface-mount footprint optimized for high-density PCB layouts with thermal relief |
Pinout & Package
54-pin TSOP II package (22.4 mm × 11.84 mm × 1.0 mm), lead-free, RoHS-compliant, industrial temperature grade (–40 °C to +85 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address inputs | 20-bit address bus supporting full 1M-word decoding; A19 is MSB and maps to pin 31 in ZSXI |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; supports byte-select writes via BHE/ BLE without bus turnaround delay |
| CE1 / CE2 | Dual chip enable inputs | Active-low CE1 and active-high CE2 form logical CE; enables hierarchical memory banking in multi-SRAM systems |
| WE | Write enable | Active-low control synchronizing write data capture on rising edge of clock-equivalent timing |
| OE | Output enable | Active-low gating of I/O pins to high-impedance state; allows shared bus arbitration without external transceivers |
| BHE / BLE | Byte high/low enable | Independent control of upper/lower byte lanes; eliminates need for external byte demux logic |
| ERR | Error indication output | Open-drain active-high signal pulsed during ECC correction; directly interfaces to FPGA GPIO or interrupt controller |
| VCC / VSS | Power / ground | Dual VCC pins (pins 24, 39) and dual VSS pins (pins 25, 40) reduce simultaneous switching noise and improve PSRR |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Corrects single-bit errors in real time during read cycles; eliminates requirement for external Hamming logic or software scrubbing |
| Multi-voltage operation | Supports 2.2–3.6 V range with guaranteed 10 ns timing; simplifies integration into mixed-supply systems without level shifters |
| ERR output pin | Hardware-asserted signal indicates correction event; enables deterministic fault reporting without polling or latency-sensitive interrupts |
| Low ISB2 standby current | 20 mA typical at 3 V; reduces quiescent power in always-on subsystems such as flight data recorders or diagnostic monitors |
| TSOP II mechanical compatibility | 54-pin footprint matches industry-standard layout; allows drop-in replacement of legacy 16-bit SRAMs like AS6C1008 or IS61LV1024 |
Applications
| Avionics Data Recorder | Industrial PLC Memory Buffer |
|---|---|
|
Use Scenario: Continuous capture of flight sensor telemetry with guaranteed data integrity over extended mission durations. IC Role / Device Role / Timing Role: Primary volatile buffer storing timestamped 16-bit analog samples prior to EEPROM archiving. Use Value: On-die ECC prevents undetected bit flips from cosmic radiation, eliminating need for periodic memory scrubbing routines. |
Use Scenario: Real-time I/O mapping and program execution stack storage in modular automation controllers. IC Role / Device Role / Timing Role: Fast-access working memory interfaced directly to ARM Cortex-M7 bus with zero-wait-state timing. Use Value: 10 ns tAA and byte-enable support enable deterministic scan-cycle performance under worst-case interrupt load. |
| Medical Imaging Frame Buffer | Test Equipment Pattern Memory |
|
Use Scenario: Storing raw pixel data from ultrasound or MRI front-end ADCs before DSP processing. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration for continuous acquisition and parallel processing. Use Value: 1.0 V data retention preserves frame content during brief power interruptions common in mobile diagnostic carts. |
Use Scenario: Holding stimulus/response vectors in automated boundary-scan and functional test systems. IC Role / Device Role / Timing Role: High-speed pattern store synchronized to 100 MHz ATE clock with precise setup/hold margins. Use Value: TTL-compatible I/O and dual CE inputs simplify integration with legacy test head logic and timing controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM-with-ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-10TIN | No embedded ECC; requires external Hamming generator/checker IC or firmware overhead. | Lacks hardware error correction; suitable only where FIT rate < 0.1 FIT/Mb is not mandated. | Select if cost sensitivity outweighs reliability requirements and board space permits external ECC logic. |
| IS61LV1024-10TQLI | 10 ns access but no ERR pin or on-die ECC; lower standby current (15 mA) but no error signaling capability. | Used in non-safety-critical instrumentation where bit errors are tolerated or handled at application layer. | Choose when ECC is unnecessary and lowest possible ISB2 is prioritized over fault observability. |
Compared with AS6C1008-10TIN and IS61LV1024-10TQLI, CY7C1061G30-10ZSXI uniquely delivers integrated ECC correction with hardware ERR assertion - enabling certified safety functions without increasing BOM count or software complexity.
Availability
CY7C1061G30-10ZSXI is available at Aetrix Electronics and suitable for avionics data recorders, industrial PLC memory buffers, and medical imaging frame buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1061G30-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, emphasizing automotive, industrial, and aerospace-grade components with long-term availability commitments.
CY7C1061G30-10ZSXI belongs to the Cypress SRAM family engineered for mission-critical systems demanding deterministic ECC, multi-voltage flexibility, and industrial temperature resilience - not general-purpose memory.
FAQ
Does CY7C1061G30-10ZSXI support automatic error write-back after correction?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite corrected data back to the memory array. System firmware must handle any required write-back if persistent correction logging is needed. This behavior is explicitly documented in Note 1 of the datasheet.
What is the meaning of "ZSXI" in the part number CY7C1061G30-10ZSXI?
ZSXI denotes the 54-pin TSOP II package (Z), industrial temperature grade (S), lead-free/RoHS-compliant finish (X), and tape-and-reel packaging (I). It confirms mechanical compatibility with standard TSOP II sockets and compliance with IPC/JEDEC standards for surface-mount assembly.
Can the ERR pin be left unconnected if ECC reporting is not used?
Yes. The ERR pin is an open-drain output and may be left floating if unused. The datasheet states: "If not used, this pin should be left floating." No pull-up or termination is required, and leaving it unconnected has no effect on ECC functionality or memory operation.
How does the dual CE architecture (CE1/CE2) affect timing parameters?
CE1 and CE2 combine logically to form a single chip enable: CE is active only when CE1 = LOW and CE2 = HIGH. All timing parameters (tAA, tCO, tOE) are specified relative to this combined CE signal, not individual pins. The dual-input structure enables hierarchical memory decoding without additional logic gates.
CY7C1061G30-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061G30-10ZSXI FAQ
1.How can I place an order for CY7C1061G30-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G30-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G30-10ZSXI reliable?
The price and inventory of CY7C1061G30-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G30-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1061G30-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G30-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G30-10ZSXI?
CY7C1061G30-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G30-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G30-10ZSXI?
For technical support, including CY7C1061G30-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G30-10ZSXI requirements.
6.How does Aetrix verify that CY7C1061G30-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061G30-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G30-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1061G30-10ZSXI?
All CY7C1061G30-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G30-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G30-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1061G30-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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