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Infineon Technologies CY7C1061GE-10BVJXI

Part No.:
CY7C1061GE-10BVJXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1061GE-10BVJXI.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,558

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Product details

Overview

CY7C1061GE-10BVJXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and ERR output pin for real-time error indication. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) and supports dual chip enable (CE1/CE2) in a 48-ball VFBGA package - used in industrial control systems requiring data integrity under radiation-prone or long-term reliability conditions.

For engineers reviewing the CY7C1061GE-10BVJXI datasheet, CY7C1061GE-10BVJXI pinout, CY7C1061GE-10BVJXI application, or CY7C1061GE-10BVJXI equivalent, key selection criteria include ECC-enabled read-cycle error detection latency, dual CE timing compatibility, VFBGA thermal performance at 125 °C ambient, and byte-write control via BHE/BLE pins in memory-mapped microcontroller interfaces.

Technical Context

This SRAM implements on-die ECC logic that detects and corrects single-bit errors during every read cycle without CPU intervention, asserting the ERR pin high upon correction. The device uses standard asynchronous parallel interface timing with independent byte enables (BHE/BLE) to support 8-bit sub-accesses within the 16-bit data bus.

It supports three distinct VCC operating windows with corresponding speed grades: 10 ns at 2.2–3.6 V and 4.5–5.5 V, and 15 ns at 1.65–2.2 V. Standby current drops to 20 mA typical in ISB2 mode with CMOS-level CE deassertion, enabling low-power retention in battery-backed systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16-bit words) - provides full 2 MB addressable space for firmware/data buffers in real-time controllers.
Access Time (tAA) 10 ns max at VCC = 2.2–3.6 V or 4.5–5.5 V - enables direct interfacing with 100 MHz microcontrollers without wait states.
ECC Function Single-bit error detection and correction per read cycle - ensures data integrity without software overhead or write-back latency.
Supply Voltage Ranges 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - allows drop-in replacement across legacy 5 V, modern 3.3 V, and ultra-low-power 1.8 V systems.
Standby Current (ISB2) 20 mA typical at VCC = 3 V - supports extended operation in industrial environments with limited thermal dissipation.
Package 48-ball VFBGA (6 × 8 × 1.0 mm, 0.8 mm pitch) - delivers superior thermal resistance vs. TSOP for high-density PCB layouts.
ERR Pin Dedicated open-drain output indicating corrected single-bit errors - enables system-level fault logging without polling or bus arbitration.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish. Thermal resistance θJA = 45 °C/W (JEDEC JESD51-2, 4-layer board).

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address inputs 20-bit address bus supporting full 1M-word decoding; A19 placed at Ball G2 per BVJXI configuration.
I/O0–I/O15 Bidirectional data bus 16-bit parallel interface; byte-access controlled independently by BHE (I/O8–I/O15) and BLE (I/O0–I/O7).
CE1 / CE2 Dual chip enable inputs Logical CE = CE1 LOW AND CE2 HIGH; enables hierarchical memory mapping and power gating in multi-SRAM systems.
WE Write enable input Active-low signal initiating write cycle; latches data on rising edge of WE when CE and OE are asserted.
OE Output enable input Active-low control for data bus tristating; required for read operations and high-impedance isolation during bus sharing.
ERR Error indication output Open-drain active-high signal pulsed during ECC correction; requires external pull-up for interrupt generation or status monitoring.
VCC / VSS Power supply / ground Dual VCC balls (Balls C1, D1) and dual VSS balls (Balls C8, D8) reduce IR drop and improve noise immunity.

Key Features

Feature Design Value
Embedded ECC logic Hardware-accelerated single-bit error correction per read cycle with no CPU cycles or memory bandwidth penalty.
Dual chip enable architecture Enables seamless integration into multi-bank memory subsystems with independent power and timing control per bank.
Three-voltage-range operation Eliminates need for level shifters when migrating between 5 V, 3.3 V, and 1.8 V host platforms.
Byte-select write capability Reduces write traffic and power consumption by allowing 8-bit updates to 16-bit words without full-word rewrite.
1.0 V data retention Preserves stored contents during brown-out or backup battery operation down to 1.0 V supply.

Applications

Industrial PLC Memory Buffer Railway Signaling Data Log

Use Scenario: Real-time I/O scanning and cyclic process data buffering in programmable logic controllers with >10-year field deployment.

IC Role / Device Role / Timing Role: Primary working memory holding ladder logic state tables and sensor history with ECC-protected read consistency.

Use Value: Prevents silent data corruption in safety-critical control loops where undetected bit flips could cause spurious actuator commands.

Use Scenario: Tamper-resistant event logging in ERTMS/ETCS Level 2 trackside units operating at –40 °C to +85 °C.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM storing train movement records with timestamped ECC-tagged entries.

