Infineon Technologies CY7C1061GE30-10ZSXIT
- Part No.:
- CY7C1061GE30-10ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1061GE30-10ZSXIT.pdf
- Description:
- IC SRAM 16MBIT PAR 54TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,698
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Product details
Overview
CY7C1061GE30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1M × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time across 2.2 V–3.6 V supply, featuring TTL-compatible I/Os, ERR output for real-time error indication, and low 20 mA typical standby current (ISB2). It serves as a high-reliability memory buffer in industrial control modules requiring data integrity under extended temperature operation.
For engineers reviewing the CY7C1061GE30-10ZSXIT datasheet, CY7C1061GE30-10ZSXIT pinout, CY7C1061GE30-10ZSXIT application, or CY7C1061GE30-10ZSXIT equivalent, this device delivers deterministic ECC correction without write-back, supports byte-level writes via BHE/ BLE, maintains 1.0 V data retention, and is validated for use in dual-chip-enable configurations with CE1/CE2 logic.
Technical Context
The CY7C1061GE30-10ZSXIT implements a synchronous SRAM architecture with dedicated ECC logic that detects and corrects single-bit errors during read cycles, signaled by the open-drain ERR output. Its address space spans A0–A19 (20-bit), supporting 1M-word addressing with 16-bit parallel I/O (I/O0–I/O15).
It operates across three voltage ranges-1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V-with this variant specifically rated for 2.2–3.6 V and 10 ns tAA. Control logic includes independent byte enables (BHE/BLE), chip enable (CE1/CE2), write enable (WE), and output enable (OE), enabling flexible memory mapping and partial-word access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) - provides full 2 MB of byte-addressable storage with ECC protection per word. |
| Access Time (tAA) | 10 ns at VCC = 3.0 V, TA = 25 °C - enables direct interfacing with 100 MHz bus systems without wait states. |
| ECC Function | Single-bit error detection and correction per 16-bit word - ensures data integrity without software overhead or automatic write-back. |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with modern low-voltage microcontroller and FPGA I/O domains. |
| Standby Current (ISB2) | 20 mA typical - supports low-power hold modes in battery-backed or energy-constrained industrial systems. |
| Data Retention Voltage | 1.0 V minimum - guarantees nonvolatile data hold during brown-out or controlled power-down sequences. |
| Output Drive | TTL-compatible VOH/VOL - eliminates level-shifting requirements when interfacing with legacy 3.3 V logic families. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, RoHS-compliant, lead-free (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1 / CE2 | Dual chip enable inputs | Enable memory access only when CE1 = LOW and CE2 = HIGH; supports hierarchical memory decoding in multi-SRAM systems. |
| WE | Write enable input | Active-low control that latches data on I/O0–I/O15 into addressed location; synchronized with address setup/hold timing. |
| OE | Output enable input | Controls tri-state output drivers; allows shared bus operation without external bus transceivers. |
| BHE / BLE | Byte high/low enable inputs | Selectively write upper (I/O8–I/O15) or lower (I/O0–I/O7) byte - essential for mixed-endian or partial-register updates. |
| ERR | Error indication output | Open-drain active-HIGH signal asserted during successful single-bit correction - enables hardware-triggered logging or fault flagging. |
| A0–A19 | Address inputs | 20-bit address bus supporting full 1M-word linear addressing; A19 placement varies by package variant (Ball G2 or H6). |
| I/O0–I/O15 | Bi-directional data bus | 16-bit parallel interface with TTL-compatible drive strength; all pins enter high-Z when CE1/CE2 inactive or OE deasserted. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Hardware-accelerated single-bit error correction per 16-bit word - eliminates need for external error-handling firmware or redundant memory controllers. |
| Dual chip enable (CE1/CE2) | Enables hierarchical memory banking and reduces address decoder complexity in multi-SRAM subsystems. |
| 1.0 V data retention | Supports reliable memory hold during undervoltage lockout (UVLO) events down to 1.0 V - critical for fail-safe system recovery. |
| Byte-select write capability | Independent BHE/BLE control allows atomic 8-bit updates without read-modify-write cycles - improves real-time determinism in control loops. |
| ERR output signaling | Dedicated open-drain output provides immediate hardware notification of corrected errors - enables integration with watchdog or diagnostic subsystems. |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Data Cache |
|---|---|
|
Use Scenario: Storing real-time I/O scan data and configuration registers in programmable logic controllers operating continuously at 85 °C ambient. IC Role / Device Role / Timing Role: Primary volatile memory buffer with ECC-protected word storage and 10 ns access for deterministic scan cycle execution. Use Value: Prevents silent data corruption in safety-critical control logic, eliminating uncorrectable memory faults during extended thermal stress. |
