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Infineon Technologies CY7C1061G30-10ZXIT
- Part No.:
- CY7C1061G30-10ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY7C1061G30-10ZXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,010
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Product details
Overview
CY7C1061G30-10ZXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and operation across 2.2 V–3.6 V supply. It features an ERR output pin for real-time single-bit error detection/correction indication and supports byte-wide writes via BHE/ BLE control - deployed in industrial memory subsystems requiring data integrity under extended temperature.
For engineers reviewing the CY7C1061G30-10ZXIT datasheet, CY7C1061G30-10ZXIT pinout, CY7C1061G30-10ZXIT application, or CY7C1061G30-10ZXIT equivalent, this device is selected for high-reliability SRAM applications where ECC-enabled data retention, low standby current (20 mA typical), and TSOP I package compatibility with legacy 48-pin footprint are critical design requirements.
Technical Context
This SRAM implements on-die ECC logic that detects and corrects single-bit errors during read cycles without automatic write-back, signaling correction events via the dedicated ERR output pin. Its dual-voltage support (2.2–3.6 V) enables integration into mixed-supply systems while maintaining TTL-level input thresholds and output drive strength.
The device offers configurable chip enable options (single CE or dual CE1/CE2), byte-selectable write capability through independent BHE and BLE controls, and three package variants - though CY7C1061G30-10ZXIT specifically uses the 48-pin TSOP I with single CE and ERR pin enabled, per ordering code ZXI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); provides full-word parallel access for microprocessor bus interfaces. |
| Access Time (tAA) | 10 ns at 2.2–3.6 V; ensures timing compatibility with 100 MHz system clocks in high-speed control loops. |
| ECC Function | On-chip single-bit error detection and correction per read cycle; no external logic required for basic data integrity. |
| Supply Voltage Range | 2.2 V to 3.6 V; supports modern low-voltage SoC domains while retaining TTL-compatible signal levels. |
| Standby Current (ISB2) | 20 mA typical; enables power-sensitive industrial applications with frequent sleep/wake cycles. |
| ERR Output | Dedicated open-drain output asserted HIGH during single-bit correction; allows host processor to log or flag corrected errors. |
| Data Retention | 1.0 V minimum retention voltage; permits ultra-low-power hold mode during brown-out conditions. |
Pinout & Package
Package: 48-pin TSOP I (12 mm × 18.4 mm × 1.0 mm), RoHS-compliant, surface-mount. Pin 1 index corner marked; lead finish: matte tin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A19 is MSB and used for row decoding. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; high-impedance when deselected or during write cycles with WE active. |
| CE | Chip Enable | Active LOW single-chip-enable control; places all I/Os in high-Z state when deasserted. |
| WE | Write Enable | Active LOW write strobe; initiates write cycle when CE and OE are properly asserted. |
| OE | Output Enable | Active LOW read strobe; enables output drivers only when CE is active and WE is HIGH. |
| BHE / BLE | Byte Enable Controls | BHE enables upper byte (I/O8–I/O15); BLE enables lower byte (I/O0–I/O7); supports 8-bit sub-word writes. |
| ERR | Error Indication Output | Open-drain output asserted HIGH during single-bit correction; requires external pull-up for logic-level interface. |
| VCC / VSS | Power / Ground | Two VCC pins (pins 24, 39) and two VSS pins (pins 25, 38) reduce IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Corrects single-bit errors on every read without CPU intervention or additional memory overhead. |
| TTL-compatible I/O | Accepts standard 5 V-tolerant logic thresholds at 2.2–3.6 V supply, easing migration from legacy 5 V systems. |
| Low ISB2 standby current | 20 mA typical enables >10-year battery-backed retention in industrial logging and telemetry nodes. |
| ERR pin signaling | Hardware-level error notification eliminates polling overhead and supports deterministic fault reporting in safety-critical firmware. |
| Byte-write select (BHE/ BLE) | Enables precise 8-bit updates in memory-mapped peripherals without corrupting adjacent bytes. |
Applications
| Industrial PLC Memory Buffer | Medical Diagnostic Imaging Cache |
|---|---|
|
Use Scenario: Stores real-time I/O scan data and configuration registers in programmable logic controllers operating continuously at –40 °C to +85 °C. IC Role / Device Role / Timing Role: Primary non-refreshing data buffer interfacing directly to ARM Cortex-M7 bus with 10 ns tAA meeting cycle-time budgets. Use Value: On-die ECC prevents silent data corruption in long-duration control sequences, reducing field failure rates in certified safety systems. |
Use Scenario: Caches DICOM image tiles during ultrasound frame reconstruction where bit-flips could misrepresent tissue boundaries. IC Role / Device Role / Timing Role: High-bandwidth pixel data staging memory synchronized to FPGA-based image pipeline with burst read capability. Use Value: ERR pin enables immediate reacquisition of corrupted tile segments, preserving diagnostic accuracy without full-frame retransmission. |
