Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1061GE30-10ZSXIT

Part No.:
CY7C1061GE30-10ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
54-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1061GE30-10ZSXIT.pdf
Description:
IC SRAM 16MBIT PAR 54TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,698

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1061GE30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time across 2.2 V–3.6 V supply, featuring TTL-compatible I/Os, ERR output for real-time error indication, and low 20 mA typical standby current (ISB2). It serves as a high-reliability memory buffer in industrial control modules requiring data integrity under extended temperature operation.

For engineers reviewing the CY7C1061GE30-10ZSXIT datasheet, CY7C1061GE30-10ZSXIT pinout, CY7C1061GE30-10ZSXIT application, or CY7C1061GE30-10ZSXIT equivalent, this device delivers deterministic ECC correction without write-back, supports byte-level writes via BHE/ BLE, maintains 1.0 V data retention, and is validated for use in dual-chip-enable configurations with CE1/CE2 logic.

Technical Context

The CY7C1061GE30-10ZSXIT implements a synchronous SRAM architecture with dedicated ECC logic that detects and corrects single-bit errors during read cycles, signaled by the open-drain ERR output. Its address space spans A0–A19 (20-bit), supporting 1M-word addressing with 16-bit parallel I/O (I/O0–I/O15).

It operates across three voltage ranges-1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V-with this variant specifically rated for 2.2–3.6 V and 10 ns tAA. Control logic includes independent byte enables (BHE/BLE), chip enable (CE1/CE2), write enable (WE), and output enable (OE), enabling flexible memory mapping and partial-word access.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16-bit words) - provides full 2 MB of byte-addressable storage with ECC protection per word.
Access Time (tAA) 10 ns at VCC = 3.0 V, TA = 25 °C - enables direct interfacing with 100 MHz bus systems without wait states.
ECC Function Single-bit error detection and correction per 16-bit word - ensures data integrity without software overhead or automatic write-back.
Supply Voltage Range 2.2 V to 3.6 V - compatible with modern low-voltage microcontroller and FPGA I/O domains.
Standby Current (ISB2) 20 mA typical - supports low-power hold modes in battery-backed or energy-constrained industrial systems.
Data Retention Voltage 1.0 V minimum - guarantees nonvolatile data hold during brown-out or controlled power-down sequences.
Output Drive TTL-compatible VOH/VOL - eliminates level-shifting requirements when interfacing with legacy 3.3 V logic families.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, RoHS-compliant, lead-free (Pb-free).

Pin/Terminal Circuit Role Design Meaning
CE1 / CE2 Dual chip enable inputs Enable memory access only when CE1 = LOW and CE2 = HIGH; supports hierarchical memory decoding in multi-SRAM systems.
WE Write enable input Active-low control that latches data on I/O0–I/O15 into addressed location; synchronized with address setup/hold timing.
OE Output enable input Controls tri-state output drivers; allows shared bus operation without external bus transceivers.
BHE / BLE Byte high/low enable inputs Selectively write upper (I/O8–I/O15) or lower (I/O0–I/O7) byte - essential for mixed-endian or partial-register updates.
ERR Error indication output Open-drain active-HIGH signal asserted during successful single-bit correction - enables hardware-triggered logging or fault flagging.
A0–A19 Address inputs 20-bit address bus supporting full 1M-word linear addressing; A19 placement varies by package variant (Ball G2 or H6).
I/O0–I/O15 Bi-directional data bus 16-bit parallel interface with TTL-compatible drive strength; all pins enter high-Z when CE1/CE2 inactive or OE deasserted.

Key Features

Feature Design Value
Embedded ECC logic Hardware-accelerated single-bit error correction per 16-bit word - eliminates need for external error-handling firmware or redundant memory controllers.
Dual chip enable (CE1/CE2) Enables hierarchical memory banking and reduces address decoder complexity in multi-SRAM subsystems.
1.0 V data retention Supports reliable memory hold during undervoltage lockout (UVLO) events down to 1.0 V - critical for fail-safe system recovery.
Byte-select write capability Independent BHE/BLE control allows atomic 8-bit updates without read-modify-write cycles - improves real-time determinism in control loops.
ERR output signaling Dedicated open-drain output provides immediate hardware notification of corrected errors - enables integration with watchdog or diagnostic subsystems.

Applications

Industrial PLC Memory Buffer Medical Imaging Data Cache

Use Scenario: Storing real-time I/O scan data and configuration registers in programmable logic controllers operating continuously at 85 °C ambient.

IC Role / Device Role / Timing Role: Primary volatile memory buffer with ECC-protected word storage and 10 ns access for deterministic scan cycle execution.

Use Value: Prevents silent data corruption in safety-critical control logic, eliminating uncorrectable memory faults during extended thermal stress.

Use Scenario: Caching raw sensor frames from X-ray or MRI front-end ADCs before FPGA-based preprocessing.

IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer interfaced directly to FPGA fabric via 16-bit parallel bus.