Use Scenario: Caching raw sensor frames from X-ray or MRI front-end ADCs before FPGA-based preprocessing. IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer interfaced directly to FPGA fabric via 16-bit parallel bus. Use Value: Enables burst-mode acquisition at >50 MB/s sustained bandwidth while maintaining bit-level reliability across multi-minute imaging sessions. |
| Railway Signaling Controller | Avionics Health Monitor |
|
Use Scenario: Holding mission-critical state variables and fault logs in EN 5012x-certified signaling hardware deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Nonvolatile-hold memory with 1.0 V retention margin, supporting graceful shutdown during grid fluctuations. Use Value: Guarantees persistence of last-known-safe state even during rapid AC mains collapse, satisfying SIL-2 data integrity requirements. |
Use Scenario: Logging sensor telemetry and flight control parameters in DO-160 qualified airborne health monitoring units. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM buffer with ECC correction for transient-induced soft errors in avionics bays. Use Value: Reduces SER FIT rate to <0.1 FIT/Mb - meets DO-254 reliability targets for Class E/EU avionics subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-10TIN | No integrated ECC; requires external error-checking logic or controller-side correction. | Suitable only where ECC is implemented in FPGA or MCU firmware - increases design complexity and latency. | Select when cost sensitivity outweighs reliability requirements and system-level ECC is already architected. |
| IS61WV102416BLL-10MLI | 10 ns access but no ERR pin; ECC must be inferred from parity status or external logic. | Lacks hardware-asserted error flag - limits real-time diagnostics and autonomous fault response capability. | Prefer where board space permits discrete error signaling circuitry and deterministic ERR timing is not required. |
Compared with AS7C31026B-10TIN and IS61WV102416BLL-10MLI, CY7C1061GE30-10ZSXIT uniquely integrates both correction logic and a dedicated ERR output, enabling zero-software-overhead fault reporting and simplifying compliance with IEC 61508/DO-254 functional safety architectures.
Availability
CY7C1061GE30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics health monitors requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY7C1061GE30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and high-reliability memory solutions.
This device belongs to Infineon's legacy Cypress SRAM portfolio, engineered for mission-critical industrial and transportation systems demanding deterministic ECC correction, wide-temperature operation, and robust data retention under voltage stress.
FAQ
Does CY7C1061GE30-10ZSXIT support automatic error write-back after correction?
No. The device performs single-bit error detection and correction during read cycles but does not automatically write the corrected data back to memory. The corrected value appears only on the I/O bus; any persistent update requires external logic or host processor intervention. This behavior is explicitly documented in Note 1 of the datasheet.
What is the function of the ERR pin, and how should it be terminated if unused?
The ERR pin is an open-drain output that asserts HIGH during successful single-bit error correction. If unused, it must be left floating - no pull-up or pull-down resistor is required or recommended. Connecting it to VCC or GND may cause contention or unintended assertion, as stated in Note 6 of the datasheet.
Can CY7C1061GE30-10ZSXIT operate across multiple VCC ranges, and which one applies to this part number?
Yes, the CY7C1061GE family supports 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V ranges. The "30" in CY7C1061GE30-10ZSXIT specifies the 2.2–3.6 V range, and the "10" denotes 10 ns access time. Operation outside this range violates electrical specifications and voids parametric guarantees.
How does the dual chip enable (CE1/CE2) logic differ from single CE operation?
CE1 and CE2 implement NAND logic: memory is selected only when CE1 = LOW and CE2 = HIGH. In contrast, single-CE variants use one input (CE) active LOW. Dual CE enables hierarchical decoding - e.g., using CE1 as bank select and CE2 as global enable - reducing external gate count in multi-SRAM designs.
CY7C1061GE30-10ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1061GE30-10ZSXIT FAQ
1.How can I place an order for CY7C1061GE30-10ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GE30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GE30-10ZSXIT reliable?
The price and inventory of CY7C1061GE30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GE30-10ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061GE30-10ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GE30-10ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GE30-10ZSXIT?
CY7C1061GE30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GE30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GE30-10ZSXIT?
For technical support, including CY7C1061GE30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GE30-10ZSXIT requirements.
6.How does Aetrix verify that CY7C1061GE30-10ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061GE30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GE30-10ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061GE30-10ZSXIT?
All CY7C1061GE30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GE30-10ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GE30-10ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1061GE30-10ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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