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Infineon Technologies CY7C1061GE30-10BVJXI
- Part No.:
- CY7C1061GE30-10BVJXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061GE30-10BVJXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,464
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Product details
Overview
CY7C1061GE30-10BVJXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time across 2.2–3.6 V supply, featuring ERR output pin for real-time error indication, and packaged in 48-ball VFBGA (6 × 8 × 1.0 mm). It supports dual chip enable (CE1/CE2), byte-level writes via BHE/BLE, and TTL-compatible I/Os for industrial memory subsystems.
For engineers reviewing the CY7C1061GE30-10BVJXI datasheet, CY7C1061GE30-10BVJXI pinout, CY7C1061GE30-10BVJXI application, or CY7C1061GE30-10BVJXI equivalent, this device is selected for high-reliability SRAM applications requiring ECC-enabled data integrity, low standby current (20 mA typical), and multi-voltage support - especially where space-constrained VFBGA packaging and deterministic error reporting are critical.
Technical Context
The CY7C1061GE30-10BVJXI implements on-die Hamming-code ECC logic that detects and corrects single-bit errors during read cycles, asserting the ERR pin high upon correction without automatic write-back. Its dual CE architecture (CE1/CE2) enables hierarchical memory enable control, while BHE/BLE pins allow independent upper- and lower-byte write operations to I/O[15:8] and I/O[7:0].
It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); this specific variant is rated for 2.2–3.6 V with 10 ns tAA and 90 mA typical ICC at 100 MHz. Data retention is guaranteed down to 1.0 V, and all I/Os enter high-Z when deselected or under disabled control conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits): provides full 16-bit parallel interface with no external data-width expansion needed. |
| Access Time (tAA) | 10 ns at 2.2–3.6 V: enables direct interfacing with 100 MHz bus systems without wait states. |
| ECC Function | On-die single-bit error detection and correction per read cycle: eliminates soft-error-induced system crashes in industrial environments. |
| Supply Voltage Range | 2.2 V to 3.6 V: compatible with modern low-voltage microcontrollers and FPGAs while maintaining TTL-level I/O compatibility. |
| Standby Current (ISB2) | 20 mA typical: reduces power in sleep modes for battery-backed or energy-sensitive applications. |
| Package | 48-ball VFBGA (6 × 8 × 1.0 mm): supports high-density PCB layouts with fine-pitch (0.8 mm) ball pitch and thermal performance suitable for industrial ambient (–40°C to +85°C). |
| ERR Pin | Dedicated open-drain output signaling single-bit correction event: allows host processor to log or flag memory integrity events without polling. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 × 8 array, 0.8 mm ball pitch, 6.0 mm × 8.0 mm footprint, 1.0 mm height. Compliant with JEDEC MO-276AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting 1M-word addressing; A19 placed at Ball G2 per BVJXI configuration. |
| I/O0–I/O15 | Bi-directional Data Bus | 16-bit parallel interface; split into upper (I/O8–I/O15) and lower (I/O0–I/O7) bytes controlled by BHE/BLE. |
| CE1 / CE2 | Dual Chip Enable Inputs | Logical AND-enable: device active only when CE1 = LOW and CE2 = HIGH; enables hierarchical memory decoding. |
| WE | Write Enable Input | Active-low signal initiating write cycle; latches data on rising edge of WE when CE and OE are asserted appropriately. |
| OE | Output Enable Input | Active-low control for read data output; places I/Os in high-Z when deasserted or device deselected. |
| BHE / BLE | Byte Enable Inputs | Control upper/lower byte writes independently; BHE enables I/O8–I/O15, BLE enables I/O0–I/O7. |
| ERR | Error Reporting Output | Open-drain output asserted HIGH during single-bit error correction; requires external pull-up for logic-level compatibility. |
| VCC / VSS | Power / Ground | Two VCC balls (Balls E1, H1) and two VSS balls (Balls D1, G1) provide low-impedance supply routing and noise reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Real-time single-bit error correction per read access without CPU intervention or memory controller overhead. |
| Dual CE architecture | Enables multi-chip memory banks with precise enable sequencing and reduced address decode complexity. |
| 1.0 V data retention | Preserves stored data during brown-out or backup-battery operation down to 1.0 V supply. |
| TTL-compatible I/Os | Eliminates level-shifter requirements when interfacing with legacy 3.3 V or 5 V controllers and peripherals. |
| VFBGA package | Reduces board area by >40% vs. TSOP II, improves thermal dissipation, and supports automated optical inspection (AOI). |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Storing real-time I/O scan data and firmware variables in programmable logic controllers operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: Primary working memory with ECC-protected read/write cycles synchronized to 100 MHz backplane clock. Use Value: Prevents undetected bit flips in control registers or sensor buffers that could trigger false safety shutdowns or actuator misfires. |