Use Value: Enables burst-mode acquisition at >50 MB/s sustained bandwidth while maintaining bit-level reliability across multi-minute imaging sessions.

Railway Signaling Controller Avionics Health Monitor

Use Scenario: Holding mission-critical state variables and fault logs in EN 5012x-certified signaling hardware deployed in outdoor cabinets.

IC Role / Device Role / Timing Role: Nonvolatile-hold memory with 1.0 V retention margin, supporting graceful shutdown during grid fluctuations.

Use Value: Guarantees persistence of last-known-safe state even during rapid AC mains collapse, satisfying SIL-2 data integrity requirements.

Use Scenario: Logging sensor telemetry and flight control parameters in DO-160 qualified airborne health monitoring units.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM buffer with ECC correction for transient-induced soft errors in avionics bays.

Use Value: Reduces SER FIT rate to <0.1 FIT/Mb - meets DO-254 reliability targets for Class E/EU avionics subsystems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C31026B-10TIN No integrated ECC; requires external error-checking logic or controller-side correction. Suitable only where ECC is implemented in FPGA or MCU firmware - increases design complexity and latency. Select when cost sensitivity outweighs reliability requirements and system-level ECC is already architected.
IS61WV102416BLL-10MLI 10 ns access but no ERR pin; ECC must be inferred from parity status or external logic. Lacks hardware-asserted error flag - limits real-time diagnostics and autonomous fault response capability. Prefer where board space permits discrete error signaling circuitry and deterministic ERR timing is not required.

Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061GE30-10ZSXIT uniquely integrates both correction logic and a dedicated ERR output, enabling zero-software-overhead fault reporting and simplifying compliance with IEC 61508/DO-254 functional safety architectures.

Availability

CY7C1061GE30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics health monitors requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7C1061GE30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and high-reliability memory solutions.

This device belongs to Infineon's legacy Cypress SRAM portfolio, engineered for mission-critical industrial and transportation systems demanding deterministic ECC correction, wide-temperature operation, and robust data retention under voltage stress.

FAQ

Does CY7C1061GE30-10ZSXIT support automatic error write-back after correction?

No. The device performs single-bit error detection and correction during read cycles but does not automatically write the corrected data back to memory. The corrected value appears only on the I/O bus; any persistent update requires external logic or host processor intervention. This behavior is explicitly documented in Note 1 of the datasheet.

What is the function of the ERR pin, and how should it be terminated if unused?

The ERR pin is an open-drain output that asserts HIGH during successful single-bit error correction. If unused, it must be left floating - no pull-up or pull-down resistor is required or recommended. Connecting it to VCC or GND may cause contention or unintended assertion, as stated in Note 6 of the datasheet.

Can CY7C1061GE30-10ZSXIT operate across multiple VCC ranges, and which one applies to this part number?

Yes, the CY7C1061GE family supports 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V ranges. The "30" in CY7C1061GE30-10ZSXIT specifies the 2.2–3.6 V range, and the "10" denotes 10 ns access time. Operation outside this range violates electrical specifications and voids parametric guarantees.

How does the dual chip enable (CE1/CE2) logic differ from single CE operation?

CE1 and CE2 implement NAND logic: memory is selected only when CE1 = LOW and CE2 = HIGH. In contrast, single-CE variants use one input (CE) active LOW. Dual CE enables hierarchical decoding - e.g., using CE1 as bank select and CE2 as global enable - reducing external gate count in multi-SRAM designs.

CY7C1061GE30-10ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
54-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TSOP II

CY7C1061GE30-10ZSXIT FAQ

1.How can I place an order for CY7C1061GE30-10ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1061GE30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1061GE30-10ZSXIT reliable?

The price and inventory of CY7C1061GE30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE30-10ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7C1061GE30-10ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE30-10ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1061GE30-10ZSXIT?

CY7C1061GE30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1061GE30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1061GE30-10ZSXIT?

For technical support, including CY7C1061GE30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE30-10ZSXIT requirements.

6.How does Aetrix verify that CY7C1061GE30-10ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1061GE30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE30-10ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7C1061GE30-10ZSXIT?

All CY7C1061GE30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE30-10ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1061GE30-10ZSXIT part is unused and in its original packaging.

Return procedure for CY7C1061GE30-10ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1061GE30-10ZSXIT Tags

  • CY7C1061GE30-10ZSXIT
  • CY7C1061GE30-10ZSXIT PDF
  • CY7C1061GE30-10ZSXIT Datasheet
  • CY7C1061GE30-10ZSXIT Specifications
  • CY7C1061GE30-10ZSXIT Images
  • Infineon Technologies
  • Infineon Technologies CY7C1061GE30-10ZSXIT
  • Buy CY7C1061GE30-10ZSXIT
  • CY7C1061GE30-10ZSXIT Price
  • CY7C1061GE30-10ZSXIT Distributor
  • CY7C1061GE30-10ZSXIT Supplier
  • CY7C1061GE30-10ZSXIT Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER