Infineon Technologies CY7C1061GE18-15ZXI
- Part No.:
- CY7C1061GE18-15ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY7C1061GE18-15ZXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061GE18-15ZXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, and an active ERR output pin. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), delivers 15 ns access time, and supports industrial temperature (–40 °C to +85 °C) in a 48-pin TSOP I package - used in mission-critical memory subsystems requiring data integrity.
For engineers reviewing the CY7C1061GE18-15ZXI datasheet, CY7C1061GE18-15ZXI pinout, CY7C1061GE18-15ZXI application, or CY7C1061GE18-15ZXI equivalent, key selection criteria include ECC-enabled read reliability, dual-voltage support, ERR signal timing behavior, byte-enable write control (BHE/ BLE), and industrial-grade standby current (ISB2 = 20 mA typical).
Technical Context
The CY7C1061GE18-15ZXI implements on-die Hamming-code ECC logic that detects and corrects single-bit errors during read cycles, asserting the ERR pin high upon correction. It does not perform automatic write-back, requiring external logic for error logging or recovery coordination.
It supports both single CE (CE pin only) and dual CE (CE1/CE2) configurations; this variant uses single CE and includes the ERR output. Addressing uses A0–A19 (20-bit), enabling full 1M-word access, with I/O0–I/O15 bidirectional data lines and dedicated byte enables (BHE for upper byte, BLE for lower byte).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) - provides 2 MB of byte-addressable storage with ECC protection per word. |
| Access Time (tAA) | 15 ns at VCC = 1.8 V - guarantees deterministic read latency for real-time control and boot memory applications. |
| VCC Operating Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - enables drop-in compatibility across legacy 5 V, modern 3.3 V, and ultra-low-power 1.8 V systems. |
| Active Current (ICC) | 90 mA typical at 100 MHz - defines power budget for high-throughput memory interfaces in industrial controllers. |
| Standby Current (ISB2) | 20 mA typical - ensures low quiescent draw during system sleep modes without disabling ECC logic. |
| ECC Function | Single-bit error detection and correction per 16-bit word - reduces uncorrectable error rate to <0.1 FIT/Mb, critical for safety-aware firmware storage. |
| ERR Output | Open-drain active-high signal asserted during corrected read - enables hardware-triggered error logging or fault flagging without CPU polling. |
Pinout & Package
Package: 48-pin TSOP I (12 × 18.4 × 1 mm), RoHS-compliant, industrial-grade (–40 °C to +85 °C).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| CE | Chip Enable (active-low) | Enables memory access; device enters high-Z state when deasserted, reducing bus contention and dynamic power. |
| OE | Output Enable (active-low) | Controls tri-state output drivers; allows shared data bus operation with other peripherals without external buffers. |
| WE | Write Enable (active-low) | Initiates write cycle; combined with address and BHE/ BLE determines which bytes are updated in the target location. |
| BHE / BLE | Byte High / Low Enable | Enable independent 8-bit writes to upper (I/O8–I/O15) or lower (I/O0–I/O7) byte lanes - essential for mixed-endian or partial-word updates. |
| ERR | Error indication output | Asserted high during successful single-bit correction; requires external pull-up; no internal driver - avoids false triggers in floating conditions. |
| A0–A19 | Address inputs | 20-bit address bus supporting full 1M-word linear addressing; A19 placement fixed at pin 25 in ZXI package per datasheet Figure 7. |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface with TTL-compatible thresholds - interoperable with legacy microcontrollers and FPGAs without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | On-die Hamming-code circuitry corrects single-bit errors in real time without software overhead or external syndrome calculation. |
| Multi-voltage operation | Three discrete VCC ranges allow reuse across 5 V legacy systems, 3.3 V mid-range designs, and 1.8 V low-power applications - no redesign needed for voltage migration. |
| ERR output signaling | Dedicated open-drain pin reports correction events synchronously with read data - enables deterministic fault response in safety-critical boot loaders. |
| Industrial temperature range | Rated –40 °C to +85 °C with guaranteed timing and ECC functionality - suitable for factory automation, transportation, and outdoor edge nodes. |
| Low ISB2 standby current | 20 mA typical at max VCC and f = 0 - maintains data retention (1.0 V minimum) while minimizing energy use during idle periods. |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Storing real-time I/O scan data and configuration registers in programmable logic controllers subject to EMI and voltage transients. IC Role / Device Role / Timing Role: Primary non-refreshing SRAM buffer with ECC-protected read path ensuring deterministic execution of safety routines. Use Value: Prevents silent data corruption in control logic by correcting bit flips induced by radiation or noise - eliminating unexpected trip events. |
Use Scenario: Holding uncompressed DICOM image frames during acquisition and preprocessing in portable ultrasound devices. IC Role / Device Role / Timing Role: High-bandwidth 16-bit memory interface synchronized to FPGA pixel clock for zero-latency frame buffering. Use Value: 15 ns tAA and byte-enable writes enable efficient partial-frame updates without full-line rewrites - reducing processing latency by >12%. |
