Infineon Technologies CY7C1061GE18-15BVJXIT
- Part No.:
- CY7C1061GE18-15BVJXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061GE18-15BVJXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,557
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Product details
Overview
CY7C1061GE18-15BVJXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 15 ns access time, and dual chip enable (CE1/CE2) logic. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), supports 1.0 V data retention, and features an ERR output pin for real-time single-bit error detection and correction - deployed in industrial control memory buffers requiring high reliability.
For engineers reviewing the CY7C1061GE18-15BVJXIT datasheet, CY7C1061GE18-15BVJXIT pinout, CY7C1061GE18-15BVJXIT application, or CY7C1061GE18-15BVJXIT equivalent, this page delivers verified package mapping (48-ball VFBGA, BVJXI), ECC functional behavior, dual CE timing constraints, byte-write control via BHE/BLE, and ERR pin assertion logic - all confirmed from Infineon's official Rev. *T datasheet (001-81540).
Technical Context
This SRAM implements full on-die ECC encoding/decoding for every 16-bit word using Hamming code, correcting single-bit errors without external logic. The ERR pin asserts high only during read cycles when a correctable error is detected - no automatic write-back occurs, and error status is not latched.
It supports two chip enable architectures: single CE (pin 24 in TSOP I) or dual CE (CE1/CE2, active-low/high combination), with CE1 and CE2 jointly defining chip select state. Byte write control is implemented via separate BHE (I/O8–I/O15) and BLE (I/O0–I/O7) inputs, enabling independent upper/lower byte writes without masking logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) - provides full 16-bit parallel interface without multiplexing or external width expansion. |
| Access Time | 15 ns (tAA) at 1.65–2.2 V - guarantees deterministic read latency for real-time industrial controllers operating at ≤66.7 MHz bus frequency. |
| ECC Function | On-die single-bit error correction with ERR output assertion - eliminates need for external ECC logic and enables system-level error logging. |
| Supply Voltage Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - supports legacy 5 V, modern low-voltage 1.8 V, and mid-range 3.3 V systems without level-shifting. |
| Standby Current | ISB2 = 20 mA typical (VCC = max, f = 0) - enables low-power hold mode in battery-backed or energy-constrained applications. |
| Data Retention | 1.0 V minimum VCC - allows memory contents to persist during brown-out conditions down to ultra-low supply voltage. |
| I/O Compatibility | TTL-compatible inputs/outputs - ensures direct interfacing with legacy microcontrollers and FPGAs without translation circuitry. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, Package ID BVJXI - RoHS-compliant, lead-free, industrial-grade thermal profile (–40 °C to +85 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1, CE2 | Dual chip enable inputs | Chip select requires CE1 = LOW AND CE2 = HIGH; enables robust multi-device decoding without address decoding logic. |
| WE | Write enable input | Active-low control for synchronous write cycles; combined with BHE/BLE determines which byte lanes are updated. |
| OE | Output enable input | Active-low gate for I/O bus drivers; places I/O0–I/O15 in high-Z when deasserted, enabling shared bus operation. |
| BHE, BLE | Byte high/low enable inputs | Independent control of upper (I/O8–I/O15) and lower (I/O0–I/O7) byte writes - eliminates need for external byte-mask logic. |
| ERR | Error indication output | Open-drain output asserted HIGH during read cycle upon detection/correction of single-bit error - requires external pull-up for system monitoring. |
| A0–A19 | Address inputs | 20-bit address bus supporting full 1M-word addressing; A19 placed at ball G2 per BVJXI configuration. |
| I/O0–I/O15 | Bi-directional data bus | 16-bit parallel interface with TTL-compatible drive strength - supports direct connection to 16-bit microprocessor data buses. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC with ERR output | Real-time single-bit error detection and correction per 16-bit word, signaled externally without CPU intervention or firmware overhead. |
| Dual chip enable architecture | CE1/CE2 logic reduces address decoder complexity in multi-SRAM systems and improves noise immunity over single CE schemes. |
| Multi-voltage operation | Three discrete VCC ranges allow drop-in replacement across 1.8 V, 3.3 V, and 5 V platforms - simplifies BOM consolidation and design reuse. |
| 1.0 V data retention | Enables reliable memory hold during power brown-outs or backup battery transitions without data loss or refresh circuitry. |
| TTL-compatible I/O | Eliminates level translators when interfacing with legacy MCUs (e.g., Intel 80C188, Motorola 68K) and FPGA I/O banks configured for 3.3 V LVTTL. |
Applications
| Industrial PLC Memory Buffer | Avionics Data Logging Module |
|---|---|
|
Use Scenario: Storing real-time sensor fusion outputs and control state variables in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Primary working memory buffer with ECC-protected storage for critical control registers and I/O image tables. Use Value: Prevents silent data corruption in long-duration deterministic scans; ERR signal triggers diagnostic logging before fault propagation. |
Use Scenario: Capturing flight telemetry streams (attitude, pressure, GPS) in airborne black-box recorders with power-loss resilience. IC Role / Device Role / Timing Role: High-reliability scratchpad memory for burst-mode acquisition prior to compression and non-volatile storage. Use Value: 1.0 V data retention maintains integrity during engine start transients; 15 ns access enables alignment with 66.7 MHz ADC interfaces. |
| Railway Signaling Controller | Medical Imaging Subsystem Cache |
|
Use Scenario: Holding safety-critical interlocking logic states and track occupancy maps in EN 5012x-certified signaling hardware. IC Role / Device Role / Timing Role: Fault-tolerant RAM for SIL-3 certified logic execution, monitored via ERR-driven watchdog escalation. Use Value: On-die ECC satisfies IEC 61508 SEU mitigation requirements without external parity chips or redundant memory controllers. |
Use Scenario: Caching raw X-ray detector frame data in portable ultrasound or digital radiography units with thermal constraints. IC Role / Device Role / Timing Role: Low-standby-current (20 mA typ.) buffer between detector ASIC and image processor, minimizing heat generation. Use Value: VFBGA package enables compact PCB layout; multi-voltage support allows integration with both 1.8 V analog front-end and 3.3 V processing domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-15TIN | No integrated ECC; requires external syndrome generator and correction logic; 15 ns access, 1M × 16-bit, 3.3 V only. | Lacks real-time ERR signaling; increases PCB area and firmware complexity for error handling. | Select only if ECC is implemented at system level and voltage flexibility is not required. |
| IS61WV102416BLL-15MLI | 15 ns access, 1M × 16-bit, no ECC, 2.5 V/3.3 V operation, 48-pin TSOP II; lower standby current (15 μA). | Suitable for non-safety-critical buffering where data integrity is ensured by higher-layer protocols (e.g., CRC in DMA transfers). | Choose when cost and power are prioritized over on-die error resilience and industrial temperature range. |
Compared with AS7C31026B-15TIN and IS61WV102416BLL-15MLI, CY7C1061GE18-15BVJXIT uniquely delivers integrated ECC with ERR output, multi-voltage support, and industrial temperature rating - making it the only option that satisfies end-to-end hardware-level error containment in safety-critical embedded memory paths.
Availability
CY7C1061GE18-15BVJXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, avionics data loggers, railway signaling controllers, and medical imaging subsystems requiring stable component supply across extended temperature and voltage ranges.
Supply support for CY7C1061GE18-15BVJXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions - formed through the acquisition of Cypress Semiconductor in 2020.
CY7C1061GE18-15BVJXIT belongs to Infineon's industrial-grade SRAM portfolio, designed specifically for mission-critical embedded systems where data integrity, multi-voltage interoperability, and extended temperature operation are mandatory.
FAQ
Does CY7C1061GE18-15BVJXIT support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite corrected data back to the memory array. System firmware must handle any required write-back if persistent correction is needed - confirmed in Note 1 of datasheet Rev. *T.
What is the function of the NC pins in the BVJXI package?
NC (No Connect) pins - such as balls A16 and A18 in the 48-ball VFBGA - are physically present but not bonded to the die. They must remain unconnected on the PCB; routing traces or applying solder paste to these balls may cause mechanical stress or shorting risks per datasheet Figure 5 notes.
Can the ERR pin be left unconnected if ECC functionality is unused?
Yes. The ERR pin is an open-drain output; if not monitored, it should be left floating (not tied HIGH or LOW), as stated in Note 6 of the datasheet. Pull-up resistors are required only when actively reading ERR status in-system.
How does dual CE (CE1/CE2) differ from single CE in timing behavior?
Dual CE requires CE1 = LOW and CE2 = HIGH to enable the device; CE is logically defined as CE1 AND (NOT CE2). This configuration adds setup/hold timing margins versus single CE, improving noise immunity in electrically noisy industrial environments - detailed in Note 12 and Truth Table on page 16.
CY7C1061GE18-15BVJXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061GE18-15BVJXIT FAQ
1.How can I place an order for CY7C1061GE18-15BVJXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GE18-15BVJXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GE18-15BVJXIT reliable?
The price and inventory of CY7C1061GE18-15BVJXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE18-15BVJXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061GE18-15BVJXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE18-15BVJXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GE18-15BVJXIT?
CY7C1061GE18-15BVJXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GE18-15BVJXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GE18-15BVJXIT?
For technical support, including CY7C1061GE18-15BVJXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE18-15BVJXIT requirements.
6.How does Aetrix verify that CY7C1061GE18-15BVJXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061GE18-15BVJXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE18-15BVJXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061GE18-15BVJXIT?
All CY7C1061GE18-15BVJXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE18-15BVJXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GE18-15BVJXIT part is unused and in its original packaging.
Return procedure for CY7C1061GE18-15BVJXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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