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Infineon Technologies CY7C1061GE-10BVJXIT

Part No.:
CY7C1061GE-10BVJXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1061GE-10BVJXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,310

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Product details

Overview

CY7C1061GE-10BVJXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), 10 ns access time, 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V triple-voltage operation, and ERR output pin for real-time error indication. It serves as fault-tolerant data buffer in industrial controllers requiring ECC-enabled memory retention.

For engineers reviewing the CY7C1061GE-10BVJXIT datasheet, CY7C1061GE-10BVJXIT pinout, CY7C1061GE-10BVJXIT application, or CY7C1061GE-10BVJXIT equivalent, key selection criteria include ECC correction capability, multi-voltage compatibility, ERR signal timing behavior, and 48-ball VFBGA (BVJXI) package footprint alignment with high-density PCB layouts.

Technical Context

This SRAM implements on-die Hamming-code ECC logic that detects and corrects single-bit errors during read cycles without external circuitry. The ERR pin asserts high only when a correctable error is found and corrected - no automatic write-back occurs.

It supports dual chip enable (CE1/CE2) and byte-level control via BHE/BLE, enabling selective upper/lower byte writes and reads. Address range spans A0–A19 (1 M words), with A19 placed at ball G2 in the BVJXI package configuration.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16-bit words) - provides full-word parallel interface for microcontroller or FPGA data buffering.
Access Time (tAA) 10 ns at VCC = 2.2–3.6 V or 4.5–5.5 V - enables synchronization with 100 MHz bus clocks in real-time control systems.
ECC Function Embedded single-bit error detection and correction per 16-bit word - eliminates need for external ECC logic in safety-critical storage paths.
Operating Voltage Ranges 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - allows direct integration into mixed-rail systems without level-shifting.
Standby Current (ISB2) 20 mA typical at VCC = 3 V - supports low-power hold mode in battery-backed industrial modules.
Data Retention Voltage 1.0 V minimum - maintains stored content during brown-out events down to ultra-low supply levels.
ERR Output Behavior Active-HIGH open-drain signal asserted only during successful single-bit correction - enables hardware-triggered logging or diagnostics.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, Pb-free, RoHS-compliant (Package ID: BVJXI). Pinout corresponds to dual chip enable (CE1/CE2) configuration with ERR output and A19 at ball G2.

Pin/Terminal Circuit Role Design Meaning
CE1, CE2 Dual chip enable inputs Device selected only when CE1 = LOW and CE2 = HIGH - enables hierarchical memory decoding in multi-SRAM systems.
WE Write enable input Active-LOW control for synchronous write cycles; latches address and data on falling edge.
OE Output enable input Active-LOW control for read data output; places I/O pins in high-Z when deasserted.
BLE, BHE Byte low/high enable inputs Independent control of I/O0–I/O7 (BLE) and I/O8–I/O15 (BHE) - supports 8-bit peripheral interfacing without data masking.
ERR Error indication output Open-drain, active-HIGH signal pulsed during ECC correction - requires external pull-up; not used → leave floating.
A0–A19 Address inputs 20-bit address bus supporting 1M-word addressing; A19 located at ball G2 per BVJXI mechanical layout.
I/O0–I/O15 Bi-directional data bus 16-bit parallel interface compatible with TTL logic levels - supports direct connection to legacy microcontrollers.

Key Features

Feature Design Value
Triple-voltage operation Single device supports 1.8 V, 3.3 V, and 5 V system rails - reduces BOM count in multi-voltage industrial platforms.
On-die ECC with ERR signaling Hardware-based single-bit correction + dedicated output pin - eliminates software overhead and enables deterministic error response.
Low ISB2 standby current 20 mA typical at 3 V - extends operational uptime in energy-constrained edge nodes with periodic wake/sleep cycles.
VFBGA package (6 × 8 mm) High I/O density with 0.5 mm ball pitch - optimizes board space in compact programmable logic controllers and motor drives.
No automatic write-back on correction ERR indicates correction occurred but does not modify memory contents - preserves deterministic timing and avoids unintended write conflicts.

Applications

Industrial PLC Data Buffer Medical Imaging Frame Store

Use Scenario: Real-time I/O scanning and program execution in DIN-rail mounted PLCs with extended temperature requirements.

IC Role / Device Role / Timing Role: Primary working memory holding ladder logic variables, register states, and communication buffers with ECC protection against cosmic-ray-induced bit flips.

Use Value: Prevents silent data corruption in safety-related control loops by detecting and correcting memory errors before they propagate to output stages.

Use Scenario: Temporary frame storage in portable ultrasound or X-ray units where power interruption may occur mid-acquisition.

IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer between ADC and image processor - retains pixel data during brief brown-outs using 1.0 V data retention.

Use Value: Ensures diagnostic image integrity by maintaining uncorrupted frames even under unstable power conditions common in mobile medical equipment.

Railway Signaling Controller Avionics Data Logger

Use Scenario: Onboard train control unit executing SIL-2 certified logic with strict memory reliability requirements.

IC Role / Device Role / Timing Role: Fault-tolerant RAM for storing route tables, speed profiles, and event logs - ERR output feeds into watchdog and diagnostic subsystems.

Use Value: Meets EN 50129 requirements for memory integrity by providing hardware-level error detection/correction without software intervention.

Use Scenario: Black-box recording in UAV flight controllers capturing sensor telemetry and control commands during extended missions.

IC Role / Device Role / Timing Role: Burst-mode write buffer accepting high-rate IMU/GNSS data streams - ECC prevents corrupted log entries from invalidating post-flight analysis.

Use Value: Guarantees forensic-grade data fidelity by eliminating undetected memory errors that could mask root causes of flight anomalies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C31026B-10TIN 10 ns access, 1M × 16-bit, no built-in ECC - requires external syndrome generator and correction logic. Lacks integrated ERR signal and on-die correction; increases PCB area and firmware complexity. Select when cost sensitivity outweighs ECC integration needs and board space permits external logic.
IS61WV102416BLL-10MLI 10 ns access, 1M × 16-bit, no ECC - supports 2.5 V/3.3 V only; no 1.8 V or 5 V operation. Cannot replace CY7C1061GE-10BVJXIT in mixed-voltage systems or 1.8 V domains without level shifters. Choose only for 3.3 V-only designs where ECC is handled at system level or deemed unnecessary.

Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061GE-10BVJXIT uniquely delivers integrated ECC correction, triple-voltage support, and ERR signaling in a single VFBGA package - reducing design risk and validation effort in safety-critical embedded systems.

Availability

CY7C1061GE-10BVJXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics data loggers requiring stable component supply across extended temperature and voltage ranges.

Supply support for CY7C1061GE-10BVJXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full CY7C1061G/GE product line as part of its industrial memory portfolio.

This device belongs to Infineon's high-reliability SRAM family designed specifically for mission-critical industrial, medical, and transportation systems demanding ECC protection and wide operating voltage flexibility.

FAQ

Does CY7C1061GE-10BVJXIT perform automatic write-back after ECC correction?

No. The device detects and corrects single-bit errors during read operations but does not automatically rewrite the corrected data back to the memory array. The ERR pin signals that correction occurred, and system firmware must decide whether to initiate a write cycle to restore the corrected value if persistent storage is required.

What is the function of the ERR pin, and how should it be terminated?

The ERR pin is an open-drain output that goes HIGH during a read cycle when a single-bit error is detected and corrected. If unused, it must be left floating per datasheet guidance; if monitored, it requires an external pull-up resistor to VCC. It does not drive low actively - only pulls low through internal FET when inactive.

Can CY7C1061GE-10BVJXIT operate at 2.5 V, and what speed grade applies?

Yes - it operates across 2.2–3.6 V, so 2.5 V falls within specification. At 2.5 V, the -10 speed grade guarantees tAA ≤ 10 ns, supporting reliable 100 MHz bus timing. ICC remains within 90 mA typical, and ISB2 stays at 20 mA typical, matching performance at 3.0 V.

How does the dual chip enable (CE1/CE2) logic differ from single CE operation?

CE1 and CE2 form a logical AND: device is enabled only when CE1 = LOW and CE2 = HIGH. This allows hierarchical memory mapping - e.g., CE1 driven by higher-order address bits and CE2 by chip-select decode - unlike single CE where one pin controls all selection. Pinout and timing parameters remain identical in both configurations.

CY7C1061GE-10BVJXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1061GE-10BVJXIT FAQ

1.How can I place an order for CY7C1061GE-10BVJXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1061GE-10BVJXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1061GE-10BVJXIT reliable?

The price and inventory of CY7C1061GE-10BVJXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE-10BVJXIT is usually 5 days.

3.What payment methods are accepted for CY7C1061GE-10BVJXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE-10BVJXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1061GE-10BVJXIT?

CY7C1061GE-10BVJXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1061GE-10BVJXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1061GE-10BVJXIT?

For technical support, including CY7C1061GE-10BVJXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE-10BVJXIT requirements.

6.How does Aetrix verify that CY7C1061GE-10BVJXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1061GE-10BVJXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE-10BVJXIT meets industry standards.

7.What is the process for return or replacement of CY7C1061GE-10BVJXIT?

All CY7C1061GE-10BVJXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE-10BVJXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1061GE-10BVJXIT part is unused and in its original packaging.

Return procedure for CY7C1061GE-10BVJXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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