Infineon Technologies CY7C1061GN30-10BVXIT
- Part No.:
- CY7C1061GN30-10BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1061GN30-10BVXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,683
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061GN30-10BVXIT from Cypress Semiconductor is a 16-Mbit (1 M × 16) asynchronous CMOS static RAM with 10 ns access time, 2.2–3.6 V operating voltage, and dual Chip Enable (CE1/CE2) architecture. It supports byte-wide writes via BHE/BLE controls, delivers 90 mA active current at 100 MHz, and enters low-power data retention mode at 1.0 V - deployed in industrial embedded controllers requiring fast, nonvolatile-critical buffer memory.
For engineers reviewing the CY7C1061GN30-10BVXIT datasheet, CY7C1061GN30-10BVXIT pinout, CY7C1061GN30-10BVXIT application, or CY7C1061GN30-10BVXIT equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 20 µA standby current, dual CE logic compatibility, and VFBGA-48 package footprint for space-constrained PCB layouts.
Technical Context
The device implements a fully asynchronous SRAM core with independent high- and low-byte write enables (BHE/BLE), enabling partial-word updates without read-modify-write cycles. Its dual CE architecture (CE1 LOW + CE2 HIGH for enable) allows hierarchical memory banking and seamless expansion across multiple devices.
It features automatic power-down when deselected, TTL-compatible I/Os, and guaranteed data retention at 1.0 V - supporting fail-safe state preservation during brown-out conditions. All timing parameters are specified over –40°C to +85°C and 2.2–3.6 V supply range, with AC characteristics validated using 5 pF load and 3 ns signal transition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| tAA | 10 ns maximum address-to-data valid delay - ensures deterministic read latency in real-time control loops. |
| ICC (active) | 90 mA typical at 100 MHz - enables predictable power budgeting for high-throughput buffering. |
| ISB2 (standby) | 20 µA typical CMOS standby current - supports ultra-low-power sleep modes in battery-backed systems. |
| VCC range | 2.2 V to 3.6 V - compatible with modern low-voltage microcontroller I/O domains and mixed-supply designs. |
| Data retention VDR | 1.0 V minimum - preserves memory contents during deep sleep or backup-battery operation. |
| Package | 48-ball VFBGA (8 × 9.5 × 1 mm) - provides compact, thermally efficient mounting for dense industrial PCBs. |
| Memory organization | 1,048,576 words × 16 bits - delivers 2 MB of fast, random-access storage without refresh overhead. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 8 mm × 9.5 mm × 1 mm, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address inputs | 20-bit address bus supporting full 1 M-word addressing; no multiplexing required. |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; split into high (I/O8–I/O15) and low (I/O0–I/O7) bytes via BHE/BLE. |
| CE1 / CE2 | Dual chip enable inputs | Active-Low CE1 + Active-High CE2 logic enables hierarchical memory decoding and bank isolation. |
| WE | Write enable | Asynchronous write strobe; initiates write when CE1/CE2 active and WE LOW. |
| OE | Output enable | Controls output drivers only; does not affect internal state or power mode. |
| BLE / BHE | Byte low/high enable | Independent gating of lower/upper 8-bit data lanes - eliminates need for external byte masking logic. |
| VCC / VSS | Power / ground | Dual VCC balls and multiple VSS balls ensure stable core and I/O supply distribution. |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns access time | Meets timing requirements of 100 MHz bus interfaces without wait states in FPGA or MCU-based systems. |
| Dual CE architecture | Enables direct connection to multi-bank memory controllers without external decode logic or glue logic. |
| Byte-selectable writes | Reduces bus traffic and eliminates read-modify-write cycles when updating partial words in protocol stacks or buffers. |
| 1.0 V data retention | Preserves register state and configuration data during system suspend or backup-battery operation. |
| Automatic power-down | Reduces quiescent current by >99% when deselected - critical for energy-sensitive industrial gateways. |
Applications
| Industrial PLC Data Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Real-time acquisition of sensor data streams in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: High-speed, non-refreshing buffer between ADC interface and CPU bus; operates as synchronous burst-capable memory under asynchronous control. Use Value: 10 ns tAA ensures sub-microsecond response to interrupt-driven sampling triggers, while dual CE supports modular I/O expansion racks. |
Use Scenario: Temporary storage of uncompressed ultrasound or X-ray frame buffers before compression and transmission. IC Role / Device Role / Timing Role: Low-latency, byte-accessible frame memory interfaced directly to image processing ASICs. Use Value: BHE/BLE enables selective update of pixel regions without full-frame reload, reducing DMA bandwidth by up to 50%. |
| Avionics Display Controller Cache | Test Equipment Pattern Memory |
|