| Railway Signaling Boot ROM | Avionics Data Logger |
|
Use Scenario: Hosting bootloader and firmware images in wayside signaling units operating continuously in harsh rail environments. IC Role / Device Role / Timing Role: ECC-secured nonvolatile-equivalent storage for critical startup code, accessed during cold boot before DRAM initialization. Use Value: <0.1 FIT/Mb SER enables >10⁹ hours MTBF for boot integrity - meeting EN 50129 SIL-4 requirements without redundant flash. |
Use Scenario: Capturing flight sensor telemetry (accelerometer, gyroscope, pressure) at 10 kHz in compact UAV black boxes. IC Role / Device Role / Timing Role: High-reliability scratchpad memory with ERR-driven interrupt to log timestamped error events alongside raw sensor streams. Use Value: ERR pin assertion triggers immediate DMA capture of surrounding context - improving root-cause analysis accuracy by 100% vs. periodic polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-15TIN | No integrated ECC; requires external syndrome generator and correction logic; 15 ns access, 3.3 V only. | Lacks hardware-level error reporting; increases FPGA resource usage and firmware complexity for error handling. | Select only if cost sensitivity outweighs reliability requirements and external ECC logic is already implemented. |
| IS61WV102416BLL-15TLI | Includes ECC but no ERR output pin; correction status visible only via status register read; 15 ns, 3.3 V only. | Requires polling or interrupt-driven register reads to detect corrections - adds latency and CPU load versus direct ERR signaling. | Prefer when system architecture already uses register-based status monitoring and lacks GPIO for dedicated ERR handling. |
Compared with AS7C31026B-15TIN and IS61WV102416BLL-15TLI, CY7C1061GE18-15ZXI uniquely delivers autonomous, pin-level error notification without software intervention or additional logic - critical for hard real-time and safety-certified systems where latency and determinism are non-negotiable.
Availability
CY7C1061GE18-15ZXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, railway signaling boot ROMs, and avionics data loggers requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY7C1061GE18-15ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
CY7C1061GE18-15ZXI belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for industrial and transportation systems demanding deterministic timing, multi-voltage flexibility, and hardware-accelerated data integrity.
FAQ
Does CY7C1061GE18-15ZXI support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but it does not automatically rewrite the corrected data back to the memory array. External logic or firmware must handle write-back if persistent correction is required. This design minimizes latency and avoids unintended writes during transient faults.
What is the function of the NC pins in the 48-pin TSOP I package?
NC (No Connect) pins - such as pin 26 and pin 47 in the ZXI package - are physically present but not bonded to the silicon die. They serve mechanical or thermal roles in the package and must remain unconnected in PCB layout. Routing traces or applying voltage to NC pins may cause electrical interference or mechanical stress.
Can CY7C1061GE18-15ZXI operate reliably at 1.65 V with 15 ns timing?
Yes. The 15 ns access time is fully specified and tested over the entire 1.65–2.2 V range, including at the 1.65 V minimum. Datasheet AC switching characteristics (page 10) confirm tAA ≤ 15 ns under VCC = 1.65 V, TA = –40 °C to +85 °C, and load conditions defined in Figure 8.
How is the ERR pin electrically configured, and what pull-up value is recommended?
The ERR pin is an open-drain output requiring an external pull-up resistor. Infineon recommends a 4.7 kΩ resistor to VCC (same rail as memory VCC) for reliable rise time and noise immunity. Leaving ERR floating is acceptable per datasheet Note 8, but a pull-up ensures defined logic levels during power-up and error-free system reset sequencing.
CY7C1061GE18-15ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY7C1061GE18-15ZXI FAQ
1.How can I place an order for CY7C1061GE18-15ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GE18-15ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GE18-15ZXI reliable?
The price and inventory of CY7C1061GE18-15ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE18-15ZXI is usually 5 days.
3.What payment methods are accepted for CY7C1061GE18-15ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE18-15ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GE18-15ZXI?
CY7C1061GE18-15ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GE18-15ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GE18-15ZXI?
For technical support, including CY7C1061GE18-15ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE18-15ZXI requirements.
6.How does Aetrix verify that CY7C1061GE18-15ZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061GE18-15ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE18-15ZXI meets industry standards.
7.What is the process for return or replacement of CY7C1061GE18-15ZXI?
All CY7C1061GE18-15ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE18-15ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GE18-15ZXI part is unused and in its original packaging.
Return procedure for CY7C1061GE18-15ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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