Use Scenario: Holding uncompressed DICOM image frames during acquisition and preprocessing in portable ultrasound or X-ray units. IC Role / Device Role / Timing Role: High-speed frame buffer interfaced directly to FPGA video pipeline with 10 ns access guaranteeing zero-frame-drop throughput. Use Value: Ensures pixel data integrity across thousands of consecutive read/write cycles, avoiding artifact generation due to memory soft errors. |
| Railway Signaling Controller Cache | Avionics Data Logger Buffer |
|
Use Scenario: Caching route tables and interlocking logic state in EN 5012x-certified signaling hardware deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Non-volatile cache holding mission-critical state variables with ERR pin feeding diagnostic watchdog circuitry. Use Value: Enables automatic fault logging and fail-safe state rollback upon ECC correction, satisfying SIL-2 integrity requirements. |
Use Scenario: Capturing flight sensor telemetry (IMU, pressure, temperature) at 10 kHz sampling rate in black-box recorders with limited power budget. IC Role / Device Role / Timing Role: Low-power SRAM buffer operating at 2.5 V with 20 mA ISB2, writing burst data to flash via DMA-triggered transfers. Use Value: Extends battery life during extended ground standby while preserving data fidelity against cosmic-ray-induced upsets at altitude. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No integrated ECC; requires external logic or controller-based correction; 10 ns access, 3.3 V only. | Lacks real-time ERR signaling; increases software/firmware validation burden for safety-critical use. | Select only if ECC is handled externally and cost sensitivity outweighs reliability assurance. |
| IS61WV102416BLL-10MLI | 10 ns access, 3.3 V, no ECC; lower standby current (15 μA), but no error reporting capability. | Suitable for non-safety applications where data corruption risk is mitigated by protocol-level CRC or redundancy. | Prefer when ultra-low ISB is mandatory and ECC is implemented at system layer (e.g., in FPGA fabric). |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, the CY7C1061GE30-10BVJXI uniquely delivers on-die ECC with dedicated ERR output - reducing system-level validation effort, eliminating external correction logic, and enabling deterministic failure reporting essential for industrial and transportation safety standards.
Availability
CY7C1061GE30-10BVJXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, railway signaling controller caches, and avionics data logger buffers requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY7C1061GE30-10BVJXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.
This device belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for mission-critical industrial, medical, and transportation systems demanding deterministic ECC protection and robust packaging.
FAQ
Does CY7C1061GE30-10BVJXI support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite corrected data to the memory cell. Host system must manage any required write-back via external logic or software if persistent correction is needed.
What is the function of the NC pins in the BVJXI package?
NC (No Connect) pins - such as Ball C1 and Ball H8 in the 48-ball VFBGA layout - are physically present but not bonded to the die. They must remain unconnected on the PCB; routing traces or soldering to them may cause mechanical stress or unintended coupling.
Can CY7C1061GE30-10BVJXI operate at 1.8 V?
No. This variant is specified only for the 2.2 V to 3.6 V supply range. For 1.65–2.2 V operation, the CY7C1061G18 series (e.g., CY7C1061G18-15BVJXI) must be used - it has different speed grading (15 ns) and electrical characteristics optimized for lower voltage.
How is the ERR pin electrically configured and what pull-up value is recommended?
The ERR pin is an open-drain output requiring an external pull-up resistor. A 4.7 kΩ resistor to VCC is recommended per Cypress AN88889, ensuring clean logic-high assertion while limiting current during active-low leakage conditions and supporting standard TTL/CMOS input thresholds.
CY7C1061GE30-10BVJXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061GE30-10BVJXI FAQ
1.How can I place an order for CY7C1061GE30-10BVJXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GE30-10BVJXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GE30-10BVJXI reliable?
The price and inventory of CY7C1061GE30-10BVJXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE30-10BVJXI is usually 5 days.
3.What payment methods are accepted for CY7C1061GE30-10BVJXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE30-10BVJXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GE30-10BVJXI?
CY7C1061GE30-10BVJXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GE30-10BVJXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GE30-10BVJXI?
For technical support, including CY7C1061GE30-10BVJXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE30-10BVJXI requirements.
6.How does Aetrix verify that CY7C1061GE30-10BVJXI is sourced from the original manufacturer or authorized distributors?
All CY7C1061GE30-10BVJXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE30-10BVJXI meets industry standards.
7.What is the process for return or replacement of CY7C1061GE30-10BVJXI?
All CY7C1061GE30-10BVJXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE30-10BVJXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GE30-10BVJXI part is unused and in its original packaging.
Return procedure for CY7C1061GE30-10BVJXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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