Use Scenario: Storing display list instructions and glyph bitmaps in ruggedized cockpit displays with strict thermal and reliability constraints. IC Role / Device Role / Timing Role: Nonvolatile-critical cache holding GUI assets during power transitions; retains data at 1.0 V during brown-out. Use Value: VFBGA package offers superior thermal resistance (θJA = 31.5 °C/W) versus TSOP, sustaining operation at +85°C ambient. |
Use Scenario: Holding digital stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: Deterministic-access pattern store synchronized to high-speed digital I/O pins of ATE controller. Use Value: Guaranteed tRC = 10 ns and tSD = 5 ns support 100 MHz pattern rates with zero setup violations across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-10MLI | 10 ns tAA, same 1 M × 16 organization, but uses single CE and lacks BHE/BLE; VDD = 2.5 V only. | Requires external byte masking logic; unsuitable for systems needing native dual-byte control or 2.2–3.6 V flexibility. | Select only if board layout already uses single-CE topology and supply is fixed at 2.5 V. |
| ON Semiconductor NVSRAM NVTFS1616L-10T3G | Integrated EEPROM backup, 10 ns access, but higher ICC (120 mA) and larger 64-pin TSSOP package. | Provides nonvolatile retention without external battery, but consumes more power and occupies more board area. | Choose when data persistence through power loss is mandatory and board space permits larger footprint. |
Compared with IS61WV102416BLL-10MLI and NVTFS1616L-10T3G, CY7C1061GN30-10BVXIT uniquely balances 10 ns speed, dual-byte control, wide VCC range, and compact VFBGA - making it optimal for thermally constrained, multi-bank industrial systems where flexibility and footprint matter.
Availability
CY7C1061GN30-10BVXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, and avionics display controllers requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for CY7C1061GN30-10BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications, with emphasis on robustness and long-term supply stability.
The CY7C1061GN30 belongs to Cypress's high-speed asynchronous SRAM product line, engineered specifically for deterministic, low-latency data buffering in real-time embedded systems where refresh-free operation and precise timing control are essential.
FAQ
Is CY7C1061GN30-10BVXIT pin-compatible with CY7C1061DV33-10ZSXI?
No. CY7C1061GN30-10BVXIT uses a 48-ball VFBGA package with specific ball assignments for CE1/CE2, BHE/BLE, and I/O grouping. CY7C1061DV33-10ZSXI is a 54-pin TSOP II device with different pinout, voltage range (3.3 V only), and single CE architecture - mechanical and electrical incompatibility prevents direct replacement.
Does this SRAM require an external clock or refresh circuitry?
No. The CY7C1061GN30-10BVXIT is a fully asynchronous static RAM - it operates without any clock signal and requires no refresh cycles. All operations are controlled solely by CE1, CE2, WE, OE, BHE, and BLE timing, making it ideal for systems with irregular or event-driven memory access patterns.
What is the maximum supported bus frequency when interfacing with an FPGA?
With tRC = 10 ns, the device supports sustained 100 MHz random read/write cycles. When used with FPGA logic implementing proper setup/hold timing (e.g., tSD = 5 ns, tHA = 0 ns), it achieves reliable operation at 100 MHz bus clocks - verified across –40°C to +85°C and 2.2–3.6 V supply range per datasheet AC specifications.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes. Asserting both BHE and BLE LOW enables concurrent write access to all 16 I/O lines (I/O0–I/O15). This is the standard mode for full-word writes and is explicitly supported in the functional description and truth table - no timing penalty or conflict occurs when both byte enables are active.
CY7C1061GN30-10BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1061GN30-10BVXIT FAQ
1.How can I place an order for CY7C1061GN30-10BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GN30-10BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GN30-10BVXIT reliable?
The price and inventory of CY7C1061GN30-10BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GN30-10BVXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061GN30-10BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GN30-10BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GN30-10BVXIT?
CY7C1061GN30-10BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GN30-10BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GN30-10BVXIT?
For technical support, including CY7C1061GN30-10BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GN30-10BVXIT requirements.
6.How does Aetrix verify that CY7C1061GN30-10BVXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061GN30-10BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GN30-10BVXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061GN30-10BVXIT?
All CY7C1061GN30-10BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GN30-10BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GN30-10BVXIT part is unused and in its original packaging.
Return procedure for CY7C1061GN30-10BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061GN30-10BVXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

