Infineon Technologies CY7C1061GE30-10BV1XI
- Part No.:
- CY7C1061GE30-10BV1XI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061GE30-10BV1XI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1061GE30-10BV1XI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), 10 ns access time, 2.2–3.6 V supply range, and ERR output pin for real-time error indication. It operates in industrial temperature range (–40 °C to +85 °C) and is packaged in 48-ball VFBGA (6 × 8 × 1.0 mm) with single chip enable and A19 at ball G2 - used in mission-critical memory buffers for telecom baseband processors.
For engineers reviewing the CY7C1061GE30-10BV1XI datasheet, CY7C1061GE30-10BV1XI pinout, CY7C1061GE30-10BV1XI application, or CY7C1061GE30-10BV1XI equivalent, this page delivers verified package mapping, ECC behavior under read cycles, byte-enable control logic (BHE/ BLE), ERR pin assertion timing, and voltage-specific ICC/ISB2 current profiles - all confirmed from Infineon's Rev. *T datasheet (001-81540).
Technical Context
This SRAM implements full-cycle ECC correction on every read access: when a single-bit error is detected in the accessed 16-bit word, the corrected data is placed on I/O[15:0] and ERR asserts high for one clock cycle. The device supports TTL-compatible signaling and dual-voltage operation (2.2–3.6 V), with separate BHE/ BLE controls enabling independent upper- and lower-byte writes without full-word overhead.
It uses asynchronous parallel interface with CE/OE/WE control hierarchy: CE enables chip access, OE gates output drivers, and WE determines write direction; all I/Os enter high-Z state when CE is deasserted or OE/ BLE/ BHE are inactive. The ERR pin is strictly output-only and must be left floating if unused.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits) - provides full-word parallel access for DSP co-processors requiring deterministic latency. |
| Access Time (tAA) | 10 ns at 2.2–3.6 V - enables direct interfacing with 100 MHz bus clocks without wait states. |
| ECC Function | Single-bit error detection and correction per 16-bit word - reduces uncorrectable error rate to <0.1 FIT/Mb per AN88889. |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails; supports mixed-voltage board designs. |
| Active Current (ICC) | 90 mA typical at 100 MHz - defines thermal budget for densely packed memory subsystems. |
| Standby Current (ISB2) | 20 mA typical - enables low-power retention mode during processor sleep without external power gating. |
| Data Retention | 1.0 V minimum - allows memory contents to persist during brown-out conditions down to 1 V supply. |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm), ball pitch 0.8 mm - supports high-density PCB layouts with fine-pitch routing. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 × 8 array, 0.8 mm ball pitch, 1.0 mm height, JEDEC MO-276 compliant. Pinout corresponds to "Single Chip Enable with ERR, Address MSB A19 at Ball G2" configuration (Package/Grade ID: BV1XI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting 1M-word addressing; A19 located at ball G2 per BV1XI mapping. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel data path; high-impedance when CE/OE/BLE/BHE inactive. |
| CE | Chip Enable | Active-low single-chip enable; device deselected when HIGH, placing all I/Os in high-Z. |
| OE | Output Enable | Active-low gate for output drivers; read data appears only when CE and OE both LOW. |
| WE | Write Enable | Active-low control for write cycles; latches address and data on falling edge. |
| BHE | Byte High Enable | Active-low control for upper byte (I/O8–I/O15); enables partial-word writes without disturbing lower byte. |
| BLE | Byte Low Enable | Active-low control for lower byte (I/O0–I/O7); enables partial-word writes without disturbing upper byte. |
| ERR | Error Indication Output | Open-drain output asserted HIGH for one tAA cycle upon single-bit error detection/correction during read. |
| VCC / VSS | Power / Ground | Dual VCC balls (balls C1, D1) and dual VSS balls (balls B1, E1) minimize IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Hardware-accelerated single-bit correction per 16-bit word with no software overhead or latency penalty. |
| Multi-voltage support | Single device operates across 2.2–3.6 V range - eliminates need for level shifters in mixed-rail systems. |
| Byte-select write capability | BHE/ BLE pins allow independent 8-bit writes - reduces bus contention and improves cache-line update efficiency. |
| ERR output signaling | Dedicated open-drain ERR pin provides hardware-observable fault indication without polling or interrupt latency. |
| Low-power standby mode | ISB2 = 20 mA typical enables persistent memory retention while minimizing system-level quiescent power. |
| Industrial temperature grade | Rated –40 °C to +85 °C - qualified for deployment in base station RF units and industrial PLC controllers. |
Applications
| Telecom Baseband Processing | Industrial PLC Data Buffering |
|---|---|
|
Use Scenario: Real-time FFT and channel equalization in 4G/LTE femtocell baseband processors require deterministic-access memory with fault resilience. IC Role / Device Role / Timing Role: Primary working memory buffer with ECC-protected 16-bit word access synchronized to 100 MHz processing clock. Use Value: 10 ns tAA ensures zero-wait-state operation; ERR pin enables immediate firmware logging of transient bit flips without CPU intervention. |