| Railway Signaling Event Logger | Avionics Flight Data Recorder Buffer |
|
Use Scenario: Captures timestamped sensor and switch status events in EN 5012x-certified train control units with battery backup. IC Role / Device Role / Timing Role: Retentive memory holding last 72 hours of operational logs; operates down to 1.0 V during power interruption. Use Value: 1.0 V data retention and 20 mA ISB2 allow >30-day battery hold time without refresh, satisfying IEC 62425 continuity requirements. |
Use Scenario: Buffers raw inertial measurement unit (IMU) streams prior to compression and storage in solid-state FDR modules. IC Role / Device Role / Timing Role: Low-latency write buffer accepting 16-bit parallel samples at 10 kHz with deterministic 10 ns access. Use Value: Single-bit ECC correction ensures flight-critical telemetry remains intact despite cosmic-ray-induced soft errors in high-altitude operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No integrated ECC; requires external Hamming logic; 10 ns access, 3.3 V only; 48-pin TSOP I. | Lacks hardware error signaling; increases PCB area and firmware complexity for error handling. | Select only if ECC is implemented externally and cost sensitivity outweighs reliability assurance. |
| IS61WV102416BLL-10MLI | 10 ns access, 3.3 V, no ECC; 48-pin TSOP I; 16 Mbit density; higher ICC (120 mA typical). | Higher active power and no error detection limit use in battery-backed or safety-augmented systems. | Choose when maximum speed is prioritized over data integrity and power efficiency in non-critical buffers. |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061G30-10ZXIT uniquely delivers integrated ECC with ERR signaling and 20 mA ISB2 in the same 48-pin TSOP I footprint - enabling drop-in reliability upgrades without redesigning memory controller logic or increasing board area.
Availability
CY7C1061G30-10ZXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging cache subsystems, and railway event loggers requiring stable component supply across extended temperature and long product lifecycles.
Supply support for CY7C1061G30-10ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
CY7C1061G30-10ZXIT belongs to Infineon's legacy Cypress SRAM portfolio, engineered for mission-critical industrial and transportation applications demanding ECC-enhanced data integrity and extended temperature operation.
FAQ
Does CY7C1061G30-10ZXIT support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles but does not automatically rewrite corrected data back to the memory array. The ERR pin signals correction occurrence, and host firmware must decide whether to initiate a write-back sequence based on system policy.
What is the function of the ERR pin, and how should it be terminated?
The ERR pin is an open-drain output asserted HIGH during single-bit error correction. It must be externally pulled up to VCC via a 4.7 kΩ resistor to ensure valid logic HIGH level. Leaving it floating or connecting directly to VCC may cause false assertions or contention.
Can CY7C1061G30-10ZXIT operate at 1.8 V?
No. This variant (G30 suffix) is rated for 2.2 V–3.6 V operation only. For 1.65 V–2.2 V operation, the CY7C1061G18 series is required. Attempting 1.8 V supply will result in undefined behavior, including failed reads and ECC malfunction.
Is the 48-pin TSOP I package of CY7C1061G30-10ZXIT pin-compatible with older CY7C1061DV devices?
Yes - the ZXI package maintains identical pinout and electrical characteristics with CY7C1061DV-10ZXI, including CE, WE, OE, BHE, BLE, and ERR placement. No PCB redesign is needed for drop-in replacement in existing designs using the same voltage range.
CY7C1061G30-10ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY7C1061G30-10ZXIT FAQ
1.How can I place an order for CY7C1061G30-10ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061G30-10ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061G30-10ZXIT reliable?
The price and inventory of CY7C1061G30-10ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061G30-10ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061G30-10ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061G30-10ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061G30-10ZXIT?
CY7C1061G30-10ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061G30-10ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061G30-10ZXIT?
For technical support, including CY7C1061G30-10ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061G30-10ZXIT requirements.
6.How does Aetrix verify that CY7C1061G30-10ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061G30-10ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061G30-10ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061G30-10ZXIT?
All CY7C1061G30-10ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061G30-10ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061G30-10ZXIT part is unused and in its original packaging.
Return procedure for CY7C1061G30-10ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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