Use Value: Guarantees forensic traceability of signaling events even after cumulative neutron-induced soft errors over decades of service.

Avionics Flight Management Unit Medical Imaging Frame Buffer

Use Scenario: Storing flight plan waypoints and navigation database segments in DO-254-certified airborne computing modules.

IC Role / Device Role / Timing Role: High-reliability scratchpad memory accessed by ARINC 653 partitioned scheduler with deterministic 10 ns latency.

Use Value: Meets RTCA DO-178C/DO-254 single-event upset (SEU) mitigation requirements without external EDAC hardware.

Use Scenario: Temporary storage of DICOM image tiles during CT/MRI reconstruction pipelines in Class IIa medical devices.

IC Role / Device Role / Timing Role: Burst-mode frame buffer interfaced to FPGA-based image processors with byte-aligned pixel packing.

Use Value: Enables lossless 16-bit grayscale pixel storage with automatic on-read correction, eliminating post-processing artifact rework.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102416BLL-10MLI No dedicated ERR pin; ECC status requires register read; 10 ns access at 3.3 V only. Lacks hardware interrupt signaling for error events - requires polling or firmware polling overhead. Select when system-level error reporting is handled in software and board space permits larger SOIC-44 package.
MT45W8MW16BGX-107:K DDR2 SDRAM with on-die ECC; synchronous interface; 107 MHz clocked operation. Requires clock tree, DLL, and command scheduling - incompatible with simple parallel bus microcontrollers. Select only for new designs targeting higher bandwidth (>800 MB/s) and willing to absorb DDR2 controller complexity.

Compared with IS61WV102416BLL-10MLI and MT45W8MW16BGX-107:K, CY7C1061GE-10BVJXI uniquely delivers asynchronous 10 ns ECC SRAM with hardware ERR signaling in compact VFBGA - critical for retrofitting legacy industrial controllers and safety-certified avionics where timing determinism and interrupt-driven error response are mandatory.

Availability

CY7C1061GE-10BVJXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, railway signaling data logs, avionics flight management units, and medical imaging frame buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1061GE-10BVJXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.

CY7C1061GE belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for mission-critical embedded systems demanding hardware ECC, wide-voltage operation, and industrial temperature resilience.

FAQ

Does CY7C1061GE-10BVJXI support automatic error correction write-back?

No. The device performs single-bit error correction transparently during read cycles but does not automatically write the corrected data back to the memory array. Correction is internal and ephemeral - the original uncorrected word remains stored unless explicitly rewritten by the host system. This behavior is documented in Note 1 of the datasheet and avoids unintended write wear or timing penalties.

What is the function of the ERR pin during normal (error-free) operation?

The ERR pin remains in high-impedance (floating) state when no single-bit error is detected or corrected. It is an open-drain output that requires an external pull-up resistor to VCC; during error-free reads, it does not drive any voltage level and must not be left unconnected in noise-sensitive environments. Its assertion is strictly synchronous with the read data valid window.

Can CY7C1061GE-10BVJXI operate at 2.5 V supply?

Yes. The device supports the 2.2 V–3.6 V VCC range, and 2.5 V falls within specification. At 2.5 V, it maintains 10 ns access time and meets all DC/AC electrical characteristics per the datasheet's "CY7C1061G(E)30" speed grade, including ICC = 90 mA typical at 100 MHz and ISB2 = 20 mA typical in standby.

How does the dual CE architecture affect power sequencing?

Power sequencing must ensure CE1 and CE2 reach valid logic levels before VCC stabilizes to prevent undefined chip enable states. The device enters low-power ISB2 mode only when CE1 is HIGH *or* CE2 is LOW - not both - so improper sequencing may cause unintended wake-up or bus contention. Recommended practice is to tie CE2 to VCC and control CE1 alone for simplified interface.

CY7C1061GE-10BVJXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1061GE-10BVJXI FAQ

1.How can I place an order for CY7C1061GE-10BVJXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1061GE-10BVJXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1061GE-10BVJXI reliable?

The price and inventory of CY7C1061GE-10BVJXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE-10BVJXI is usually 5 days.

3.What payment methods are accepted for CY7C1061GE-10BVJXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE-10BVJXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1061GE-10BVJXI?

CY7C1061GE-10BVJXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1061GE-10BVJXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1061GE-10BVJXI?

For technical support, including CY7C1061GE-10BVJXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE-10BVJXI requirements.

6.How does Aetrix verify that CY7C1061GE-10BVJXI is sourced from the original manufacturer or authorized distributors?

All CY7C1061GE-10BVJXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE-10BVJXI meets industry standards.

7.What is the process for return or replacement of CY7C1061GE-10BVJXI?

All CY7C1061GE-10BVJXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE-10BVJXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1061GE-10BVJXI part is unused and in its original packaging.

Return procedure for CY7C1061GE-10BVJXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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