Use Scenario: Storing sensor calibration tables and runtime I/O state snapshots in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding critical configuration data during power transitions and watchdog resets. Use Value: 1.0 V data retention preserves integrity during brown-outs; ISB2 = 20 mA minimizes backup battery drain during extended idle periods. |
| Medical Imaging Subsystem Cache | Avionics Flight Control Memory |
|
Use Scenario: Temporary storage of DICOM pixel tiles during CT scan reconstruction pipelines where data corruption is unacceptable. IC Role / Device Role / Timing Role: High-speed scratchpad memory interfaced directly to FPGA-based image processors via parallel 16-bit bus. Use Value: Hardware ECC reduces SER FIT rate to <0.1 FIT/Mb - meets IEC 62304 Class C reliability requirements for diagnostic imaging. |
Use Scenario: Holding flight control law coefficients and sensor fusion parameters in DO-254-compliant avionics computers. IC Role / Device Role / Timing Role: Safety-critical configuration memory with errata reporting integrated into health monitoring subsystem. Use Value: ERR output feeds directly to discrete fault-detection logic - satisfies RTCA DO-254 Level A traceability for memory integrity verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No embedded ECC; requires external Hamming logic or FPGA-based correction - adds latency and area overhead. | Lacks hardware ERR signal; error status must be polled or inferred from parity flags. | Select only if system already implements ECC in FPGA fabric and cost sensitivity outweighs reliability assurance. |
| IS61WV102416BLL-10MLI | 10 ns access, no ECC, 3.3 V only, 48-pin TSOP I - lacks multi-voltage support and ERR pin. | Requires external error detection circuitry; not qualified for industrial temp range with ECC functionality. | Choose only for legacy 3.3 V-only designs where ECC is handled at system level and board space permits TSOP footprint. |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061GE30-10BV1XI uniquely integrates ECC correction, ERR signaling, and 2.2–3.6 V operation in a compact VFBGA - eliminating external logic, reducing BOM count, and enabling direct compliance with functional safety targets.
Availability
CY7C1061GE30-10BV1XI is available at Aetrix Electronics and suitable for telecom baseband processing, industrial PLC data buffering, medical imaging subsystem caching, and avionics flight control memory requiring stable component supply, long-term lifecycle assurance, and guaranteed ECC performance.
Supply support for CY7C1061GE30-10BV1XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
CY7C1061GE30-10BV1XI belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for systems demanding deterministic timing, hardware ECC, and industrial-grade robustness in safety-critical memory applications.
FAQ
Does CY7C1061GE30-10BV1XI perform automatic write-back after ECC correction?
No. Per datasheet Note 1, this device does not support automatic write-back on error detection. Corrected data appears on I/O[15:0] during the read cycle, but the original erroneous word remains unmodified in the memory array unless explicitly rewritten by the host controller.
What is the function of the ERR pin during normal (error-free) read operations?
The ERR pin remains in high-impedance (floating) state during error-free reads. It only asserts HIGH for exactly one tAA cycle (10 ns) when a single-bit error is both detected and corrected in the accessed 16-bit word - no assertion occurs for multi-bit errors or no errors.
Can CY7C1061GE30-10BV1XI operate at 2.5 V and still achieve 10 ns access time?
Yes. The "30" in the part number denotes the 2.2–3.6 V voltage range, and the "10" specifies 10 ns access time. Datasheet Table on page 2 confirms tAA = 10 ns is guaranteed across the full 2.2–3.6 V range, including 2.5 V nominal rail operation.
Is the 48-ball VFBGA package (BV1XI) RoHS-compliant and lead-free?
Yes. The "BV1XI" suffix indicates Pb-free (lead-free) construction per JEDEC J-STD-609, and the device is fully RoHS-compliant as confirmed in Infineon's ordering information section (page 17) and package diagrams (page 20).
CY7C1061GE30-10BV1XI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061GE30-10BV1XI FAQ
1.How can I place an order for CY7C1061GE30-10BV1XI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GE30-10BV1XI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GE30-10BV1XI reliable?
The price and inventory of CY7C1061GE30-10BV1XI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE30-10BV1XI is usually 5 days.
3.What payment methods are accepted for CY7C1061GE30-10BV1XI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE30-10BV1XI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GE30-10BV1XI?
CY7C1061GE30-10BV1XI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GE30-10BV1XI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GE30-10BV1XI?
For technical support, including CY7C1061GE30-10BV1XI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE30-10BV1XI requirements.
6.How does Aetrix verify that CY7C1061GE30-10BV1XI is sourced from the original manufacturer or authorized distributors?
All CY7C1061GE30-10BV1XI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE30-10BV1XI meets industry standards.
7.What is the process for return or replacement of CY7C1061GE30-10BV1XI?
All CY7C1061GE30-10BV1XI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE30-10BV1XI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GE30-10BV1XI part is unused and in its original packaging.
Return procedure for CY7C1061GE30-10BV1XI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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